SCHEMBL6036772

SCHEMBL6036772

[B].[Ni].[Si]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10489718 0.87
SCHEMBL11757085 0.87
SCHEMBL10489649 0.87
SCHEMBL1769741 0.87
SCHEMBL57763 0.82
SCHEMBL25073 0.82
SCHEMBL25075 0.82
SCHEMBL7699345 0.82
SCHEMBL2010171 0.82
SCHEMBL168044 0.82

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 72 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20260110096-A1 TURBINE BLADE OUTERMOST ABRASIVE LAYER USING GRADED CERAMICS GE INFRASTRUCTURE TECHNOLOGY LLC (US) 2026-04-23 US claimed
CN-119677397-A Magnetic field wire, preparation method thereof, magnetic field coil and chip 美新半导体(无锡)有限公司 2025-03-21 CN claimed
US-20250018494-A1 METHOD AND APPARATUS FOR FORMING AN OVERLAY BETWEEN CUTTER POCKETS OF A POLYCRYSTALLINE DIAMOND ROCK BIT ARC SPECIALTIES, INC. 2025-01-16 US claimed
CN-117966265-A High-quality hexagonal boron nitride film prepared by magnetron sputtering and crystal phase modulation method thereof 西安电子科技大学芜湖研究院 2024-05-03 CN claimed
CN-116393870-A Preparation method of high-boron silicon nickel-based brazing alloy powder containing refractory elements 中国科学院金属研究所 2023-07-07 CN claimed
US-11679978-B2 Method for preparing multi-layer hexagonal boron nitride film SHANGHAI INSTITUTE OF MICROSYSTEM AND INFORMATION TECHNOLOGY, CHINESE ACADEMY OF SCIENCES (CN) 2023-06-20 US claimed
CN-110921637-B Preparation method of multilayer hexagonal boron nitride film 中国科学院上海微系统与信息技术研究所 2022-09-23 CN claimed
CN-112077475-B Flux-cored wire for NCu30 nickel alloy seamless pipe welding for pressure-bearing equipment 郑州大学 2021-12-28 CN claimed
CN-112077475-A Flux-cored wire for NCu30 nickel alloy seamless pipe welding for pressure-bearing equipment 郑州大学 2020-12-15 CN claimed
WO-2020057672-A1 METHOD FOR PREPARING MULTI-LAYER HEXAGONAL BORON NITRIDE FILM 中国科学院上海微系统与信息技术研究所 2020-03-26 WO claimed
EP-0498989-B1 Improved surfacing alloy WALL COLMONOY CORP (US) 1997-01-08 EP claimed
EP-0498989-A1 Improved surfacing alloy WALL COLMONOY CORPORATION (US) 1992-08-19 EP claimed
US-20260110096-A1 TURBINE BLADE OUTERMOST ABRASIVE LAYER USING GRADED CERAMICS GE INFRASTRUCTURE TECHNOLOGY LLC (US) 2026-04-23 US disclosed
EP-4729743-A1 TURBINE BLADE OUTERMOST ABRASIVE LAYER USING GRADED CERAMICS GE Vernova Technology GmbH (CH) 2026-04-22 EP disclosed
US-12590494-B2 Drilling tool having pre-fabricated components SCHLUMBERGER TECHNOLOGY CORPORATION (US) 2026-03-31 US disclosed
US-12584719-B2 End cap BAE SYSTEMS PLC (GB) 2026-03-24 US disclosed
EP-0377452-B1 Thermal spray method for producing glass mold plungers PERKIN ELMER CORP (US) 1994-08-10 EP disclosed
US-5006321-A Thermal spray method for producing glass mold plungers THE PERKIN-ELMER CORPORATION (US) 1991-04-09 US disclosed
CN-1044421-A Produce the heat spraying method of glass mold plungers PERKIN ELMER CORP (US) 1990-08-08 CN disclosed
EP-0377452-A2 Thermal spray method for producing glass mold plungers THE PERKIN-ELMER CORPORATION (US) 1990-07-11 EP disclosed