SCHEMBL598491

SCHEMBL598491

COCCCCOC(=O)OOC(=O)OCCCCOC

nearest known ligand 0.48

Predicted protein targets (top 8)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 4/20 0.48
TSHR P16473 5/20 0.39
NAAA Q02083 1/20 0.37
CYP3A4 P08684 1/20 0.34
EPHX1 P07099 1/20 0.34
RECQL P46063 1/20 0.34
ACHE P22303 5/20 0.33
ATM Q13315 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9845778 0.91 ALDH1A1 (0.47) ALDH1A1TSHRNAAACYP3A4EPHX1
SCHEMBL1469990 0.90 ALDH1A1 (0.52) ALDH1A1TSHRNAAACYP3A4EPHX1
SCHEMBL25705939 0.87 ALDH1A1 (0.56) ALDH1A1TSHRNAAACYP3A4EPHX1
SCHEMBL18287424 0.87 ALDH1A1 (0.56) ALDH1A1TSHRNAAACYP3A4EPHX1
SCHEMBL27254661 0.87 ALDH1A1 (0.50) ALDH1A1TSHRNAAACYP3A4EPHX1
SCHEMBL18287422 0.87 ALDH1A1 (0.56) ALDH1A1TSHRNAAACYP3A4EPHX1
SCHEMBL15430605 0.87 ALDH1A1 (0.56) ALDH1A1TSHRNAAACYP3A4EPHX1
SCHEMBL29081310 0.87 ALDH1A1 (0.56) ALDH1A1TSHRNAAACYP3A4EPHX1
SCHEMBL19418922 0.87 ALDH1A1 (0.56) ALDH1A1TSHRNAAACYP3A4EPHX1
SCHEMBL1128341 0.85 ALDH1A1 (0.48) ALDH1A1TSHRNAAACYP3A4EPHX1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114341240-A Foam and method for producing foam 积水化学工业株式会社 2022-04-12 CN disclosed
CN-114302910-A Foam and method for producing foam 积水化学工业株式会社 2022-04-08 CN disclosed
US-8120189-B2 Wiring terminal-connecting adhesive HITACHI CHEMICAL COMPANY, LTD. (JP) 2012-02-21 US disclosed
US-8115322-B2 Adhesive, method of connecting wiring terminals and wiring structure HITACHI CHEMICAL COMPANY, LTD. (JP) 2012-02-14 US disclosed
US-20100330364-A1 ADHESIVE, METHOD OF CONNECTING WIRING TERMINALS AND WIRING STRUCTURE ARIFUKU MOTOHIRO 2010-12-30 US disclosed
US-20100326596-A1 ADHESIVE, METHOD OF CONNECTING WIRING TERMINALS AND WIRING STRUCTURE ARIFUKU MOTOHIRO 2010-12-30 US disclosed
US-7777335-B2 Wiring structure having a wiring-terminal-connecting adhesive comprising silicone particles HITACHI CHEMICAL COMPANY, LTD. (JP) 2010-08-17 US disclosed
US-20090101279-A1 ADHESIVE, METHOD OF CONNECTING WIRING TERMINALS AND WIRING STRUCTURE ARIFUKI MOTOHIRO 2009-04-23 US disclosed
US-7241644-B2 Adhesive, method of connecting wiring terminals and wiring structure HITACHI CHEMICAL COMPANY, LTD. (JP) 2007-07-10 US disclosed
EP-1229095-B1 ADHESIVE AGENT, METHOD FOR CONNECTING WIRING TERMINALS AND WIRING STRUCTURE HITACHI CHEMICAL CO LTD (JP) 2006-10-18 EP disclosed
US-6939913-B1 Adhesive agent, method of connecting wiring terminals and wiring structure HITACHI CHEMICAL COMPANY, LTD. (JP) 2005-09-06 US disclosed
US-20050178502-A1 Adhesive, method of connecting wiring terminals and wiring structure ARIFUKU MOTOHIRO (JP) 2005-08-18 US disclosed
US-20050176882-A1 Adhesive, method of connecting wiring terminals and wiring structure ARIFUKU MOTOHIRO (JP) 2005-08-11 US disclosed
EP-1229095-A1 ADHESIVE AGENT, METHOD FOR CONNECTING WIRING TERMINALS AND WIRING STRUCTURE HITACHI CHEMICAL COMPANY, LTD. (JP) 2002-08-07 EP disclosed