⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL15569062 | 0.87 | — | — | |
| SCHEMBL28466822 | 0.87 | — | — | |
| SCHEMBL61893 | 0.87 | — | — | |
| SCHEMBL15390443 | 0.87 | — | — | |
| SCHEMBL1205973 | 0.75 | — | — | |
| SCHEMBL21380712 | 0.75 | — | — | |
| SCHEMBL17184577 | 0.75 | — | — | |
| Hydrogen Sulfide SCHEMBL20972404 | 0.75 | — | — | |
| Arsenic SCHEMBL21773555 | 0.75 | — | — | |
| SCHEMBL6092959 | 0.75 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 55 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-10290796-B2 | Thermoelectric devices and systems | MATRIX INDUSTRIES, INC. (US) | 2019-05-14 | — | — | US | claimed |
| EP-3132473-A1 | PIEZOELECTRIC MEMS RESONATOR WITH INTEGRATED PHASE CHANGE MATERIAL SWITCHES | Northeastern University (US) | 2017-02-22 | — | — | EP | claimed |
| WO-2015161257-A1 | PIEZOELECTRIC MEMS RESONATOR WITH INTEGRATED PHASE CHANGE MATERIAL SWITCHES | NORTHEASTERN UNIVERISTY (US) | 2015-10-22 | — | — | WO | claimed |
| US-12571106-B2 | Brittle particle cold spray (BPCS) technology for the deposition of nanostructured and microstructured multicompound composite materials | THUSS RICHARD C (US) | 2026-03-10 | — | — | US | disclosed |
| US-20230366098-A1 | BRITTLE PARTICLE COLD SPRAY (BPCS) TECHNOLOGY FOR THE DEPOSITION OF NANOSTRUCTURED AND MICROSTRUCTURED MULTICOMPOUND COMPOSITE MATERIALS | THUSS RICHARD C (US) | 2023-11-16 | — | — | US | disclosed |
| US-20210242389-A1 | METHODS FOR FORMING THERMOELECTRIC ELEMENTS | DEEB, ANTOINE E. | 2021-08-05 | — | — | US | disclosed |
| US-20210210670-A1 | METHODS FOR FORMING THERMOELECTRIC ELEMENTS | DEEB, ANTOINE E. | 2021-07-08 | — | — | US | disclosed |
| US-20200388743-A1 | METHODS FOR FORMING THERMOELECTRIC ELEMENTS | DEEB, ANTOINE E. | 2020-12-10 | — | — | US | disclosed |
| US-20200343433-A1 | THERMOELECTRIC DEVICES AND SYSTEMS | DEEB, ANTOINE E. | 2020-10-29 | — | — | US | disclosed |
| EP-3713480-A1 | THERMOELECTRIC DEVICES AND SYSTEMS | Matrix Industries, Inc. (US) | 2020-09-30 | — | — | EP | disclosed |
| US-10749094-B2 | Thermoelectric devices, systems and methods | THE REGENTS OF THE UNIVERSITY OF MICHIGAN (US) | 2020-08-18 | — | — | US | disclosed |
| WO-2014028903-A1 | SYSTEMS AND METHODS FOR FORMING THERMOELECTRIC DEVICES | SILICIUM ENERGY, INC. (US) | 2014-02-20 | — | — | WO | disclosed |
| CN-103095182-A | Novel automobile generator without consuming engine power | WU CHENZHI | 2013-05-08 | — | — | CN | disclosed |
| US-20130019918-A1 | THERMOELECTRIC DEVICES, SYSTEMS AND METHODS | THE REGENTS OF THE UNIVERSITY OF MICHIGAN (US) | 2013-01-24 | — | — | US | disclosed |
| WO-2013012842-A1 | THERMOELECTRIC DEVICES, SYSTEMS AND METHODS | THE REGENTS OF THE UNIVERSITY OF MICHIGAN (US) | 2013-01-24 | — | — | WO | disclosed |
| CN-102756660-A | Automobile capable of saving oil by 50 percent | CHENZHI WU | 2012-10-31 | — | — | CN | disclosed |
| CN-102456834-A | Nonvolatile memory device and manufacturing method thereof | SONY CORP | 2012-05-16 | — | — | CN | disclosed |
| US-7149155-B2 | Channeled dielectric re-recordable data storage medium | HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. (US) | 2006-12-12 | — | — | US | disclosed |
| US-20040057372-A1 | Channeled dielectric re-recordable data storage medium | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2004-03-25 | — | — | US | disclosed |
| EP-1400979-A2 | Channeled dielectric re-recordable data storage medium | Hewlett-Packard Development Company, L.P. (US) | 2004-03-24 | — | — | EP | disclosed |