Predicted protein targets (top 9)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | HTR2A | P28223 | 3/20 | 0.66 |
| ▸ | IDO1 | P14902 | 2/20 | 0.44 |
| ▸ | PAM | P19021 | 1/20 | 0.44 |
| ▸ | GRIK1 | P39086 | 2/20 | 0.44 |
| ▸ | GRIK2 | Q13002 | 2/20 | 0.44 |
| ▸ | MAOB | P27338 | 1/20 | 0.41 |
| ▸ | SIGMAR1 | Q99720 | 2/20 | 0.41 |
| ▸ | CHRNB2 | P17787 | 1/20 | 0.40 |
| ▸ | CHRNA4 | P43681 | 1/20 | 0.40 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL107852 | 0.83 | HTR2A (0.70) | HTR2AIDO1PAMGRIK1GRIK2 | |
| SCHEMBL2170349 | 0.83 | HTR2A (0.70) | HTR2AIDO1PAMGRIK1GRIK2 | |
| SCHEMBL107851 | 0.83 | HTR2A (0.70) | HTR2AIDO1PAMGRIK1GRIK2 | |
| SCHEMBL14037582 | 0.83 | HTR2A (0.70) | HTR2AIDO1PAMGRIK1GRIK2 | |
| SCHEMBL11059710 | 0.80 | HTR2A (0.61) | HTR2AIDO1PAMGRIK1GRIK2 | |
| SCHEMBL10435367 | 0.80 | HTR2A (0.66) | HTR2AIDO1GRIK1GRIK2 | |
| SCHEMBL810095 | 0.79 | HTR2A (0.66) | HTR2AIDO1PAMGRIK1GRIK2 | |
| SCHEMBL19586953 | 0.79 | HTR2A (1.00) | HTR2AIDO1PAMGRIK1GRIK2 | |
| SCHEMBL19604562 | 0.79 | HTR2A (0.66) | HTR2AIDO1PAMGRIK1GRIK2 | |
| SCHEMBL19586585 | 0.79 | HTR2A (1.00) | HTR2AIDO1PAMGRIK1GRIK2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-114555360-A | Copper-clad laminate, wiring board, and resin-attached copper foil | 松下知识产权经营株式会社 | 2022-05-27 | — | — | CN | disclosed |
| CN-114555357-A | Metal-clad laminate, wiring board, metal foil with resin, and resin composition | 松下知识产权经营株式会社 | 2022-05-27 | — | — | CN | disclosed |
| CN-114423602-A | Resin composition, prepreg, film with resin, metal foil with resin, metal-foil-clad laminate, and wiring board | 松下知识产权经营株式会社 | 2022-04-29 | — | — | CN | disclosed |
| CN-114174411-A | Resin composition, prepreg, film with resin, metal foil with resin, metal-foil-clad laminate, and wiring board | 松下知识产权经营株式会社 | 2022-03-11 | — | — | CN | disclosed |
| US-6900273-B1 | Low-hygroscopicity low-birefringence resin compositions, molding material obtained therefrom, sheet or film, and optical part | HITACHI CHEMICAL CO., LTD. (JP) | 2005-05-31 | — | — | US | disclosed |
| US-20040220342-A1 | Low-hygroscopicity low-birefringence resin compositions, molding material, sheet or film obtained therefrom, and optical part | YAMASHITA YUKIHIKO (JP) | 2004-11-04 | — | — | US | disclosed |
| EP-1205517-A1 | LOW-HYGROSCOPICITY LOW-BIREFRINGENCE RESIN COMPOSITIONS, MOLDING MATERIAL OBTAINED THEREFROM, SHEET OR FILM, AND OPTICAL PART | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2002-05-15 | — | — | EP | disclosed |