Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MAPT | P10636 | 3/20 | 0.53 |
| ▸ | NPC1 | O15118 | 2/20 | 0.53 |
| ▸ | RAB9A | P51151 | 2/20 | 0.53 |
| ▸ | KDM4E | B2RXH2 | 2/20 | 0.53 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.53 |
| ▸ | LMNA | P02545 | 2/20 | 0.53 |
| ▸ | HPGD | P15428 | 2/20 | 0.53 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.53 |
| ▸ | PNMT | P11086 | 1/20 | 0.49 |
| ▸ | MAOA | P21397 | 1/20 | 0.47 |
| ▸ | MAP4K4 | O95819 | 1/20 | 0.45 |
| ▸ | ADORA2A | P29274 | 1/20 | 0.44 |
| ▸ | ADORA1 | P30542 | 1/20 | 0.44 |
| ▸ | ACHE | P22303 | 2/20 | 0.42 |
| ▸ | TDP2 | O95551 | 1/20 | 0.40 |
| ▸ | HTR7 | P34969 | 1/20 | 0.40 |
| ▸ | HTR2B | P41595 | 1/20 | 0.40 |
| ▸ | BRD4 | O60885 | 1/20 | 0.39 |
| ▸ | POLB | P06746 | 1/20 | 0.38 |
| ▸ | CA1 | P00915 | 1/20 | 0.38 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL7805131 | 0.88 | NPC1 (0.50) | MAPTNPC1RAB9AKDM4EALDH1A1 | |
| SCHEMBL30074156 | 0.87 | NPC1 (0.51) | MAPTNPC1RAB9AKDM4EALDH1A1 | |
| SCHEMBL28282684 | 0.87 | NPC1 (0.51) | MAPTNPC1RAB9AKDM4EALDH1A1 | |
| SCHEMBL28851607 | 0.87 | PNMT (0.52) | MAPTNPC1RAB9AKDM4EALDH1A1 | |
| SCHEMBL28888665 | 0.86 | KDM4E (0.50) | MAPTNPC1RAB9AKDM4EALDH1A1 | |
| SCHEMBL1681656 | 0.82 | NPC1 (0.52) | MAPTNPC1RAB9AKDM4EALDH1A1 | |
| SCHEMBL7805125 | 0.81 | PNMT (0.47) | MAPTNPC1RAB9AKDM4EALDH1A1 | |
| Benzidine SCHEMBL28228770 | 0.81 | HSD17B10 (0.50) | MAPTNPC1RAB9AKDM4EALDH1A1 | |
| Biphenyl SCHEMBL27512224 | 0.81 | HSD17B10 (0.50) | MAPTNPC1RAB9AKDM4EALDH1A1 | |
| SCHEMBL70992 | 0.81 | PNMT (0.53) | NPC1RAB9APNMTADORA2AADORA1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 28 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-113150545-B | Polymer film containing nano fullerene and preparation method thereof | 北京市科学技术研究院分析测试研究所(北京市理化分析测试中心) | 2022-11-15 | — | — | CN | claimed |
| CN-117120516-A | Polyimide, resin composition, polyimide film, and method for producing same | 旭化成株式会社 | 2023-11-24 | — | — | CN | disclosed |
| CN-116554473-A | Thermoplastic polyimide and application thereof in temporary bonding technology | 深圳先进电子材料国际创新研究院 | 2023-08-08 | — | — | CN | disclosed |
| CN-114683633-A | Laminate and method for manufacturing same | 律胜科技股份有限公司 | 2022-07-01 | — | — | CN | disclosed |
| CN-104662097-B | Resin combination, cured film, the manufacturing method of laminate film and semiconductor devices | 东丽株式会社 | 2018-06-05 | — | — | CN | disclosed |
| CN-106574163-A | Adhesive for temporary bonding, adhesive layer, method for manufacturing wafer work piece and semiconductor device using same, rework solvent, polyimide copolymer, polyimide mixed resin, and resin composition | 东丽株式会社 | 2017-04-19 | — | — | CN | disclosed |
| CN-106029743-A | Composition containing polyimide precursor and/or polyimide, and polyimide film | 三菱化学株式会社 | 2016-10-12 | — | — | CN | disclosed |
| CN-106029744-A | POLYIMIDE RESIN, RESIN COMPOSITION USING SAME, AND LAMINATED FILM | 东丽株式会社 | 2016-10-12 | — | — | CN | disclosed |
| CN-105612600-A | Element-processing layered structure, method for manufacturing element-processing layered structure, and method for manufacturing thin element using same | TORAY INDUSTRIES | 2016-05-25 | — | — | CN | disclosed |
| CN-103748141-B | Polyimide resin, the resin combination using it and laminate film | TORAY INDUSTRIES, INC. (JP) | 2016-04-20 | — | — | CN | disclosed |
| CN-100345927-C | Adhesive plaster for electronic parts and electronic parts | TOMOEGAWA PAPER CO LTD (JP) | 2007-10-31 | — | — | CN | disclosed |
| CN-1954015-A | Polyimide resin, multilayer film, multilayer film with metal layer, and semiconductor device | TORAY INDUSTRIES (JP) | 2007-04-25 | — | — | CN | disclosed |
| CN-1929994-A | Heat-resistant resin laminated film, multilayer film with metal layer including same, and semiconductor device | TORAY INDUSTRIES (JP) | 2007-03-14 | — | — | CN | disclosed |
| CN-1721489-A | Adhesive plaster for electronic parts and electronic parts | TOMOEGAWA PAPER CO LTD (JP) | 2006-01-18 | — | — | CN | disclosed |
| EP-1117102-B1 | Method of manufacturing material for forming insulating film | JSR CORP (JP) | 2005-08-10 | — | — | EP | disclosed |
| CN-1136252-C | Preparation of polyimide and polyamine acid | 世韩米克罗尼克斯株式会社 | 2004-01-28 | — | — | CN | disclosed |
| CN-1117113-C | Preparation of polyimide resin and polyamine acid as adhesive | SAEHAN IND CO LTD (KR) | 2003-08-06 | — | — | CN | disclosed |
| CN-1313349-A | Preparation of polyimide and polyamine acid | SAEHAN IND CO LTD (KR) | 2001-09-19 | — | — | CN | disclosed |
| CN-1313350-A | Preparation of polyimide resin and polyamine acid as adhesive | SAEHAN IND CO LTD (KR) | 2001-09-19 | — | — | CN | disclosed |
| EP-1117102-A2 | Method of manufacturing material for forming insulating film | JSR Corporation (JP) | 2001-07-18 | — | — | EP | disclosed |