SCHEMBL6348686

SCHEMBL6348686

C=C(C)OC(=O)OCCOCC

nearest known ligand 0.60

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
THRB P10828 2/20 0.60
ALDH1A1 P00352 7/20 0.57
TSHR P16473 6/20 0.57
SOAT1 P35610 1/20 0.43
HSD17B10 Q99714 3/20 0.39
TDP1 Q9NUW8 1/20 0.39
GLO1 Q04760 1/20 0.35
LMNA P02545 1/20 0.34
TP53 P04637 2/20 0.33
HIF1A Q16665 2/20 0.33
MAPT P10636 1/20 0.32
EPHX2 P34913 1/20 0.32
NPSR1 Q6W5P4 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6353793 0.82 SOAT1 (0.44) THRBALDH1A1TSHRSOAT1HSD17B10
SCHEMBL6354928 0.81 TDP1 (0.44) THRBALDH1A1TSHRSOAT1HSD17B10
SCHEMBL6141329 0.81
SCHEMBL938633 0.80 ALDH1A1 (0.68) THRBALDH1A1TSHRSOAT1HSD17B10
SCHEMBL27597499 0.79 ALDH1A1 (0.56) THRBALDH1A1TSHRSOAT1HSD17B10
Acetic Acid SCHEMBL28148366 0.79 ALDH1A1 (0.67) THRBALDH1A1TSHRSOAT1HSD17B10
Propane SCHEMBL11376289 0.79 SOAT1 (0.64) THRBALDH1A1TSHRSOAT1HSD17B10
SCHEMBL1470310 0.78 ALDH1A1 (0.65) THRBALDH1A1TSHRSOAT1HSD17B10
SCHEMBL1470280 0.78 ALDH1A1 (0.65) THRBALDH1A1TSHRSOAT1HSD17B10
SCHEMBL11416400 0.78 ALDH1A1 (0.65) THRBALDH1A1TSHRSOAT1HSD17B10

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6974658-B2 HIGH MOLECULAR COMPOUND, MONOMER COMPOUNDS AND PHOTOSENSITIVE COMPOSITION FOR PHOTORESIST, PATTERN FORMING METHOD UTILIZING PHOTOSENSITIVE COMPOSITION, AND METHOD OF MANUFACTURING ELECTRONIC COMPONENTS KABUSHIKI KAISHA TOSHIBA (JP) 2005-12-13 US disclosed
US-20030235781-A1 High molecular compound, monomer compounds and photosensitive composition for photoresist, pattern forming method utilizing photosensitive composition, and method of manufacturing electronic components KABUSHIKI KAISHA TOSHIBA (JP) 2003-12-25 US disclosed