SCHEMBL599894

SCHEMBL599894

CCCc1cccc(-c2c3ccccc3nc3ccccc23)c1

nearest known ligand 0.53

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 2/20 0.53
ALDH1A1 P00352 1/20 0.53
GAA P10253 1/20 0.53
HPGD P15428 1/20 0.53
ESR1 P03372 4/20 0.49
ESR2 Q92731 4/20 0.49
CTSS P25774 1/20 0.45
CTSK P43235 1/20 0.45
ABCC1 P33527 1/20 0.43
PDE10A Q9Y233 1/20 0.42
ELANE P08246 1/20 0.41
APP P05067 1/20 0.40
BCHE P06276 1/20 0.40
ACHE P22303 1/20 0.40
BACE1 P56817 1/20 0.39
PDE5A O76074 1/20 0.39
LMNA P02545 1/20 0.39
MAPT P10636 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29587943 1.00 KDM4E (0.53) KDM4EALDH1A1GAAHPGDESR1
SCHEMBL600671 0.91 PSMB5 (0.49) KDM4EALDH1A1GAAHPGDESR1
SCHEMBL29587930 0.91 PSMB5 (0.49) KDM4EALDH1A1GAAHPGDESR1
SCHEMBL10906078 0.87 ESR1 (0.51) KDM4EALDH1A1GAAHPGDESR1
SCHEMBL30543802 0.87 ESR1 (0.51) KDM4EALDH1A1GAAHPGDESR1
SCHEMBL29488287 0.82 KDM4E (0.58) KDM4EALDH1A1GAAHPGDESR1
SCHEMBL600665 0.82 KDM4E (0.58) KDM4EALDH1A1GAAHPGDESR1
SCHEMBL27651468 0.81 ESR1 (0.51) KDM4EALDH1A1HPGDESR1ESR2
SCHEMBL27812375 0.78 ESR1 (0.49) ALDH1A1ESR1ESR2LMNA
SCHEMBL4533749 0.77 AGXT (0.52) KDM4EALDH1A1HPGDCTSSCTSK

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 23 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-110357989-B Tertiary amine photosensitizer, preparation method thereof, photosensitive resin composition containing tertiary amine photosensitizer and application of photosensitive resin composition 常州强力电子新材料股份有限公司 2022-04-22 CN claimed
CN-108241259-B Resist composition with good hole masking function and capable of directly depicting, exposing and imaging 杭州福斯特电子材料有限公司 2021-08-10 CN claimed
US-5346805-A Initiator comprising an onium compound and an acridine derivative; printing plate, resist, photomask FUJI PHOTO FILM CO., LTD. (JP) 1994-09-13 US claimed
US-4587200-A Photopolymerizable composition comprising an acridine and a heterocyclic thiol compound as a photopolymerization initiator and a photographic process using said photopolymerizable composition FUJI PHOTO FILM CO., LTD. (JP) 1986-05-06 US claimed
CN-113156764-B Photosensitive resin composition and resist laminate 杭州福斯特电子材料有限公司 2024-04-26 CN disclosed
CN-111315828-B Composition, cured product, optical filter, and method for producing cured product 株式会社艾迪科 2023-09-29 CN disclosed
CN-112154167-B Composition, cured product, optical filter, and method for producing cured product 株式会社艾迪科 2023-08-22 CN disclosed
CN-115047714-A Resist composition and laminate thereof 杭州福斯特电子材料有限公司 2022-09-13 CN disclosed
CN-110114376-B Curable composition, method for producing cured product, cured product thereof, and adhesive using same 株式会社ADEKA 2022-06-14 CN disclosed
CN-110357989-B Tertiary amine photosensitizer, preparation method thereof, photosensitive resin composition containing tertiary amine photosensitizer and application of photosensitive resin composition 常州强力电子新材料股份有限公司 2022-04-22 CN disclosed
EP-3339331-B1 COMPOSITION ADEKA CORP (JP) 2022-02-16 EP disclosed
CN-108419438-B Coloring composition 株式会社艾迪科 2021-10-01 CN disclosed
CN-111566173-A Coating composition, method for curing the composition, barrier film, and method for producing cured product 株式会社艾迪科 2020-08-21 CN disclosed
CN-107636024-B Composition comprising a metal oxide and a metal oxide 株式会社艾迪科 2020-06-19 CN disclosed
CN-111221215-A Photosensitive resin composition and application thereof 常州强力先端电子材料有限公司 2020-06-02 CN disclosed
EP-3339331-A1 COMPOSITION Adeka Corporation (JP) 2018-06-27 EP disclosed
US-20120040290-A1 PHOTOSENSITIVE RESIN COMPOSITION, AND PHOTOSENSITIVE ELEMENT, RESIST PATTERN FORMATION METHOD AND PRINTED CIRCUIT BOARD PRODUCTION METHOD EACH UTILIZING SAME HITACHI CHEMICAL COMPANY, LTD. (JP) 2012-02-16 US disclosed
US-20100159691-A1 PHOTOSENSITIVE RESIN COMPOSITION AND LAMINATE ASAHI KASEI EMD CORPORATION (JP) 2010-06-24 US disclosed
US-5346805-A Initiator comprising an onium compound and an acridine derivative; printing plate, resist, photomask FUJI PHOTO FILM CO., LTD. (JP) 1994-09-13 US disclosed
US-4587200-A Photopolymerizable composition comprising an acridine and a heterocyclic thiol compound as a photopolymerization initiator and a photographic process using said photopolymerizable composition FUJI PHOTO FILM CO., LTD. (JP) 1986-05-06 US disclosed