SCHEMBL6286622

SCHEMBL6286622

CCC(CC)CC=Cc1ccccc1

nearest known ligand 0.60

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
HTR2A P28223 3/20 0.60
GRIK1 P39086 2/20 0.47
GRIK2 Q13002 2/20 0.47
CTSC P53634 1/20 0.44
IDO1 P14902 2/20 0.44
PAM P19021 1/20 0.44
RELA Q04206 1/20 0.41
MEN1 O00255 1/20 0.41
KMT2A Q03164 1/20 0.41
MAOB P27338 1/20 0.41
SIGMAR1 Q99720 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5000035 0.86 HTR2A (0.50) HTR2AGRIK1GRIK2CTSC
SCHEMBL28420093 0.83 HTR2A (0.47) HTR2ACTSC
SCHEMBL28869297 0.82 GRIK1 (0.47) HTR2AGRIK1GRIK2MEN1KMT2A
SCHEMBL106773 0.82 HTR2A (0.63) HTR2AGRIK1GRIK2CTSCIDO1
SCHEMBL106772 0.82 HTR2A (0.63) HTR2AGRIK1GRIK2CTSCIDO1
SCHEMBL810276 0.80 HTR2A (0.56) HTR2AGRIK1GRIK2CTSCIDO1
SCHEMBL5773300 0.80 HTR2A (0.56) HTR2AGRIK1GRIK2CTSCIDO1
SCHEMBL5771311 0.80 HTR2A (0.56) HTR2AGRIK1GRIK2CTSCIDO1
SCHEMBL810131 0.80 HTR2A (0.56) HTR2AGRIK1GRIK2CTSCIDO1
SCHEMBL28419221 0.79 HTR2A (0.55) HTR2AGRIK1GRIK2CTSCIDO1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-4068676-A RELEASE AGENTS HALLIBURTON COMPANY (US) 1978-01-17 US claimed
CN-114555357-A Metal-clad laminate, wiring board, metal foil with resin, and resin composition 松下知识产权经营株式会社 2022-05-27 CN disclosed
CN-114555360-A Copper-clad laminate, wiring board, and resin-attached copper foil 松下知识产权经营株式会社 2022-05-27 CN disclosed
CN-110088148-B 1,3, 7-octatriene polymer, hydrogenated product thereof, and method for producing the polymer 株式会社可乐丽 2022-05-10 CN disclosed
CN-114174411-A Resin composition, prepreg, film with resin, metal foil with resin, metal-foil-clad laminate, and wiring board 松下知识产权经营株式会社 2022-03-11 CN disclosed
US-6900273-B1 Low-hygroscopicity low-birefringence resin compositions, molding material obtained therefrom, sheet or film, and optical part HITACHI CHEMICAL CO., LTD. (JP) 2005-05-31 US disclosed
US-20040220342-A1 Low-hygroscopicity low-birefringence resin compositions, molding material, sheet or film obtained therefrom, and optical part YAMASHITA YUKIHIKO (JP) 2004-11-04 US disclosed
EP-1205517-A1 LOW-HYGROSCOPICITY LOW-BIREFRINGENCE RESIN COMPOSITIONS, MOLDING MATERIAL OBTAINED THEREFROM, SHEET OR FILM, AND OPTICAL PART HITACHI CHEMICAL COMPANY, LTD. (JP) 2002-05-15 EP disclosed
US-4068676-A RELEASE AGENTS HALLIBURTON COMPANY (US) 1978-01-17 US disclosed