SCHEMBL633439

SCHEMBL633439

O=C(CCCOCCCC(=O)c1ccccc1)c1ccccc1

nearest known ligand 0.69

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TDP1 Q9NUW8 4/20 0.69
MAPT P10636 3/20 0.69
L3MBTL1 Q9Y468 2/20 0.69
LMNA P02545 2/20 0.69
HDAC1 Q13547 5/20 0.62
HDAC8 Q9BY41 5/20 0.62
HDAC3 O15379 1/20 0.62
HDAC4 P56524 1/20 0.62
HDAC7 Q8WUI4 1/20 0.62
HDAC2 Q92769 1/20 0.62
HDAC10 Q969S8 1/20 0.62
HDAC11 Q96DB2 1/20 0.62
HDAC6 Q9UBN7 1/20 0.62
HDAC9 Q9UKV0 1/20 0.62
HDAC5 Q9UQL6 1/20 0.62
NPC1 O15118 1/20 0.60
CASP3 P42574 1/20 0.60
RAB9A P51151 1/20 0.60
SENP8 Q96LD8 1/20 0.60
SENP7 Q9BQF6 1/20 0.60

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5422035 0.94 TDP1 (0.73) TDP1MAPTL3MBTL1LMNAHDAC1
SCHEMBL8599281 0.92 TDP1 (0.77) TDP1MAPTL3MBTL1LMNAHDAC1
SCHEMBL11878394 0.91 TDP1 (0.58) TDP1MAPTL3MBTL1LMNAHDAC1
SCHEMBL6206820 0.89 TDP1 (0.60) TDP1MAPTL3MBTL1LMNAHDAC1
SCHEMBL6488590 0.87 TDP1 (0.61) TDP1MAPTL3MBTL1LMNAHDAC1
SCHEMBL5424313 0.87 TDP1 (0.61) TDP1MAPTL3MBTL1LMNAHDAC1
SCHEMBL7068671 0.84 TDP1 (0.95) TDP1MAPTL3MBTL1LMNAHDAC1
SCHEMBL1052631 0.84 TDP1 (0.86) TDP1MAPTL3MBTL1LMNAHDAC1
SCHEMBL7720290 0.84 TDP1 (0.64) TDP1MAPTL3MBTL1LMNAHDAC1
SCHEMBL5214695 0.84 TDP1 (0.64) TDP1MAPTL3MBTL1LMNAHDAC1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 43 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117186470-A Flexible barrier hardening film and preparation method thereof 博莫威(嘉兴)新技术有限公司 2023-12-08 CN disclosed
CN-116583498-A Blocked isocyanate compound 株式会社力森诺科 2023-08-11 CN disclosed
WO-2022145298-A1 BLOCKED ISOCYANATE COMPOUND 昭和電工株式会社 2022-07-07 WO disclosed
CN-105295718-B Composition for forming hard coat layer SK新技术株式会社 2020-06-30 CN disclosed
EP-2803504-B1 TIRE BRIDGESTONE CORP (JP) 2018-04-11 EP disclosed
US-9821612-B2 Tire BRIDGESTONE CORPORATION (JP) 2017-11-21 US disclosed
US-20140360645-A1 TIRE BRIDGESTONE CORPORATION (JP) 2014-12-11 US disclosed
US-8896117-B2 Semiconductor device bonded by an anisotropic conductive film CHEIL INDUSTRIES, INC. (KR) 2014-11-25 US disclosed
EP-2803504-A1 TIRE Bridgestone Corporation (JP) 2014-11-19 EP disclosed
US-20130127038-A1 SEMICONDUCTOR DEVICE BONDED BY AN ANISOTROPIC CONDUCTIVE FILM KUKDO CHEMICAL CO., LTD. (KR) 2013-05-23 US disclosed
EP-1612252-A2 Anisotropically electroconductive film Bridgestone Corporation (JP) 2006-01-04 EP disclosed
US-20050136246-A1 Anisotropic conductive film BRIDGESTONE CORPORATION 2005-06-23 US disclosed
EP-1533354-A1 ANISOTROPIC CONDUCTIVE FILM Bridgestone Corporation (JP) 2005-05-25 EP disclosed
US-6706391-B2 ADHESIVE IS COMPOSED OF A THERMOSET OR PHOTOSETTING RESIN COMPOSITION INCLUDING A BASE RESIN (ESPECIALLY A POLYVINYL ACETAL), A POLYMERIZATION INHIBITOR, AND ELECTROCONDUCTIVE PARTICLES. BRIDGESTONE CORPORATION (JP) 2004-03-16 US disclosed
EP-0883329-B1 Anisotropic conductive film BRIDGESTONE CORP (JP) 2003-03-26 EP disclosed
US-20020010247-A1 Anisotropically electroconductive film BRIDGESTONE CORPORATION 2002-01-24 US disclosed
EP-1168373-A1 ANISOTROPICALLY CONDUCTIVE FILM Bridgestone Corporation (JP) 2002-01-02 EP disclosed
US-6194492-B1 ELECTRICAL RESISTANCE, ADHESIVES, CONDUCTIVITY AND THERMOSETTING RESINS OR PHOTOSETTING RESINS WITH PEROXIDE OR PHOTOSENSITIZERS AND SILANES BRIDGESTONE CORPORATION (JP) 2001-02-27 US disclosed
EP-0883329-A2 Anisotropic conductive film Bridgestone Corporation (JP) 1998-12-09 EP disclosed
US-4371651-A PHOTOSTABILITY, HEAT RESISTANCE PHOENIX CHEMICAL CORPORATION (US) 1983-02-01 US disclosed