SCHEMBL631088

SCHEMBL631088

C=CC(=O)OC(C)OC1CCCCC1

nearest known ligand 0.35

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
TSHR P16473 2/20 0.35
CYP19A1 P11511 1/20 0.32
EPHX1 P07099 2/20 0.32
LMNA P02545 1/20 0.30
CYP1A2 P05177 1/20 0.30
CYP2D6 P10635 1/20 0.30
CTSL P07711 1/20 0.30
CTSB P07858 1/20 0.30
CTSK P43235 1/20 0.30
SCN1A P35498 1/20 0.30
SCN2A Q99250 1/20 0.30
SCN3A Q9NY46 1/20 0.30
ALDH1A1 P00352 1/20 0.30
NPSR1 Q6W5P4 1/20 0.30
ACHE P22303 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14776487 0.98 TSHR (0.36) TSHR
SCHEMBL14776503 0.92 TSHR (0.33) TSHRCYP19A1CTSLCTSBCTSK
SCHEMBL3875556 0.91 TSHR (0.38) TSHR
SCHEMBL14776926 0.90 TSHR (0.33) TSHR
SCHEMBL8982919 0.82
SCHEMBL9421293 0.82 TSHR (0.37) TSHR
SCHEMBL1023799 0.81 TSHR (0.32) TSHR
SCHEMBL21169961 0.79 CYP19A1 (0.30) CYP19A1
SCHEMBL21235113 0.79 CYP19A1 (0.30) CYP19A1
SCHEMBL14776505 0.79 TSHR (0.33) TSHRCYP19A1EPHX1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 63 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
JP-58103339-A None JP disclosed
CN-111324013-B Chemically amplified positive photosensitive resin composition and application thereof 奇美实业股份有限公司 2023-12-01 CN disclosed
WO-2023167186-A1 POLYMERIZABLE COMPOSITION 株式会社日本触媒 2023-09-07 WO disclosed
WO-2023167187-A1 POLYMERIZABLE COMPOSITION 株式会社日本触媒 2023-09-07 WO disclosed
EP-3919525-B1 POLAR GROUP-CONTAINING OLEFIN COPOLYMER JAPAN POLYETHYLENE CORP (JP) 2023-08-09 EP disclosed
CN-116360211-A Chemically amplified positive photosensitive resin composition, protective film, and element having protective film 奇美实业股份有限公司 2023-06-30 CN disclosed
CN-111381438-B Chemically amplified positive photosensitive resin composition and application thereof 奇美实业股份有限公司 2023-06-20 CN disclosed
US-11643489-B2 (Meth)acrylic copolymer, polymer solution, polymer-containing composition, anti-fouling coating composition, and method for producing (meth)acrylic copolymer MITSUBISHI CHEMICAL CORPORATION (JP) 2023-05-09 US disclosed
US-11643489-B2 (Meth)acrylic copolymer, polymer solution, polymer-containing composition, anti-fouling coating composition, and method for producing (meth)acrylic copolymer MITSUBISHI CHEMICAL CORPORATION (JP) 2023-05-09 US disclosed
CN-115437214-A Chemically amplified positive photosensitive resin composition, protective film, and element having protective film 奇美实业股份有限公司 2022-12-06 CN disclosed
US-20110101503-A1 HYPERBRANCHED POLYMER SYNTHESIZING METHOD, HYPERBRANCHED POLYMER, RESIST COMPOSITION, SEMICONDUCTOR INTEGRATED CIRCUIT, AND SEMICONDUCTOR INTEGRATED CIRCUIT FABRICATION METHOD LION CORPORATION (JP) 2011-05-05 US disclosed
US-7695889-B2 Copolymer for semiconductor lithography and process for production thereof MARUZEN PETROCHEMICAL CO., LTD. (JP) 2010-04-13 US disclosed
US-7695889-B2 Copolymer for semiconductor lithography and process for production thereof MARUZEN PETROCHEMICAL CO., LTD. (JP) 2010-04-13 US disclosed
US-20100048848-A1 PROCESS FOR PRODUCING POLYMER FOR SEMICONDUCTOR LITHOGRAPHY MARUZEN PETROCHEMICAL CO., LTD. (JP) 2010-02-25 US disclosed
US-20100048848-A1 PROCESS FOR PRODUCING POLYMER FOR SEMICONDUCTOR LITHOGRAPHY MARUZEN PETROCHEMICAL CO., LTD. (JP) 2010-02-25 US disclosed
US-20090169736-A1 THERMOSETTING RESIN COMPOSITION, METHOD OF FORMING ANTIHALATION FILM OF SOLID-STATE IMAGING DEVICE, ANTIHALATION FILM FOR SOLID-STATE IMAGING DEVICES, AND SOLID-STATE IMAGING DEVICE JSR CORPORATION (JP) 2009-07-02 US disclosed
EP-0939109-B1 UV curable resin composition for coating FUJIKURA KASEI KK (JP) 2003-09-24 EP disclosed
US-20010008691-A1 UV CURABLE RESIN COMPOSITION FOR COATING FUJIKURA KASEI CO., LTD. (JP) 2001-07-19 US disclosed
EP-0939109-A1 UV curable resin composition for coating FUJIKURA KASEI CO., LTD. (JP) 1999-09-01 EP disclosed
JP-S58103339-A NOVEL ACRYLIC ACID ESTER MITSUBISHI PETROCHEM CO LTD 1983-06-20 JP disclosed