SCHEMBL62953

SCHEMBL62953

NCCN(CCN)CCO

nearest known ligand 0.44

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 2/20 0.44
TSHR P16473 1/20 0.44
LCK P06239 1/20 0.39
MAPT P10636 3/20 0.35
KDM4E B2RXH2 2/20 0.33
SMN1; SMN2 Q16637 2/20 0.33
ALOX15 P16050 1/20 0.33
HPGD P15428 2/20 0.31
MAPK1 P28482 2/20 0.31
CYP1A2 P05177 1/20 0.31
CYP2C9 P11712 1/20 0.31
HIF1A Q16665 1/20 0.31
HSD17B10 Q99714 1/20 0.31
HTT P42858 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL62067 1.00 ALDH1A1 (0.44) ALDH1A1TSHRLCKMAPTKDM4E
Hydrochloric Acid SCHEMBL6534747 0.97 ALDH1A1 (0.41) ALDH1A1TSHRLCKMAPTKDM4E
SCHEMBL10890082 0.97 ALDH1A1 (0.41) ALDH1A1TSHRLCKMAPTKDM4E
Hydrochloric Acid SCHEMBL6778167 0.97 ALDH1A1 (0.41) ALDH1A1TSHRLCKMAPTKDM4E
Trolamine SCHEMBL1092043 0.90 ALDH1A1 (0.57) ALDH1A1TSHRMAPTKDM4ESMN1; SMN2
Trolamine SCHEMBL5708445 0.90 ALDH1A1 (0.47) ALDH1A1TSHRMAPTKDM4ESMN1; SMN2
Monoethanolamine SCHEMBL21635468 0.90 ALDH1A1 (0.57) ALDH1A1TSHRLCKMAPT
Guanidine SCHEMBL9576405 0.89 ALDH1A1 (0.35) ALDH1A1TSHRLCK
SCHEMBL10632614 0.89 LCK (0.43) ALDH1A1TSHRLCK
SCHEMBL28508921 0.89 LCK (0.43) ALDH1A1TSHRLCK

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 340 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250320400-A1 CORROSION INHIBITOR AND RELATED METHODS OF INHIBITING CORROSION SCHLUMBERGER TECHNOLOGY CORP (US) 2025-10-16 US claimed
US-20250320401-A1 CORROSION INHIBITOR AND RELATED METHODS OF INHIBITING THE CORROSION OF METAL SURFACES SCHLUMBERGER TECHNOLOGY CORP (US) 2025-10-16 US claimed
EP-4632034-A1 CORROSION INHIBITOR AND RELATED METHODS OF INHIBITING CORROSION Services Pétroliers Schlumberger (FR) 2025-10-15 EP claimed
EP-4632033-A1 CORROSION INHIBITOR AND RELATED METHODS OF INHIBITING THE CORROSION OF METAL SURFACES Services Pétroliers Schlumberger (FR) 2025-10-15 EP claimed
US-20250129236-A1 PACKAGING FILMS AND METHODS OF MAKING THE SAME DisSolves, Inc. (US) 2025-04-24 US claimed
US-12202963-B2 Packaging films and methods of making the same DisSolves, Inc. (US) 2025-01-21 US claimed
WO-2025013658-A1 EMULSION COMPOSITION UBE株式会社 2025-01-16 WO claimed
US-20240002641-A1 Packaging Films And Methods of Making the Same DISSOLVES,INC. (US) 2024-01-04 US claimed
US-11795305-B2 Packaging films DisSolves, Inc. (US) 2023-10-24 US claimed
CN-111593378-A Preparation of high corrosion-resistant alkaline zinc-nickel alloy electroplating solution and components of additive 常州新纪元材料科技有限公司 2020-08-28 CN claimed
CN-111465679-A Cleaning compositions for removing post-etch or post-ash residues from semiconductor substrates and corresponding methods 巴斯夫欧洲公司 2020-07-28 CN claimed
US-9790600-B2 Etching agent for copper or copper alloy ENTEGRIS, INC. (US) 2017-10-17 US claimed
US-20160053383-A1 ETCHING AGENT FOR COPPER OR COPPER ALLOY SAMSUNG ELECTRONICS CO., LTD. (KR) 2016-02-25 US claimed
US-9175404-B2 Etching agent for copper or copper alloy ADVANCED TECHNOLOGY MATERIALS, INC. (US) 2015-11-03 US claimed
US-20140238953-A1 ETCHING AGENT FOR COPPER OR COPPER ALLOY SAMSUNG ELECTRONICS CO., LTD. (KR) 2014-08-28 US claimed
WO-2005037507-A1 METHODS FOR PRODUCING AND USING A CU(1)-BASED WOOD PRESERVATIVE PHIBRO-TECH, INC. (US) 2005-04-28 WO claimed
EP-1174491-A2 Bleaching and oxidation agents and their use Hahn, Ekkehardt (DE) 2002-01-23 EP claimed
US-4230588-A REACT WITH FATTY ACIDS AND ARYL SULFONIC ACIDS PHILLIPS PETROLEUM COMPANY (US) 1980-10-28 US claimed
US-20250343042-A1 DIFFUSING AGENT COMPOSITION, AND METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE TOKYO OHKA KOGYO CO LTD (JP) 2025-11-06 US disclosed
US-4048146-A PHOTORESISTS EASTMAN KODAK COMPANY (US) 1977-09-13 US disclosed