SCHEMBL608713

SCHEMBL608713

C=COC(C)COC(C)CO

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8946894 0.98 TDP1 (0.31)
SCHEMBL14117999 0.98 TDP1 (0.31)
SCHEMBL1155663 0.98 TDP1 (0.31)
SCHEMBL23064137 0.98 TDP1 (0.31)
SCHEMBL23064131 0.98 TDP1 (0.31)
SCHEMBL23064154 0.98 TDP1 (0.31)
SCHEMBL23064141 0.98 TDP1 (0.31)
SCHEMBL23064148 0.98 TDP1 (0.31)
SCHEMBL606356 0.84
SCHEMBL4348273 0.80

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 390 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-109021167-B Modified carboxymethyl chitosan quaternary ammonium salt scale inhibitor and preparation method thereof 广东顺德良盛水处理科技有限公司 2021-04-30 CN claimed
CN-108865304-B Amide group-containing coal water slurry additive and preparation method thereof 佛山市天亿化工有限公司 2021-04-30 CN claimed
CN-106537195-B Resin composition for forming color filter underlayer film 日产化学工业株式会社 2019-12-06 CN claimed
EP-3312211-B1 CURABLE COMPOSITION, ADHESIVE SHEET, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING ADHESIVE SHEET, AND DEVICE DAICEL CORP (JP) 2026-05-27 EP disclosed
CN-122037808-A Adhesive tape 长兴材料工业股份有限公司 2026-05-15 CN disclosed
US-20260132314-A1 ADHESIVE TAPE ETERNAL MATERIALS CO., LTD. (TW) 2026-05-14 US disclosed
EP-4692162-A1 POLYMERIZABLE COMPOSITION, COPOLYMER, METHOD FOR PRODUCING COPOLYMER, AND KIT FOR PRODUCING COPOLYMER Maruzen Petrochemical Co., Ltd. (JP) 2026-02-11 EP disclosed
EP-4692256-A1 INK COMPOSITION, INK SET, INK PACK, AND INKJET RECORDING METHOD Maxell, Ltd. (JP) 2026-02-11 EP disclosed
EP-4685168-A1 METHOD FOR PRODUCING BLOCK COPOLYMER Maruzen Petrochemical Co., Ltd. (JP) 2026-01-28 EP disclosed
EP-4613789-A1 EPOXY COMPOUND PRODUCT Daicel Corporation (JP) 2025-09-10 EP disclosed
EP-4596230-A1 MULTILAYER STRUCTURE AND METHOD FOR PRODUCING SAME, AUTOMOBILE PART, AIRCRAFT PART, AND DAMPING MATERIAL FOR CARBON-FIBER-REINFORCED PLASTIC Mitsubishi Chemical Corporation (JP) 2025-08-06 EP disclosed
US-6706777-B1 CAN BE CURED IN THE ABSENCE OF A PHOTOINITIATOR WITH A IRRADIATION SOURCE OF PRACTICAL INTENSITY AND ENERGY VALUE SUN CHEMICAL CORPORATION 2004-03-16 US disclosed
EP-1339127-A1 SOLID POLYMER ELECTROLYTE AND CELL CONTAINING THE ELECTROLYTE DAINIPPON INK AND CHEMICALS, INC. (JP) 2003-08-27 EP disclosed
EP-0878482-B1 An active energy ray curable composition comprised of a maleimide derivative and a method for curing the said curable composition DAINIPPON INK & CHEMICALS (JP) 2003-03-26 EP disclosed
US-20020143120-A1 Composition of vinyl ether group-containing (meth) acrylic acid ester and production method thereof NIPPON SHOKUBAI CO., LTD. 2002-10-03 US disclosed
US-6410611-B1 COATINGS, SURFACE FINISHES, BINDERS DAINIPPON INK AND CHEMICALS, INC. (JP) 2002-06-25 US disclosed
EP-1201641-A2 Composition of vinyl ether group containing (meth)acrylic acid ester and production method thereof Nippon Shokubai Co., Ltd. (JP) 2002-05-02 EP disclosed
US-6235358-B1 COATING LAYERS OF EPOXY RESINS AND PHOTOCATIONIC CURING CATALTST WITH CATIONIC SULFUR ESTERS, SENSITIZERS OF THIOXANTHONES AND TITANIUM DIOXIDE PIGMENTS TOYO SEIKAN KAISHA, LTD. (JP) 2001-05-22 US disclosed
EP-0878482-A1 An active energy ray curable composition comprised of a maleimide derivative and a method for curing the said curable composition DAINIPPON INK AND CHEMICALS, INC. (JP) 1998-11-18 EP disclosed
US-5576407-A Copolymers of hydroxyalkyl vinyl ethers for use in detergents and cleaning agents BASF AKTIENGESELLSCHAFT (DE) 1996-11-19 US disclosed