SCHEMBL632697

SCHEMBL632697

CC=CC(=O)OCCCN=C=O

nearest known ligand 0.44

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
ATM Q13315 1/20 0.44
HCAR2 Q8TDS4 4/20 0.40
MAPT P10636 1/20 0.35
RAB9A P51151 1/20 0.35
NPSR1 Q6W5P4 1/20 0.35
TSHR P16473 2/20 0.34
HPGD P15428 1/20 0.34
ALDH1A1 P00352 1/20 0.33
CYP3A4 P08684 1/20 0.33
GSTP1 P09211 1/20 0.32
APP P05067 2/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5354168 1.00 ATM (0.44) ATMHCAR2MAPTRAB9ANPSR1
SCHEMBL3695169 0.95 ATM (0.43) ATMHCAR2MAPTRAB9ANPSR1
SCHEMBL3695165 0.95 ATM (0.43) ATMHCAR2MAPTRAB9ANPSR1
SCHEMBL5356475 0.93 HCAR2 (0.42) ATMHCAR2MAPTRAB9ANPSR1
SCHEMBL5370758 0.93 HCAR2 (0.42) ATMHCAR2MAPTRAB9ANPSR1
SCHEMBL25198124 0.93 HCAR2 (0.42) ATMHCAR2MAPTRAB9ANPSR1
SCHEMBL27883977 0.93 HCAR2 (0.42) ATMHCAR2MAPTRAB9ANPSR1
SCHEMBL5356470 0.93 HCAR2 (0.42) ATMHCAR2MAPTRAB9ANPSR1
SCHEMBL5370765 0.93 HCAR2 (0.42) ATMHCAR2MAPTRAB9ANPSR1
SCHEMBL27884001 0.93 HCAR2 (0.42) ATMHCAR2MAPTRAB9ANPSR1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 204 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4321549-A1 LOW VISCOSITY ASPARTATE TERMINATED PREPOLYMERS FOR ADHESIVE APPLICATIONS Covestro LLC (US) 2024-02-14 EP claimed
WO-2023249854-A1 LOW VISCOSITY ASPARTATE TERMINATED PREPOLYMERS FOR ADHESIVE APPLICATIONS COVESTRO LLC (US) 2023-12-28 WO claimed
US-20230416444-A1 LOW VISCOSITY ASPARTATE TERMINATED PREPOLYMERS FOR ADHESIVE APPLICATIONS COVESTRO LLC 2023-12-28 US claimed
US-20220154043-A1 ADHESIVE COMPOSITION FOR DICING FILM, DICING FILM AND DICING DIE BOND FILM LG CHEM, LTD. (KR) 2022-05-19 US claimed
CN-102844297-B method for producing isocyanates 3M INNOVATIVE PROPERTIES CO 2014-12-10 CN claimed
CN-102844297-A Method for producing isocyanates 3M INNOVATIVE PROPERTIES CO 2012-12-26 CN claimed
WO-2025084057-A1 METHOD FOR PRODUCING MONOMER PRECURSOR COMPOSITION 東レ株式会社 2025-04-24 WO disclosed
CN-118339207-A Polymer emulsion, method for storing same, two-part thermosetting resin composition using same, resin cured film, and coating film 株式会社力森诺科 2024-07-12 CN disclosed
WO-2024128086-A1 CURABLE COMPOSITION, LAMINATE, AND METHOD FOR PRODUCING LAMINATE 富士フイルム株式会社 2024-06-20 WO disclosed
CN-118159576-A Copolymer emulsion, and one-part thermosetting resin composition, two-part thermosetting resin composition, paint, resin cured film, and coating film using the copolymer emulsion 株式会社力森诺科 2024-06-07 CN disclosed
WO-2024117161-A1 BLOCKED ISOCYANATE COMPOSITION, (CO)POLYMER, COATING MATERIAL, CURED PRODUCT, AND COATING FILM 株式会社レゾナック 2024-06-06 WO disclosed
EP-4321549-A1 LOW VISCOSITY ASPARTATE TERMINATED PREPOLYMERS FOR ADHESIVE APPLICATIONS Covestro LLC (US) 2024-02-14 EP disclosed
US-11891472-B2 Composition, production method for composition, and production method for unsaturated compound RESONAC CORPORATION (JP) 2024-02-06 US disclosed
US-5847071-A Photosensitive resin composition HITACHI, CHEMICAL CO., LTD. (JP) 1998-12-08 US disclosed
US-5668248-A POLYAMIC ACID ESTERS HITACHI CHEMICAL CO., LTD. (JP) 1997-09-16 US disclosed
US-5547576-A POLYAMINE IMMOBILIZED ON SURFACE OF BASE MATERIAL TERUMO KABUSHIKI KAISHA (JP) 1996-08-20 US disclosed
US-5472823-A Polyamic acids HITACHI CHEMICAL CO., LTD. (JP) 1995-12-05 US disclosed
EP-0373952-B1 Photosensitive resin composition and photosensitive element using the same HITACHI CHEMICAL CO LTD (JP) 1995-02-08 EP disclosed
US-5262277-A Light sensitive elements for electrical thick films with heat resistance HITACHI CHEMICAL COMPANY, INC. (JP) 1993-11-16 US disclosed
EP-0373952-A2 Photosensitive resin composition and photosensitive element using the same Hitachi Chemical Co., Ltd. (JP) 1990-06-20 EP disclosed