SCHEMBL606747

SCHEMBL606747

CCC(N)C(N)(O)O.[NaH].[NaH]

nearest known ligand 0.31

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
LAP3 P28838 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL539201 0.97
Ammonia Solution, Strong SCHEMBL598219 0.94 LAP3 (0.31) LAP3
Acetic Acid SCHEMBL5205539 0.85 SLC1A3 (0.35) LAP3
SCHEMBL27973595 0.77
SCHEMBL993291 0.75
SCHEMBL1047200 0.74
SCHEMBL3852239 0.73
Iodide SCHEMBL28521251 0.73
SCHEMBL3852175 0.73
Bromide SCHEMBL28512692 0.73

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8114178-B2 Polishing composition for semiconductor wafer and polishing method NIPPON CHEMICAL INDUSTRIAL CO., LTD. (JP) 2012-02-14 US disclosed
US-20080311750-A1 Polishing composition for semiconductor wafer and polishing method NIPPON CHEMICAL INDUSTRIAL CO., LTD. (JP) 2008-12-18 US disclosed