SCHEMBL6235094

SCHEMBL6235094

Cc1cc(/C=C/c2cc(C)c(OCC3CO3)c(C)c2)cc(C)c1OCC1CO1

nearest known ligand 0.46

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 6/20 0.46
GLA P06280 1/20 0.46
TSHR P16473 4/20 0.44
TP53 P04637 3/20 0.44
HIF1A Q16665 2/20 0.44
CYP3A4 P08684 1/20 0.44
SMN1; SMN2 Q16637 1/20 0.44
TDP1 Q9NUW8 1/20 0.42
MAPT P10636 2/20 0.40
HPGD P15428 2/20 0.40
PKM P14618 2/20 0.40
MEN1 O00255 2/20 0.40
KMT2A Q03164 2/20 0.40
PPARG P37231 2/20 0.40
CYP1A2 P05177 1/20 0.40
LMNA P02545 1/20 0.40
GAA P10253 1/20 0.40
TUBB1 Q9H4B7 2/20 0.33
PTGS1 P23219 1/20 0.33
PTGS2 P35354 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6235098 1.00 ALDH1A1 (0.46) ALDH1A1GLATSHRTP53HIF1A
SCHEMBL21838255 0.86 ALDH1A1 (0.44) ALDH1A1GLATSHRTP53HIF1A
SCHEMBL4470150 0.83 ALDH1A1 (0.50) ALDH1A1GLATSHRTP53HIF1A
SCHEMBL13117147 0.83 ALDH1A1 (0.50) ALDH1A1GLATSHRTP53HIF1A
SCHEMBL49658 0.83 ALDH1A1 (0.50) ALDH1A1GLATSHRTP53HIF1A
Water SCHEMBL7640555 0.81 ALDH1A1 (0.49) ALDH1A1GLATSHRTP53HIF1A
SCHEMBL17857313 0.81 TUBB1 (0.47) ALDH1A1GLATSHRTP53HIF1A
SCHEMBL8636857 0.81 ALDH1A1 (0.40) ALDH1A1GLATSHRTP53HIF1A
SCHEMBL8636861 0.81 ALDH1A1 (0.40) ALDH1A1GLATSHRTP53HIF1A
SCHEMBL6242395 0.81 ALDH1A1 (0.38) ALDH1A1GLATSHRTP53HIF1A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
JP-11147937-A None JP disclosed
JP-9176144-A None JP disclosed
EP-1130041-B1 EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE SUMITOMO BAKELITE CO (JP) 2005-06-01 EP disclosed
US-6881812-B2 Latent catalyst having a structure of phosphonium borate consisting of a monovalent cation portion in which four specific groups are bonded to the phosphorus atom and a monovalent anion portion in which four specific groups are SUMITOMO BAKELITE COMPANY, LTD. (JP) 2005-04-19 US disclosed
EP-1153984-B1 RESIN COMPOSITION, MOLDED ARTICLE THEREFROM, AND UTILIZATION THEREOF KYOWA CHEM IND CO LTD (JP) 2004-10-27 EP disclosed
EP-0915118-B1 Epoxy resin composition and semiconductor device encupsulated therewith SUMITOMO BAKELITE CO (JP) 2004-02-11 EP disclosed
US-20030199391-A1 Latent catalyst having a structure of phosphonium borate consisting of a monovalent cation portion in which four specific groups are bonded to the phosphorus atom and a monovalent anion portion in which four specific groups are MIYAKE SUMIYA (JP) 2003-10-23 US disclosed
US-6524989-B2 Latent polymerization catalyst consists of phosphonium borate consisting of monovalent cation portion in which four specific groups are bonded to phoshorus atom and a monovalent anion portion in which four specific groups are bonded with B SUMITOMO BAKELITE COMPANY LIMITED (JP) 2003-02-25 US disclosed
US-6506828-B1 Resin composition, molded article therefrom, and utilization thereof KYOWA CHEMICAL INDUSTRY CO., LTD. (JP) 2003-01-14 US disclosed
EP-1153984-A1 RESIN COMPOSITION, MOLDED ARTICLE THEREFROM, AND UTILIZATION THEREOF Kyowa Chemical Industry Co., Ltd. (JP) 2001-11-14 EP disclosed
US-20010037003-A1 Latent polymerization catalyst consists of phosphonium borate consisting of monovalent cation portion in which four specific groups are bonded to phoshorus atom and a monovalent anion portion in which four specific groups are bonded with B MIYAKE SUMIYA (JP) 2001-11-01 US disclosed
US-20010021454-A1 Phosphonium borate MIYAKE SUMIYA (JP) 2001-09-13 US disclosed
EP-1130041-A1 EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE SUMITOMO BAKELITE CO., LTD. (JP) 2001-09-05 EP disclosed
US-6242110-B1 BLEND OF PHENOLIC RESIN, EPOXY RESIN FILLER AND CURING PROMOTER SUMITOMO BAKELITE COMPANY LIMITED (JP) 2001-06-05 US disclosed
JP-H11147937-A EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE SUMITOMO BAKELITE CO LTD 1999-06-02 JP disclosed
EP-0915118-A1 Epoxy resin composition and semiconductor device encupsulated therewith SUMITOMO BAKELITE COMPANY LIMITED (JP) 1999-05-12 EP disclosed
US-5854370-A Epoxy resin stilbenes and process for producing the same by photoisomerization SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1998-12-29 US disclosed
US-5705596-A STILBENE COMPOUNDS FOR ADHESIVES, PAINTS, ELECTRONICS AND INSULATION OF LAMINATES SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1998-01-06 US disclosed
JP-H09176144-A EPOXY COMPOUND, ITS PRODUCTION, CURABLE COMPOSITION AND CURED PRODUCT NIPPON KAYAKU CO LTD 1997-07-08 JP disclosed