⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL20811 | 0.96 | — | — | |
| Water SCHEMBL29130541 | 0.92 | — | — | |
| Hydrochloric Acid SCHEMBL28633829 | 0.92 | — | — | |
| Ammonia Solution, Strong SCHEMBL4661964 | 0.92 | — | — | |
| SCHEMBL9983155 | 0.92 | — | — | |
| SCHEMBL27928230 | 0.83 | FDPS (0.31) | — | |
| SCHEMBL12790551 | 0.81 | FDPS (0.33) | — | |
| Thiourea SCHEMBL15303756 | 0.78 | TSHR (0.33) | — | |
| SCHEMBL23319713 | 0.76 | — | — | |
| SCHEMBL737157 | 0.76 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2302000-B1 | CURABLE COMPOSITION AND CATALYST COMPOSITION | KANEKA CORP (JP) | 2016-11-16 | — | — | EP | disclosed |
| US-9051501-B2 | Curable composition and catalyst composition | KANEKA CORPORATION (JP) | 2015-06-09 | — | — | US | disclosed |
| EP-2088173-B1 | CURABLE COMPOSITION AND CATALYST COMPOSITION | KANEKA CORP (JP) | 2012-02-22 | — | — | EP | disclosed |
| EP-2302000-A1 | Curable composition and catalyst composition | KANEKA CORPORATION (JP) | 2011-03-30 | — | — | EP | disclosed |
| US-20100041810-A1 | CURABLE COMPOSITION AND CATALYST COMPOSITION | KANEKA CORPORATION (JP) | 2010-02-18 | — | — | US | disclosed |
| EP-2088173-A1 | CURABLE COMPOSITION AND CATALYST COMPOSITION | Kaneka Corporation (JP) | 2009-08-12 | — | — | EP | disclosed |
| US-7252718-B2 | Forming a passivating aluminum fluoride layer and removing same for use in semiconductor manufacture | EKC TECHNOLOGY, INC. (US) | 2007-08-07 | — | — | US | disclosed |
| US-20060000492-A1 | Forming a passivating aluminum fluoride layer and removing same for use in semiconductor manufacture | CARTER MELVIN K | 2006-01-05 | — | — | US | disclosed |