SCHEMBL6309352

SCHEMBL6309352

C=CC(=O)OCCCC([SiH3])(O[Si](C)(C)C=C)O[Si](C)(C)C=C

nearest known ligand 0.49

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
TSHR P16473 7/20 0.49
ALDH1A1 P00352 4/20 0.49
CYP3A4 P08684 2/20 0.49
HPGD P15428 1/20 0.49
TP53 P04637 3/20 0.41
HIF1A Q16665 3/20 0.41
HSD17B10 Q99714 1/20 0.41
THRB P10828 2/20 0.39
MAPK1 P28482 1/20 0.38
SMN1; SMN2 Q16637 1/20 0.38
ATM Q13315 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL394437 0.91 TSHR (0.52) TSHRALDH1A1CYP3A4HPGDTP53
SCHEMBL5701336 0.84 TSHR (0.45) TSHRALDH1A1CYP3A4HPGDTP53
SCHEMBL1125587 0.84 TSHR (0.55) TSHRALDH1A1CYP3A4HPGDTP53
SCHEMBL5701744 0.82 TSHR (0.43) TSHRALDH1A1CYP3A4HPGDTP53
SCHEMBL397195 0.81 TSHR (0.46) TSHRALDH1A1CYP3A4HPGDTP53
SCHEMBL21066770 0.80 TSHR (0.58) TSHRALDH1A1CYP3A4HPGDTP53
SCHEMBL26918870 0.78 TSHR (0.61) TSHRALDH1A1CYP3A4HPGDTP53
SCHEMBL21101831 0.78 TSHR (0.61) TSHRALDH1A1CYP3A4HPGDTP53
SCHEMBL21108491 0.78 TSHR (0.61) TSHRALDH1A1CYP3A4HPGDTP53
SCHEMBL9229975 0.78 TSHR (0.56) TSHRALDH1A1CYP3A4HPGDTP53

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 16 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6866764-B2 Processes for fabricating printed wiring boards using dendritic polymer copper nanocomposite coatings MICHIGAN MOLECULAR INSTITUTE (US) 2005-03-15 US claimed
EP-0882755-B1 Radially layered copoly (amidoamineorganosilicon) dendrimers MICHIGAN MOLECULAR INST (US) 2002-08-14 EP claimed
EP-0928813-A1 Dendrimer-based nanoscopic sponges and metal composites DOW CORNING CORPORATION (US) 1999-07-14 EP claimed
EP-0882755-A1 Radially layered copoly (amidoamineorganosilicon) dendrimers DOW CORNING CORPORATION (US) 1998-12-09 EP claimed
US-5739218-A HYDROPHOBIC; WATER INSOLUBILITY; MONOLAYERS ON WATER SUSTAIN SURFACE PRESSURE DOW CORNING CORPORATION (US) 1998-04-14 US claimed
EP-0893482-B1 Dendrimer-based networks having lyophilic organosilicon and hydrophilic polyamidoamine nanoscopic domains MICHIGAN MOLECULAR INST (US) 2004-05-12 EP disclosed
EP-0882755-B1 Radially layered copoly (amidoamineorganosilicon) dendrimers MICHIGAN MOLECULAR INST (US) 2002-08-14 EP disclosed
EP-1036809-A1 High generation radially layered dendrimers DOW CORNING CORPORATION (US) 2000-09-20 EP disclosed
US-6077500-A High generation radially layered dendrimers DOW CORNING CORPORATION (US) 2000-06-20 US disclosed
EP-0928813-A1 Dendrimer-based nanoscopic sponges and metal composites DOW CORNING CORPORATION (US) 1999-07-14 EP disclosed
US-5902863-A HAVING HYDROPHILIC AND HYDROPHOBIC DOMAINS; CONTROLLED SIZE, SHAPE AND DISTRIBUTION; THIN FILMS HAVING OPTICAL CLARITY, TRANSPARENT, COLORLESS AND A NON-STICK SURFACE DOW CORNING CORPORATION (US) 1999-05-11 US disclosed
EP-0893482-A1 Dendrimer-based networks having lyophilic organosilicon and hydrophilic polyamidoamine nanoscopic domains DOW CORNING CORPORATION (US) 1999-01-27 EP disclosed
EP-0882755-A1 Radially layered copoly (amidoamineorganosilicon) dendrimers DOW CORNING CORPORATION (US) 1998-12-09 EP disclosed
EP-0882755-A1 Radially layered copoly (amidoamineorganosilicon) dendrimers DOW CORNING CORPORATION (US) 1998-12-09 EP disclosed
US-5739218-A HYDROPHOBIC; WATER INSOLUBILITY; MONOLAYERS ON WATER SUSTAIN SURFACE PRESSURE DOW CORNING CORPORATION (US) 1998-04-14 US disclosed
US-5739218-A HYDROPHOBIC; WATER INSOLUBILITY; MONOLAYERS ON WATER SUSTAIN SURFACE PRESSURE DOW CORNING CORPORATION (US) 1998-04-14 US disclosed