SCHEMBL5953585

SCHEMBL5953585

C(COCCOCCOCCOCCOCC1CO1)OCCOCCOCCOCCOCCOCC1CO1

nearest known ligand 0.75

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
TSHR P16473 5/20 0.75
SMN1; SMN2 Q16637 2/20 0.62
ALDH1A1 P00352 10/20 0.58
TDP1 Q9NUW8 3/20 0.58
MAPK1 P28482 1/20 0.52
TP53 P04637 4/20 0.37
CYP3A4 P08684 2/20 0.37
HIF1A Q16665 2/20 0.37
GLA P06280 1/20 0.34
MEN1 O00255 2/20 0.34
KMT2A Q03164 2/20 0.34
MAPT P10636 2/20 0.32
HPGD P15428 2/20 0.32
CYP1A2 P05177 1/20 0.32
PPARG P37231 1/20 0.32
LMNA P02545 1/20 0.32
GAA P10253 1/20 0.32
PKM P14618 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL55331 1.00 TSHR (0.75) TSHRSMN1; SMN2ALDH1A1TDP1MAPK1
SCHEMBL1005362 1.00 TSHR (0.75) TSHRSMN1; SMN2ALDH1A1TDP1MAPK1
SCHEMBL5954227 1.00 TSHR (0.75) TSHRSMN1; SMN2ALDH1A1TDP1MAPK1
SCHEMBL19410605 1.00 TSHR (0.75) TSHRSMN1; SMN2ALDH1A1TDP1MAPK1
SCHEMBL8621977 1.00 TSHR (0.75) TSHRSMN1; SMN2ALDH1A1TDP1MAPK1
Etoglucid SCHEMBL8442 1.00 TSHR (0.75) TSHRSMN1; SMN2ALDH1A1TDP1MAPK1
SCHEMBL5954248 1.00 TSHR (0.75) TSHRSMN1; SMN2ALDH1A1TDP1MAPK1
SCHEMBL13583289 1.00 TSHR (0.75) TSHRSMN1; SMN2ALDH1A1TDP1MAPK1
SCHEMBL21932618 1.00 TSHR (0.75) TSHRSMN1; SMN2ALDH1A1TDP1MAPK1
SCHEMBL28208576 1.00 TSHR (0.75) TSHRSMN1; SMN2ALDH1A1TDP1MAPK1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-112882342-B Laminate body 旭化成株式会社 2024-04-19 CN disclosed
US-20240018678-A1 Copper Electrodeposition in Microelectronics MACDERMID ENTHONE INC (US) 2024-01-18 US disclosed
CN-110941140-B Photosensitive resin composition 旭化成株式会社 2023-09-15 CN disclosed
CN-112882342-A Laminated body 旭化成株式会社 2021-06-01 CN disclosed
CN-107077067-B Photosensitive resin composition, photosensitive resin laminate, method for producing resin pattern, cured film, and display device 旭化成株式会社 2021-04-13 CN disclosed
CN-106997148-B Laminated body 旭化成株式会社 2020-12-29 CN disclosed
CN-110941140-A Photosensitive resin composition 旭化成株式会社 2020-03-31 CN disclosed
CN-106918993-B Photosensitive resin composition, photosensitive resin laminate, and method for forming protective pattern 旭化成株式会社 2020-03-10 CN disclosed
US-10338468-B2 Photosensitive resin composition, photosensitive resin laminate, resin pattern production method, cured film, and display device ASAHI KASEI KABUSHIKI KAISHA (JP) 2019-07-02 US disclosed
US-20170285474-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAMINATE, RESIN PATTERN PRODUCTION METHOD, CURED FILM, AND DISPLAY DEVICE ASAHI KASEI KABUSHIKI KAISHA (JP) 2017-10-05 US disclosed
US-9775549-B2 Temperature insensitive in vivo analyte devices, methods and systems ABBOTT DIABETES CARE INC. (US) 2017-10-03 US disclosed
US-20160045147-A1 Temperature Insensitive In Vivo Analyte Devices, Methods and Systems ABBOTT DIABETES CARE INC. 2016-02-18 US disclosed
US-20060115740-A1 Hologram recording medium KABUSHIKI KAISHA TOSHIBA (JP) 2006-06-01 US disclosed