SCHEMBL604340

SCHEMBL604340

CCCCCCCCCCCCCCCCCCC(Cc1ccc(O)c(C(C)(C)C)c1)C(=O)O

nearest known ligand 0.50

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
GAA P10253 2/20 0.50
XBP1 P17861 1/20 0.50
ATM Q13315 1/20 0.50
NPSR1 Q6W5P4 1/20 0.50
L3MBTL1 Q9Y468 1/20 0.50
PPARG P37231 8/20 0.46
PTGES O14684 3/20 0.46
ALOX5 P09917 3/20 0.46
KAT8 Q9H7Z6 2/20 0.43
PPARA Q07869 4/20 0.41
FOLH1 Q04609 4/20 0.41
PPARD Q03181 1/20 0.41
GRIK1 P39086 1/20 0.40
GRIK2 Q13002 1/20 0.40
HSP90AA1 P07900 1/20 0.40
HSP90AB1 P08238 1/20 0.40
SMN1; SMN2 Q16637 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6750769 0.95 GAA (0.45) GAAXBP1ATMNPSR1L3MBTL1
SCHEMBL2546373 0.90 PPARG (0.48) PPARGPTGESALOX5PPARAFOLH1
SCHEMBL4096825 0.86 HMGCR (0.42) GAAXBP1ATMNPSR1L3MBTL1
SCHEMBL5415838 0.85 HMGCR (0.46) GAAATMNPSR1PPARGPTGES
SCHEMBL284122 0.85 HMGCR (0.46) GAAATMNPSR1PPARGPTGES
SCHEMBL17491249 0.85 HMGCR (0.46) GAAATMNPSR1PPARGPTGES
SCHEMBL11459320 0.85 HMGCR (0.46) GAAATMNPSR1PPARGPTGES
SCHEMBL18855 0.85 HMGCR (0.46) GAAATMNPSR1PPARGPTGES
SCHEMBL21616894 0.85 HMGCR (0.46) GAAATMNPSR1PPARGPTGES
SCHEMBL208069 0.85 HMGCR (0.46) GAAATMNPSR1PPARGPTGES

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 41 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240158553-A1 FINE RESIN PARTICLE, COATING FILM-SOFTENING AGENT, MATTING AGENT FOR PAINTS, STRESS RELIEVER FOR CURABLE RESINS, LIGHT DIFFUSER, LIGHT DIFFUSING RESIN COMPOSITION, AND RESIN COMPOSITION SEKISUI KASEI CO., LTD. (JP) 2024-05-16 US disclosed
EP-4317224-A1 RESIN FINE PARTICLES, COATING SOFTENER, MATTING AGENT FOR PAINT, STRESS RELAXATION AGENT FOR CURABLE RESIN, LIGHT DIFFUSING AGENT, LIGHT DIFFUSING RESIN COMPOSITION, AND RESIN COMPOSITION Sekisui Kasei Co., Ltd. (JP) 2024-02-07 EP disclosed
WO-2024024977-A1 STYRENIC RESIN COMPOSITION AND MOLDED PRODUCT PSジャパン株式会社 2024-02-01 WO disclosed
US-20230290550-A1 MAGNETIC RESIN COMPOSITION FOR INJECTION MOLDING, AND INJECTION MOLDED BODY FOR MAGNETIC SHIELDS TOYO INK SC HOLDINGS CO., LTD. (JP) 2023-09-14 US disclosed
US-11724483-B2 Laminated resin film NIPPON SHOKUBAI CO., LTD. (JP) 2023-08-15 US disclosed
WO-2023120301-A1 MAGNETIC RESIN COMPOSITION FOR INJECTION MOLDING, AND INJECTION-MOLDED ARTICLE FOR MAGNETIC SHIELD 東洋インキSCホールディングス株式会社 2023-06-29 WO disclosed
EP-4180485-A1 MAGNETIC RESIN COMPOSITION FOR INJECTION MOLDING, AND INJECTION MOLDED BODY FOR MAGNETIC SHIELDS Toyo Ink SC Holdings Co., Ltd. (JP) 2023-05-17 EP disclosed
WO-2022210893-A1 RESIN FINE PARTICLES, COATING SOFTENER, MATTING AGENT FOR PAINT, STRESS RELAXATION AGENT FOR CURABLE RESIN, LIGHT DIFFUSING AGENT, LIGHT DIFFUSING RESIN COMPOSITION, AND RESIN COMPOSITION 積水化成品工業株式会社 2022-10-06 WO disclosed
CN-107207847-B Foamed polycarbonate articles with improved impact force and methods of making and using the same 沙特基础工业全球技术公司 2020-06-26 CN disclosed
US-20190322782-A1 VINYL POLYMER MICROPARTICLES, AND MASTERBATCH AND RESIN FILM CONTAINING THE SAME NIPPON SHOKUBAI CO., LTD. (JP) 2019-10-24 US disclosed
US-6726780-B2 SOLDER COMPRISING ELEMENT WHICH IS CAPABLE OF GENERATING DELUSTERING COMPONENT FOR MINIMIZING METALLIC LUSTER OF SOLDER, CONTAINING SILVER, COPPER, BISMUTH, ANTIMONY AND TIN TAMURA KAKEN CORPORATION (JP) 2004-04-27 US disclosed
US-6677411-B2 AS CATALYST SUPPORT AN ION-EXCHANGE LAYERED SILICATE HAVING A SPECIFIC PORE SIZE DISTRIBUTION CURVE JAPAN POLYCHEM CORPORATION (JP) 2004-01-13 US disclosed
US-20030178101-A1 Lead-free solder, and paste solder composition TAMURA CORPORATION (JP) 2003-09-25 US disclosed
US-20030027950-A1 Component of catalyst for olefin polymerization JAPAN POLYCHEM CORPORATION (JP) 2003-02-06 US disclosed
EP-1241188-A1 COMPONENT OF CATALYST FOR OLEFIN POLYMERIZATION Japan Polychem Corporation (JP) 2002-09-18 EP disclosed
EP-0735054-B1 Method of after treatment of modified polyolefins MITSUBISHI CHEM CORP (JP) 2001-05-23 EP disclosed
US-5753169-A MELT KNEADING UNDER GRAFT CONDITIONS MIXTURE OF POLYOLEFIN AND ETHYLENICALLY UNSATURATED CARBOXYLIC ACID OR DERIVATIVE MITSUBISHI CHEMICAL CORPORATION (JP) 1998-05-19 US disclosed
EP-0735054-A2 Method of after treatment of modified polyolefins Mitsubishi Chemical Corporation (JP) 1996-10-02 EP disclosed
EP-0257803-B1 PEELABLE PROTECTIVE FILM COMPRISING METHACRYLATE COPOLYMER SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1992-12-30 EP disclosed
US-4808484-A ETHYLENE-METHYL METHACRYLATE COPOLYMERS, FILLER, SLIP AGENT; WRAPPING TACKY SUBSTANCES SUMITOMO CHEMICAL CO., LTD. (JP) 1989-02-28 US disclosed