SCHEMBL6001882

SCHEMBL6001882

O=C1NC(=O)C2C(CCO)CC=CC12

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9506014 0.80 ALDH1A1 (0.33)
SCHEMBL6683356 0.76 ALDH1A1 (0.35)
SCHEMBL17459005 0.75
SCHEMBL7617521 0.74 ALDH1A1 (0.33)
SCHEMBL1316872 0.73 POLB (0.32)
SCHEMBL9500654 0.70 ALDH1A1 (0.33)
SCHEMBL8501574 0.69 MEN1 (0.33)
SCHEMBL8120429 0.68 ALDH1A1 (0.32)
SCHEMBL9620412 0.68 ALDH1A1 (0.33)
SCHEMBL8594521 0.67 MAPT (0.32)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0260688-B1 PROCESS FOR THE PREPARATION OF MOULDING COMPOSITIONS FROM UNSATURATED POLYESTERS BASF Aktiengesellschaft (DE) 1992-03-25 EP claimed
EP-0260688-A2 Process for the preparation of moulding compositions from unsaturated polyesters BASF Aktiengesellschaft (DE) 1988-03-23 EP claimed
US-20060182956-A1 Radiation-curable pressure-sensitive adhesive composition and pressure-sensitive adhesive sheets TOAGOSEI CO., LTD. (JP) 2006-08-17 US disclosed
EP-1634935-A1 RADIATION-CURABLE PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND PRESSURE-SENSITIVE ADHESIVE SHEETS TOAGOSEI CO., LTD. (JP) 2006-03-15 EP disclosed
US-20050101683-A1 Pressure-sensitive adhesive curable with active energy ray and pressure-sensitive adhesive sheet TOAGOSEI CO., LTD. (JP) 2005-05-12 US disclosed
EP-1482015-A1 PRESSURE-SENSITIVE ADHESIVE CURABLE WITH ACTIVE ENERGY RAY AND PRESSURE-SENSITIVE ADHESIVE SHEET TOAGOSEI CO., LTD. (JP) 2004-12-01 EP disclosed