Ethylenediamine

Ethylenediamine

SCHEMBL6370977

C=C.C=C.C=C.C=C.NCCN.O=[PH](O)O

nearest known ligand 0.31

Full drug profile on Sugi Atlas →

Known targets — ChEMBL curated mechanism

ADORA1ADORA2AADORA2BADORA3PDE3APDE3BPDE4APDE4BPDE4CPDE4D

The experimentally established mechanism targets of Ethylenediamine. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 1/20 0.31
TSHR P16473 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118119693-A Laundry detergent formulations 美国陶氏有机硅公司 2024-05-31 CN disclosed
CN-118019837-A Method for reducing residual water in clothes 美国陶氏有机硅公司 2024-05-10 CN disclosed
CN-117500904-A Liquid laundry detergent formulations 陶氏环球技术有限责任公司 2024-02-02 CN disclosed
CN-117480239-A Liquid laundry detergents 陶氏环球技术有限责任公司 2024-01-30 CN disclosed
CN-116940660-A Fabric care formulations 陶氏环球技术有限责任公司 2023-10-24 CN disclosed
CN-116917451-A fabric care compositions 罗门哈斯公司 2023-10-20 CN disclosed
CN-116568789-A Opacifying agent for detergent formulations 陶氏环球技术有限责任公司 2023-08-08 CN disclosed
CN-116234895-A Laundry treatment formulation 美国陶氏有机硅公司 2023-06-06 CN disclosed
US-11203731-B2 Composition for surface treatment and method of producing the same, surface treatment method, and method of producing semiconductor substrate FUJIMI INCORPORATED (JP) 2021-12-21 US disclosed
US-20210130735-A1 COMPOSITION FOR SURFACE TREATMENT AND METHOD OF PRODUCING THE SAME, SURFACE TREATMENT METHOD, AND METHOD OF PRODUCING SEMICONDUCTOR SUBSTRATE FUJIMI INCORPORATED (JP) 2021-05-06 US disclosed
CN-112384602-A Process for preparing stabilized polymers containing vinylimidazoles 巴斯夫欧洲公司 2021-02-19 CN disclosed
CN-111278960-A Washing and cleaning active polymer membranes, method for the production thereof and use thereof 巴斯夫欧洲公司 2020-06-12 CN disclosed
US-20050204639-A1 Polishing composition and polishing method FUJIMI INCORPORATED (JP) 2005-09-22 US disclosed
US-20050205837-A1 Polishing composition and polishing method FUJIMI INCORPORATED (JP) 2005-09-22 US disclosed