SCHEMBL6337494

SCHEMBL6337494

[SiH3]CC12CCC(CC1)C2

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3612425 0.77 GRIN2D (0.36)
SCHEMBL65160 0.72
SCHEMBL246184 0.72
SCHEMBL17969194 0.72
SCHEMBL1278877 0.72
SCHEMBL949557 0.72
SCHEMBL10787067 0.69 GRIN2D (0.31)
SCHEMBL222556 0.69 GRIN2D (0.31)
SCHEMBL11717577 0.69 GRIN2D (0.58)
SCHEMBL891886 0.69 MEN1 (0.38)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6852354-B2 Polymer/substrate and polymer/polymer interfaces and methods of modeling and forming same HONEYWELL INTERNATIONAL, INC. (US) 2005-02-08 US disclosed
WO-2003083901-A2 NOVEL POLYMER/SUBSTRATE AND POLYMER/POLYMER INTERFACES AND METHODS OF MODELING AND FORMING SAME HONEYWELL INTERNATIONAL INC. (US) 2003-10-09 WO disclosed
US-20030165695-A1 Models and methods of integrating simulation techniques for advanced material predictive analysis HONEYWELL INTERNATIONAL INC. 2003-09-04 US disclosed
US-6544650-B2 Modeling a first material with respect to a characteristic of the first material; modeling a second material with respect to a characteristic of the second value for characteristic; modeling an interface generating a set of evaluation data HONEYWELL INTERNATIONAL INC. 2003-04-08 US disclosed
US-20020157788-A1 Novel polymer/substrate and polymer/polymer interfaces and methods of modeling and forming same IWAMOTO NANCY E (US) 2002-10-31 US disclosed
US-20020035446-A1 Models and methods of integrating simulation techniques for advanced material predictive analysis HONEYWELL INTERNATIONAL INC. 2002-03-21 US disclosed