SCHEMBL617987

SCHEMBL617987

[O]C(=O)CCS

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28628136 0.79
Mercaptopropionic Acid SCHEMBL28277042 0.74 ACE (0.63)
SCHEMBL8424503 0.74
SCHEMBL31621553 0.72 ACE (0.45)
SCHEMBL7460319 0.72
SCHEMBL8602936 0.70
SCHEMBL3496462 0.69
Mercaptopropionic Acid SCHEMBL10853644 0.69 ACE (0.67)
SCHEMBL1854231 0.69 ACE (0.77)
Mercaptopropionic Acid SCHEMBL7289 0.69

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 32 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2024069992-A1 ADHESIVE COMPOSITION AND PRODUCTION METHOD FOR ADHESIVE COMPOSITION 株式会社クラレ 2024-04-04 WO disclosed
CN-113227010-A Hydrofluoric acid-resistant resist composition and substrate processed product obtained using same 太阳油墨制造株式会社 2021-08-06 CN disclosed
US-11015114-B2 Article comprising particles with quantum dots 3M INNOVATIVE PROPERTIES COMPANY (US) 2021-05-25 US disclosed
US-20210011376-A1 PHOTOSENSITIVE TRANSFER MATERIAL, ELECTRODE PROTECTIVE FILM, LAMINATE, CAPACITIVE INPUT DEVICE, AND MANUFACTURING METHOD OF TOUCH PANEL FUJIFILM CORPORATION (JP) 2021-01-14 US disclosed
WO-2020130155-A1 HYDROFLUORIC ACID-RESISTANT RESIST COMPOSITION, AND PROCESSED SUBSTRATE PRODUCT PRODUCED USING SAME 太陽インキ製造株式会社 2020-06-25 WO disclosed
US-20190345379-A1 ARTICLE COMPRISING PARTICLES WITH QUANTUM DOTS 3M INNOVATIVE PROPERTIES COMPANY 2019-11-14 US disclosed
CN-110435276-A Layered body TEIJIN LTD 2019-11-12 CN disclosed
CN-110248808-A Layered body 帝人株式会社 2019-09-17 CN disclosed
CN-109423033-A Thermoplastic resin composition and its moulding article with excellent thermal stability and low birefringence 现代摩比斯株式会社 2019-03-05 CN disclosed
CN-109415646-A Lubricating additive composition, lubricating composition containing lubricating additive composition, and engine oil composition containing lubricating composition 株式会社ADEKA 2019-03-01 CN disclosed
US-8476333-B2 Photocurable composition BRIDGESTONE CORPORATION (JP) 2013-07-02 US disclosed
US-20120165498-A1 PHOTOCURABLE COMPOSITION BRIDGESTONE CORPORATION (JP) 2012-06-28 US disclosed
EP-2468797-A1 PHOTOCURABLE COMPOSITION Bridgestone Corporation (JP) 2012-06-27 EP disclosed
US-20120071579-A1 THIOL GROUP- CONTAINING ADHESIVE RESIN COMPOSITION BRIDGESTONE CORPORATION (JP) 2012-03-22 US disclosed
EP-2423282-A1 THIOL GROUP-CONTAINING ADHESIVE RESIN COMPOSITION Bridgestone Corporation (JP) 2012-02-29 EP disclosed
EP-2420535-A1 THIOL-CONTAINING LIQUID RUBBER COMPOSITION Bridgestone Corporation (JP) 2012-02-22 EP disclosed
US-20120041154-A1 THIOL-CONTAINING LIQUID RUBBER COMPOSITION BRIDGESTONE CORPORATION (JP) 2012-02-16 US disclosed
US-20110224382-A1 THERMOSETTING COMPOSITION BRIDGESTONE CORPORATION (JP) 2011-09-15 US disclosed
EP-2341100-A1 THERMOSETTING COMPOSITION Bridgestone Corporation (JP) 2011-07-06 EP disclosed
JP-2009173744-A UNDERFILL AGENT COMPOSITION SHIN ETSU CHEM CO LTD 2009-08-06 JP disclosed