SCHEMBL637284

SCHEMBL637284

C=C(CCCCNC)C(=O)O

nearest known ligand 0.44

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KDM4A O75164 1/20 0.44
KDM4C Q9H3R0 1/20 0.44
TBXAS1 P24557 2/20 0.38
ADRA1A P35348 1/20 0.36
EPHX1 P07099 1/20 0.36
ALOX15 P16050 1/20 0.34
HSD17B10 Q99714 1/20 0.34
PRMT1 Q99873 1/20 0.34
TET2 Q6N021 1/20 0.33
KDM4E B2RXH2 2/20 0.33
ALDH1A1 P00352 1/20 0.33
KISS1R Q969F8 1/20 0.32
L3MBTL1 Q9Y468 1/20 0.32
SIGMAR1 Q99720 1/20 0.31
PAOX Q6QHF9 1/20 0.31
HAO1 Q9UJM8 1/20 0.31
THRB P10828 1/20 0.31
FNTA P49354 1/20 0.31
FNTB P49356 1/20 0.31
PGGT1B P53609 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL17423957 0.98 KDM4A (0.47) KDM4AKDM4CTBXAS1ADRA1AEPHX1
SCHEMBL4337783 0.98 KDM4A (0.47) KDM4AKDM4CTBXAS1ADRA1AEPHX1
SCHEMBL4334364 0.98 KDM4A (0.47) KDM4AKDM4CTBXAS1ADRA1AEPHX1
SCHEMBL337280 0.93 KDM4A (0.38) KDM4AKDM4CTBXAS1EPHX1ALOX15
Hydrochloric Acid SCHEMBL8005993 0.91 KDM4A (0.41) KDM4AKDM4CTBXAS1EPHX1ALOX15
Chloromethane SCHEMBL1507246 0.89 TET2 (0.36) KDM4AKDM4CTBXAS1ALOX15HSD17B10
SCHEMBL336883 0.84
SCHEMBL8527958 0.84 KDM4A (0.34) KDM4AKDM4CKDM4EALDH1A1L3MBTL1
SCHEMBL15709752 0.84 KDM4C (0.41) KDM4AKDM4CPAOX
Hydrochloric Acid SCHEMBL8380450 0.82 ALOX15 (0.37) KDM4AKDM4CTBXAS1ALOX15HSD17B10

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 121 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4076916-B1 WETTABLE SILICONE HYDROGEL CONTACT LENSES ALCON INC (CH) 2024-06-12 EP claimed
US-8568873-B2 Pressure-sensitive adhesive for polarizing plates, polarizing plate with pressure-sensitive adhesive and production process for the same LINTEC CORPORATION (JP) 2013-10-29 US claimed
US-7291372-B2 Release process film LINTEC CORPORATION (JP) 2007-11-06 US claimed
US-20070009733-A1 Adhesive optical component comprising an adhesive composition LINTEC CORPORATION (JP) 2007-01-11 US claimed
US-6720375-B2 MIXTURE OF (METH)ACRYLATE ESTER, CROSSLINKING AGENT AND PHENOLIC COMPOUND LINTEC CORPORATION (JP) 2004-04-13 US claimed
WO-2003092913-A1 INK-JET COATING COMPOSITIONS, PROCESS FOR MAKING, AND USE IN PROVIDING WATER-RESISTANT IMAGE PIXTERRA, INC. (US) 2003-11-13 WO claimed
EP-4063954-B1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, POSITIVE PHOTOSENSITIVE DRY FILM, METHOD FOR PRODUCING POSITIVE PHOTOSENSITIVE DRY FILM, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATION FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHINETSU CHEMICAL CO (JP) 2023-10-04 EP disclosed
EP-4067999-B1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATION FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHINETSU CHEMICAL CO (JP) 2023-10-04 EP disclosed
EP-4067999-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATION FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT Shin-Etsu Chemical Co., Ltd. (JP) 2022-10-05 EP disclosed
EP-3951499-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATION FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT Shin-Etsu Chemical Co., Ltd. (JP) 2022-02-09 EP disclosed
EP-3951498-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, POSITIVE PHOTOSENSITIVE DRY FILM, METHOD FOR PRODUCING POSITIVE PHOTOSENSITIVE DRY FILM, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATION FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT Shin-Etsu Chemical Co., Ltd. (JP) 2022-02-09 EP disclosed
WO-2022004197-A1 METHOD FOR MANUFACTURING ABRASIVE GRAINS, COMPOSITION FOR CHEMICAL MECHANICAL POLISHING AND METHOD FOR CHEMICAL MECHANICAL POLISHING JSR株式会社 2022-01-06 WO disclosed
EP-2605853-B1 PROCESS FOR IMPROVING THE STORAGE STABILITY OF AQUEOUS COMPOSITE PARTICLE DISPERSIONS BASF SE (DE) 2017-04-19 EP disclosed
EP-1235869-B1 METHOD FOR PRODUCING AN AQUEOUS DISPERSION OF PARTICLES THAT ARE MADE UP OF POLYMERS AND INORGANIC SOLID MATTER WHICH CONSISTS OF FINE PARTICLES BASF AG (DE) 2004-12-01 EP disclosed
WO-2004092481-A2 METHOD FOR THE TREATMENT OF PAPER SURFACES BASF AKTIENGESELLSCHAFT (DE) 2004-10-28 WO disclosed
EP-1431356-A2 Use of aqueous dipersion of particles made up of polymerisate and fine inorganic solid material for priming mineral substrates Basf AG (DE) 2004-06-23 EP disclosed
EP-1401902-A1 METHOD FOR PRODUCING AN AQUEOUS DISPERSION OF PARTICLES COMPOSED OF A POLYMER AND A FINE-PARTICLE INORGANIC SOLID BASF AKTIENGESELLSCHAFT (DE) 2004-03-31 EP disclosed
WO-2003099921-A1 RUBBER MIXTURES CONTAINING QUATERNARY POLYMERS AND POLAR SOFTENING AGENTS LANXESS DEUTSCHLAND GMBH (DE) 2003-12-04 WO disclosed
WO-2003000760-A1 METHOD FOR PRODUCING AN AQUEOUS DISPERSION OF PARTICLES COMPOSED OF A POLYMER AND A FINE-PARTICLE INORGANIC SOLID BASF AKTIENGESELLSCHAFT (DE) 2003-01-03 WO disclosed
EP-0412388-A2 Process of preparation of fine particles of polymers in powder form BASF Aktiengesellschaft (DE) 1991-02-13 EP disclosed