SCHEMBL6284419

SCHEMBL6284419

C=Cc1ccccc1CCCCc1ccccc1C=C

nearest known ligand 0.44

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 2/20 0.44
THRB P10828 2/20 0.37
THRA P10827 1/20 0.37
LIPG Q9Y5X9 1/20 0.35
TSHR P16473 1/20 0.35
MITF O75030 1/20 0.34
TLR8 Q9NR97 1/20 0.32
MGLL Q99685 1/20 0.32
MEN1 O00255 1/20 0.31
LMNA P02545 1/20 0.31
BLM P54132 1/20 0.31
KMT2A Q03164 1/20 0.31
TDP1 Q9NUW8 1/20 0.31
MPO P05164 1/20 0.31
SLC6A4 P31645 1/20 0.31
EP300 Q09472 1/20 0.30
KAT2B Q92831 1/20 0.30
KAT5 Q92993 1/20 0.30
KAT8 Q9H7Z6 1/20 0.30
BID P55957 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL31054112 1.00 ALDH1A1 (0.44) ALDH1A1THRBTHRALIPGTSHR
SCHEMBL6278185 0.98 ALDH1A1 (0.43) ALDH1A1THRBTHRALIPGTSHR
SCHEMBL6278393 0.98 ALDH1A1 (0.43) ALDH1A1THRBTHRALIPGTSHR
SCHEMBL6281460 0.98 ALDH1A1 (0.43) ALDH1A1THRBTHRALIPGTSHR
SCHEMBL6280633 0.98 ALDH1A1 (0.43) ALDH1A1THRBTHRALIPGTSHR
SCHEMBL6278186 0.98 ALDH1A1 (0.43) ALDH1A1THRBTHRALIPGTSHR
SCHEMBL6285088 0.98 ALDH1A1 (0.43) ALDH1A1THRBTHRALIPGTSHR
SCHEMBL6278153 0.95 ALDH1A1 (0.44) ALDH1A1THRBTHRALIPGTSHR
SCHEMBL29377653 0.90 ALDH1A1 (0.48) ALDH1A1THRBTSHRMITFMEN1
SCHEMBL595200 0.90 ALDH1A1 (0.48) ALDH1A1THRBTSHRMITFMEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4474431-A1 THERMOSETTING RESIN COMPOSITION, RESIN COMPOSITION FOR PRINTED WIRING BOARD, AND RESIN COMPOSITION FOR PRINTED WIRING BOARD SUBSTRATE Daicel Corporation (JP) 2024-12-11 EP claimed
WO-2023145960-A1 THERMOSETTING RESIN COMPOSITION, RESIN COMPOSITION FOR PRINTED WIRING BOARD, AND RESIN COMPOSITION FOR PRINTED WIRING BOARD SUBSTRATE 株式会社ダイセル 2023-08-03 WO claimed
WO-2022266095-A1 GLOVE COMPRISING ACTIVATED ELASTOMERIC FILM BERRY GLOBAL, INC. (US) 2022-12-22 WO claimed
US-20220395039-A1 GLOVE COMPRISING ACTIVATED ELASTOMERIC FILM BERRY GLOBAL FILMS, LLC 2022-12-15 US claimed
US-12414911-B2 Topical compositions and methods of use MIRACLE FRUIT OIL L.L.C. (US) 2025-09-16 US disclosed
EP-4474431-A1 THERMOSETTING RESIN COMPOSITION, RESIN COMPOSITION FOR PRINTED WIRING BOARD, AND RESIN COMPOSITION FOR PRINTED WIRING BOARD SUBSTRATE Daicel Corporation (JP) 2024-12-11 EP disclosed
WO-2023145960-A1 THERMOSETTING RESIN COMPOSITION, RESIN COMPOSITION FOR PRINTED WIRING BOARD, AND RESIN COMPOSITION FOR PRINTED WIRING BOARD SUBSTRATE 株式会社ダイセル 2023-08-03 WO disclosed
US-11712877-B2 Elastomeric films having low tear propagation BERRY GLOBAL, INC. (US) 2023-08-01 US disclosed
US-11690932-B2 Elastomeric films having low tear propagation BERRY FILM PRODUCTS COMPANY, INC. (US) 2023-07-04 US disclosed
US-11673035-B2 Golf club head TAYLOR MADE GOLF COMPANY, INC. (US) 2023-06-13 US disclosed
WO-2023282219-A1 PRESSURE-SENSITIVE ADHESIVE TAPE デンカ株式会社 2023-01-12 WO disclosed
EP-4106645-A1 INSERTION DEVICES Smith&Nephew, Inc. (US) 2022-12-28 EP disclosed
WO-2022266095-A1 GLOVE COMPRISING ACTIVATED ELASTOMERIC FILM BERRY GLOBAL, INC. (US) 2022-12-22 WO disclosed
US-20220395039-A1 GLOVE COMPRISING ACTIVATED ELASTOMERIC FILM BERRY GLOBAL FILMS, LLC 2022-12-15 US disclosed
WO-2022081351-A1 ELASTIC LAMINATE HAVING INCREASED RUGOSITY BERRY GLOBAL, INC. (US) 2022-04-21 WO disclosed
US-20220111616-A1 Elastic Laminate Having Increased Rugosity BERRY GLOBAL, INC. (US) 2022-04-14 US disclosed
US-6855952-B2 Semiconductor device and semiconductor package HITACHI, LTD. (JP) 2005-02-15 US disclosed
US-20040038021-A1 Semiconductor device and semiconductor package HITACHI, LTD. (JP) 2004-02-26 US disclosed