SCHEMBL6325430

SCHEMBL6325430

CCOC(N)C(O)(OCC)OCC

nearest known ligand 0.33

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
THRB P10828 1/20 0.33
LMNA P02545 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27659775 0.85
SCHEMBL749805 0.78 THRB (0.35) THRBLMNA
Ammonia Solution, Strong SCHEMBL4366931 0.76 THRB (0.33) THRBLMNA
SCHEMBL319331 0.75
SCHEMBL9487660 0.75 THRB (0.36) THRBLMNA
SCHEMBL7682477 0.75 MAPK1 (0.33)
SCHEMBL7100639 0.75 MAPK1 (0.33)
SCHEMBL9700080 0.74 THRB (0.32) THRBLMNA
SCHEMBL15577388 0.73 THRB (0.35) THRBLMNA
SCHEMBL6250058 0.73 THRB (0.35) THRBLMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-111123649-B Negative photoresist composition containing high heat resistance carboxyl phenolic resin 苏州瑞红电子化学品有限公司 2024-01-30 CN claimed
CN-116589622-A High-temperature-resistant photoresist film-forming resin and preparation method and application thereof 北京化工大学 2023-08-15 CN claimed
CN-113999340-B Film-forming resin containing silicon or sulfur and photoresist composition 江苏集萃光敏电子材料研究所有限公司 2023-04-28 CN claimed
CN-118778361-B Water-soluble acrylic photoresist 广东科优材料科技有限公司 2024-12-20 CN disclosed
CN-118778361-A Water-soluble acrylic photoresist 广东科优材料科技有限公司 2024-10-15 CN disclosed
CN-117908329-A KrF positive photoresist and preparation method thereof 瑞红(苏州)电子化学品股份有限公司 2024-04-19 CN disclosed
CN-111123649-B Negative photoresist composition containing high heat resistance carboxyl phenolic resin 苏州瑞红电子化学品有限公司 2024-01-30 CN disclosed
CN-113717314-B Photosensitive film-forming resin, photoresist composition and preparation method thereof 江苏集萃光敏电子材料研究所有限公司 2023-09-22 CN disclosed
CN-116589622-A High-temperature-resistant photoresist film-forming resin and preparation method and application thereof 北京化工大学 2023-08-15 CN disclosed
CN-113999340-B Film-forming resin containing silicon or sulfur and photoresist composition 江苏集萃光敏电子材料研究所有限公司 2023-04-28 CN disclosed
US-9083044-B2 Method for manufacturing anode active material for lithium secondary battery, anode active material for lithium secondary battery manufactured thereby and lithium secondary battery using same ECOPRO CO., LTD. (KR) 2015-07-14 US disclosed
US-20130183583-A1 METHOD FOR MANUFACTURING ANODE ACTIVE MATERIAL FOR LITHIUM SECONDARY BATTERY, ANODE ACTIVE MATERIAL FOR LITHIUM SECONDARY BATTERY MANUFACTURED THEREBY AND LITHIUM SECONDARY BATTERY USING SAME ECOPRO CO LTD (KR) 2013-07-18 US disclosed
CN-101146840-B Perfluoropolyether urethane additives having (meth)acryl groups and hardcoats 3M INNOVATIVE PROPERTIES CO 2011-06-15 CN disclosed
CN-101146840-A Perfluoropolyether urethane additives having (meth)acryl groups and hardcoats 3M INNOVATIVE PROPERTIES CO (US) 2008-03-19 CN disclosed
US-20050233207-A1 Electrolyte for lithium ion battery to control swelling E SQUARE TECHNOLOGIES CO, LTD. (KR) 2005-10-20 US disclosed
US-6856777-B2 Image forming apparatus with first and second charging members for charging residual toner CANON KABUSHIKI KAISHA (JP) 2005-02-15 US disclosed
US-20030053820-A1 Image forming apparatus CANON KABUSHIKI KAISHA (JP) 2003-03-20 US disclosed
EP-0009679-B1 FLUORESCENT DYESTUFFS OF THE STILBENE SERIES, PROCESS FOR THEIR PREPARATION AND THEIR USE IN THE WHITENING OF ORGANIC MATERIALS AND AS LASER DYESTUFFS BAYER AG (DE) 1982-04-21 EP disclosed
EP-0042181-A2 Diphenyl derivatives BAYER AG (DE) 1981-12-23 EP disclosed