SCHEMBL6049014

SCHEMBL6049014

CC(C)c1ccc(C=C(O)[C@H](O)[C@@H](O)[C@H](O)[C@H](O)CO)cc1

nearest known ligand 0.40

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ KDM4E B2RXH2 2/20 0.38
▸ MAPK1 P28482 1/20 0.38
▸ TYR P14679 1/20 0.37
▸ PDE4A P27815 1/20 0.37
▸ SMN1; SMN2 Q16637 5/20 0.36
▸ RAB9A P51151 3/20 0.36
▸ NPC1 O15118 2/20 0.36
▸ POLB P06746 1/20 0.36
▸ LMNA P02545 4/20 0.35
▸ GRIN2D O15399 2/20 0.33
▸ GRIN3B O60391 2/20 0.33
▸ GRIN1 Q05586 2/20 0.33
▸ GRIN2A Q12879 2/20 0.33
▸ GRIN2B Q13224 2/20 0.33
▸ GRIN2C Q14957 2/20 0.33
▸ GRIN3A Q8TCU5 2/20 0.33
▸ PTGS1 P23219 1/20 0.33
▸ PTGS2 P35354 1/20 0.33
▸ L3MBTL1 Q9Y468 1/20 0.33
▸ TDP1 Q9NUW8 2/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27433730 1.00 KDM4E (0.38) KDM4EMAPK1TYRPDE4ASMN1; SMN2
SCHEMBL6200543 0.89 KDM4E (0.46) KDM4EMAPK1TYRSMN1; SMN2RAB9A
SCHEMBL6049035 0.87 ALDH1A1 (0.35) PDE4ALMNAL3MBTL1ALDH1A1MAPT
SCHEMBL27499206 0.87 ALDH1A1 (0.35) PDE4ALMNAL3MBTL1ALDH1A1MAPT
SCHEMBL5069345 0.84 PDE4A (0.43) PDE4ALMNAGRIN1GRIN2BL3MBTL1
SCHEMBL20506870 0.84 PDE4A (0.43) PDE4ALMNAGRIN1GRIN2BL3MBTL1
SCHEMBL21049665 0.84 PDE4A (0.39) KDM4EPDE4ARAB9ALMNAPTGS2
SCHEMBL1253981 0.84 PDE4A (0.39) KDM4EPDE4ARAB9ALMNAPTGS2
SCHEMBL28654643 0.83 PDE4A (0.40) KDM4EPDE4ALMNAPTGS1PTGS2
SCHEMBL29051499 0.82 NPC1 (0.36) PDE4ASMN1; SMN2RAB9ANPC1POLB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1270696-B1 Adhesive sheet for dicing NITTO DENKO CORP (JP) 2006-03-29 — — EP disclosed
EP-0864589-A2 MOLDED RESIN ARTICLES CHISSO CORPORATION (JP) 1998-09-16 — — EP disclosed
US-5536773-A Polypropylene resin composition and the use of the same MITSUI PETROCHEMICAL INDUSTRIES, LTD. (JP) 1996-07-16 — — US disclosed
Send feedback