SCHEMBL6018042

SCHEMBL6018042

CC(=O)Nc1ccc(SC(C)=O)cc1SC(C)=O

nearest known ligand 0.43

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAPT P10636 2/20 0.43
NPC1 O15118 1/20 0.43
POLB P06746 1/20 0.43
RAB9A P51151 1/20 0.43
KDM4E B2RXH2 2/20 0.39
HSD17B10 Q99714 1/20 0.39
ALDH1A1 P00352 4/20 0.38
HPGD P15428 2/20 0.38
PDE7A Q13946 1/20 0.37
CA1 P00915 5/20 0.37
CA2 P00918 5/20 0.37
CA9 Q16790 5/20 0.37
HDAC1 Q13547 1/20 0.37
HDAC6 Q9UBN7 1/20 0.37
RXFP1 Q9HBX9 1/20 0.37
CA12 O43570 1/20 0.36
CA4 P22748 1/20 0.36
CA7 P43166 1/20 0.36
BLM P54132 1/20 0.36
TP53 P04637 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6019268 0.86 ALDH1A1 (0.41) MAPTNPC1POLBRAB9AKDM4E
SCHEMBL5085415 0.81 POLB (0.42) MAPTNPC1POLBRAB9AKDM4E
SCHEMBL5082284 0.80 POLB (0.41) MAPTNPC1POLBRAB9AKDM4E
SCHEMBL9721425 0.77 ALDH1A1 (0.55) MAPTPOLBHSD17B10ALDH1A1HPGD
SCHEMBL4847759 0.76 MAPT (0.43) MAPTNPC1POLBRAB9AKDM4E
SCHEMBL9713055 0.72 SMN1; SMN2 (0.59) MAPTNPC1POLBRAB9AKDM4E
SCHEMBL26965416 0.71 KDM4E (0.53) POLBKDM4EHSD17B10ALDH1A1PDE7A
SCHEMBL917054 0.70 CYP3A4 (0.46) MAPTNPC1POLBRAB9AKDM4E
SCHEMBL4219569 0.70 ALDH1A1 (0.58) MAPTPOLBRAB9AHSD17B10ALDH1A1
SCHEMBL14341653 0.70 HPGD (0.46) MAPTNPC1RAB9AALDH1A1HPGD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1683822-A1 PREPOLYMER, PREPOLYMER COMPOSITION, HIGH MOLECULAR WEIGHT POLYMER HAVING STRUCTURE CONTAINING HOLE AND ELECTRICALLY INSULATING FILM Daicel Chemical Industries, Ltd. (JP) 2006-07-26 EP disclosed