SCHEMBL6047727

SCHEMBL6047727

C=CC(CCN)[Si](OCC)(OCC)OCC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2289279 0.83
SCHEMBL2679897 0.82
SCHEMBL2555689 0.80
SCHEMBL467181 0.80 TSHR (0.32)
SCHEMBL2285458 0.79
Ammonia Solution, Strong SCHEMBL514062 0.77
SCHEMBL2776616 0.77
SCHEMBL28385122 0.75
SCHEMBL664450 0.73
SCHEMBL483480 0.72

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0971011-B1 Adhesive composition and adhesive sheet LINTEC CORP (JP) 2006-03-15 EP claimed
EP-0971011-A2 Adhesive composition and adhesive sheet Lintec Corporation (JP) 2000-01-12 EP claimed
EP-0971011-B1 Adhesive composition and adhesive sheet LINTEC CORP (JP) 2006-03-15 EP disclosed
US-6277481-B1 PRESSURE SENSITIVE ADHESIVE BLEND OF THERMOSETTING RESIN, POLYSILOXANE AND COUPLING AGENT LINTEC CORPORATION (JP) 2001-08-21 US disclosed
EP-0971011-A2 Adhesive composition and adhesive sheet Lintec Corporation (JP) 2000-01-12 EP disclosed