Predicted protein targets (top 5)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TSHR | P16473 | 2/20 | 0.39 |
| ▸ | PRKCA | P17252 | 2/20 | 0.33 |
| ▸ | FAAH | O00519 | 1/20 | 0.31 |
| ▸ | DHCR24 | Q15392 | 1/20 | 0.30 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL489031 | 0.91 | TSHR (0.36) | TSHRPRKCA | |
| SCHEMBL1560861 | 0.91 | TSHR (0.36) | TSHRPRKCAFAAHALOX15 | |
| SCHEMBL10605323 | 0.84 | MAPT (0.42) | TSHRFAAHDHCR24ALOX15 | |
| SCHEMBL10605319 | 0.84 | MAPT (0.42) | TSHRFAAHDHCR24ALOX15 | |
| SCHEMBL7776918 | 0.83 | PRKCA (0.34) | TSHRPRKCA | |
| SCHEMBL28161187 | 0.82 | TSHR (0.35) | TSHR | |
| SCHEMBL7779129 | 0.81 | TSHR (0.33) | TSHR | |
| SCHEMBL1473218 | 0.81 | TSHR (0.59) | TSHRDHCR24ALOX15 | |
| SCHEMBL873047 | 0.81 | TSHR (0.59) | TSHRDHCR24ALOX15 | |
| SCHEMBL873046 | 0.81 | TSHR (0.59) | TSHRDHCR24ALOX15 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 140 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-11330721-B2 | Resin film, and laminated film including base material film, resin film formed on base material film, and protective film attached to resin film | SHOWA DENKO MATERIALS CO., LTD (JP) | 2022-05-10 | — | — | US | claimed |
| CN-113088239-A | Ultraviolet light chain initiated self-reaction low-viscosity high-thickness full-curing glue | 烟台大学 | 2021-07-09 | — | — | CN | claimed |
| US-20200253059-A1 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR, AND RESIN COMPOSITION FOR FORMING FLEXIBLE RESIN LAYER | RESONAC CORPORATION (JP) | 2020-08-06 | — | — | US | claimed |
| EP-4383312-A1 | FILM FOR TEMPORARY FIXATION, LAYERED PRODUCT FOR TEMPORARY FIXATION, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | Resonac Corporation (JP) | 2024-06-12 | — | — | EP | disclosed |
| EP-4378682-A1 | RESIN COMPOSITION, RESIN SHEET, MULTILAYER BODY, SHEET CURED PRODUCT, AND CIRCUIT BOARD MATERIAL | Mitsubishi Chemical Corporation (JP) | 2024-06-05 | — | — | EP | disclosed |
| US-20240166858-A1 | RESIN COMPOSITION, RESIN SHEET, MULTILAYER BODY, SHEET CURED PRODUCT, AND CIRCUIT BOARD MATERIAL | MITSUBISHI CHEMICAL CORPORATION (JP) | 2024-05-23 | — | — | US | disclosed |
| US-20240166794-A1 | PHOTOCURABLE COMPOSITION, PHOTOCURABLE FOAM COMPOSITION, URETHANE (METH)ACRYLATE COMPOUND, AND METHOD FOR PRODUCING FOAM | SUNSTAR ENGINEERING INC. (JP) | 2024-05-23 | — | — | US | disclosed |
| US-20240150549-A1 | RESIN COMPOSITION, CURED PRODUCT, LAMINATE, TRANSPARENT ANTENNA AND MANUFACTURING METHOD THEREFOR, AND IMAGE DISPLAY DEVICE | RESONAC CORPORATION (JP) | 2024-05-09 | — | — | US | disclosed |
| US-20240141150-A1 | RESIN COMPOSITION, CURED PRODUCT, LAMINATE, TRANSPARENT ANTENNA, MANUFACTURING METHOD THEREFOR, AND IMAGE DISPLAY DEVICE | RESONAC CORPORATION (JP) | 2024-05-02 | — | — | US | disclosed |
| EP-3677649-B1 | ACTIVE ENERGY RAY-CURABLE COATING COMPOSITION | NIPPON PAINT AUTOMOTIVE COATINGS CO LTD (JP) | 2024-04-24 | — | — | EP | disclosed |
| US-20240093059-A1 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD, CURABLE RESIN COMPOSITION FOR TEMPORARY FIXATION MATERIAL, FILM FOR TEMPORARY FIXATION MATERIAL, AND LAMINATED FILM FOR TEMPORARY FIXATION MATERIAL | RESONAC CORPORATION (JP) | 2024-03-21 | — | — | US | disclosed |
| EP-1808447-A1 | Photocurable resin composition and a method for forming a pattern | HITACHI CHEMICAL CO., LTD. (JP) | 2007-07-18 | — | — | EP | disclosed |
| US-20070160937-A1 | Photocurable resin composition and a method for forming a pattern | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2007-07-12 | — | — | US | disclosed |
| US-20070065757-A1 | Photo-curable resin composition and a method for forming a pattern using the same | HITACHI CHEMICAL CO., LTD. (JP) | 2007-03-22 | — | — | US | disclosed |
| US-20070009834-A1 | Photosensitive thermosetting resin composition, and photosensitive cover lay and flexible printed wiring board using the composition | ARISAWA MFG. CO., LTD. (JP) | 2007-01-11 | — | — | US | disclosed |
| US-20060041067-A1 | Acrylic resin, resin boards, transparent electrode boards for touch panels, touch panels, and processes for production of them | MITSUBISHI RAYON CO., LTD. (JP) | 2006-02-23 | — | — | US | disclosed |
| EP-1505090-A1 | REACTIVE DILUENT COMPOSITION AND CURABLE RESIN COMPOSITION | Nippon Shokubai Co., Ltd. (JP) | 2005-02-09 | — | — | EP | disclosed |
| US-6767980-B2 | ACTIVATED ENERGY RAY-CURABLE INK COMPOSITION FOR INK-JET PRINTING; VINYL ETHER GROUP-CONTAINING (METH)ACRYLIC ESTER | NIPPON SHOKUBAI CO., LTD. (JP) | 2004-07-27 | — | — | US | disclosed |
| US-6639099-B1 | Transesterfication of methacrylic acid esters with 1,n-diols using in situ created zirconium acetylacetone catalyst; high purity materials with reduced level of zirconium impurities | ROEHM GMBH & CO. KG (DE) | 2003-10-28 | — | — | US | disclosed |
| US-20030199655-A1 | Reactive diluent and curable resin composition | NIPPON SHOKUBAI CO., LTD. | 2003-10-23 | — | — | US | disclosed |