Predicted protein targets (top 14)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | DGKA | P23743 | 1/20 | 0.52 |
| ▸ | DNM1 | Q05193 | 1/20 | 0.44 |
| ▸ | PRSS1 | P07477 | 1/20 | 0.42 |
| ▸ | PRSS2 | P07478 | 1/20 | 0.42 |
| ▸ | PRSS3 | P35030 | 1/20 | 0.42 |
| ▸ | EPHX2 | P34913 | 3/20 | 0.40 |
| ▸ | PRKCA | P17252 | 2/20 | 0.40 |
| ▸ | PAM | P19021 | 2/20 | 0.40 |
| ▸ | HTR2C | P28335 | 1/20 | 0.39 |
| ▸ | NAAA | Q02083 | 1/20 | 0.39 |
| ▸ | TSHR | P16473 | 1/20 | 0.38 |
| ▸ | MAPT | P10636 | 1/20 | 0.38 |
| ▸ | USP2 | O75604 | 1/20 | 0.37 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.37 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL27885495 | 0.94 | DGKA (0.46) | DGKADNM1PAMTSHRALDH1A1 | |
| SCHEMBL7938480 | 0.90 | DGKA (0.62) | DGKADNM1PRSS1PRSS2PRSS3 | |
| SCHEMBL20549269 | 0.90 | DGKA (0.47) | DGKADNM1PRSS1PRSS2PRSS3 | |
| SCHEMBL5730879 | 0.87 | DGKA (0.62) | DGKADNM1PRSS1PRSS2PRSS3 | |
| SCHEMBL11908231 | 0.87 | DGKA (0.62) | DGKADNM1PRSS1PRSS2PRSS3 | |
| SCHEMBL7941998 | 0.87 | DGKA (0.62) | DGKADNM1PRSS1PRSS2PRSS3 | |
| SCHEMBL15963994 | 0.87 | DGKA (0.62) | DGKADNM1PRSS1PRSS2PRSS3 | |
| SCHEMBL11908905 | 0.87 | DGKA (0.62) | DGKADNM1PRSS1PRSS2PRSS3 | |
| SCHEMBL9706868 | 0.87 | DGKA (0.62) | DGKADNM1PRSS1PRSS2PRSS3 | |
| SCHEMBL11909432 | 0.87 | DGKA (0.62) | DGKADNM1PRSS1PRSS2PRSS3 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-114381208-A | Photo-thermal dual-curing adhesive | 广州惠利电子材料有限公司 | 2022-04-22 | — | — | CN | disclosed |
| CN-110484180-B | High-flexibility high-hardness low-warpage hardening glue, hardening protective film and preparation method | 张家港康得新光电材料有限公司 | 2021-12-07 | — | — | CN | disclosed |
| US-9365754-B2 | Heat-curing resin composition, heat-curing adhesive sheet, and method for producing heat-curing adhesive sheet | DEXERIALS CORPORATION (JP) | 2016-06-14 | — | — | US | disclosed |
| US-9228116-B2 | Thermosetting resin composition, thermosetting adhesive sheet, and method of producing thermosetting adhesive sheet | DEXERIALS CORPORATION (JP) | 2016-01-05 | — | — | US | disclosed |
| US-20150111035-A1 | THERMOSETTING RESIN COMPOSITION, THERMOSETTING ADHESIVE SHEET, AND METHOD OF PRODUCING THERMOSETTING ADHESIVE SHEET | DEXERIALS CORPORATION (JP) | 2015-04-23 | — | — | US | disclosed |
| US-20130183520-A1 | HEAT-CURING RESIN COMPOSITION, HEAT-CURING ADHESIVE SHEET, AND METHOD FOR PRODUCING HEAT-CURING ADHESIVE SHEET | DEXERIALS CORPORATION (JP) | 2013-07-18 | — | — | US | disclosed |
| US-7147746-B2 | Pasting a first sheet and a second sheet having an integrated circuit module between them with a moisture hardenable adhesive; storing at 10-30 degrees C.; and storing at a higher temperature of 20-50 degrees C.; pasted sheets may be stacked together with paper, nonwoven fabric or metal separating sheets | KONICA CORPORATION (JP) | 2006-12-12 | — | — | US | disclosed |