SCHEMBL637701

SCHEMBL637701

[CH2]CC(C)(C)CC([CH2])C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL811746 0.84
SCHEMBL451286 0.79
SCHEMBL5985045 0.78
SCHEMBL101701 0.77
SCHEMBL6935499 0.77
SCHEMBL866401 0.77
SCHEMBL16166198 0.74
SCHEMBL5986071 0.74
SCHEMBL23439968 0.72 ALDH1A1 (0.32)
SCHEMBL1971314 0.72

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 538 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3679013-B1 METHOD FOR MAKING ISOCYANATES COVESTRO INTELLECTUAL PROPERTY GMBH & CO KG (DE) 2023-11-29 EP claimed
EP-3481885-B1 HIGH-SOLIDS CONTENT SOLVENT-BASED ADHESIVE COMPOSITIONS AND METHODS OF MAKING SAME DOW GLOBAL TECHNOLOGIES LLC (US) 2023-09-13 EP claimed
EP-4223823-A1 NOVEL POLYURETHANES HAVING PENDANT EPOXY GROUPS AND THERMOSETS THEREOF Covestro LLC (US) 2023-08-09 EP claimed
EP-3514189-B1 SOLVENT-FREE MULTICOMPONENT SYSTEM EVONIK OPERATIONS GMBH (DE) 2023-07-26 EP claimed
US-11326024-B2 Polyamide resin, molded body, laminate, medical device, and polyamide resin production method KANEKA CORPORATION (JP) 2022-05-10 US claimed
EP-3481879-B1 TWO-COMPONENT ADHESIVE COMPOSITIONS AND METHODS OF MAKING SAME DOW GLOBAL TECHNOLOGIES LLC (US) 2021-12-22 EP claimed
US-20210277183-A1 POLYAMIDE RESIN, MOLDED BODY, LAMINATE, MEDICAL DEVICE, AND POLYAMIDE RESIN PRODUCTION METHOD KANEKA CORPORATION (JP) 2021-09-09 US claimed
CN-108699220-B Curing agent for low emission epoxy resin compositions SIKA技术股份公司 2021-07-23 CN claimed
EP-3330311-B1 STORAGE STABLE 1K-POLYURETHANE-PREPREGS AND MOULDED ARTICLE MADE FROM SAME ON THE BASIS OF A POLYURETHANE COMPOSITION EVONIK OPERATIONS GMBH (DE) 2021-05-05 EP claimed
EP-2685540-B1 NON-AQUEOUS ELECTROLYTE AND NON-AQUEOUS-ELECTROLYTE SECONDARY BATTERY USING SAME MITSUBISHI CHEM CORP (JP) 2021-03-10 EP claimed
EP-0122688-A2 Crystalline copolyamides from terephthalic acid, isophthalic acid and C6 diamines AMOCO CORPORATION (US) 1984-10-24 EP claimed
EP-0121985-A2 Crystalline copolyamides from terephthalic acid and hexamethylenediamine and trimethylhexamethylenediamine AMOCO CORPORATION (US) 1984-10-17 EP claimed
EP-0121983-A2 Polyamide compositions from mixtures of trimethylhexamethylene diamine, hexamethylene diamine and diacids AMOCO CORPORATION (US) 1984-10-17 EP claimed
US-4476280-A Polyamide compositions from mixtures of trimethylhexamethylene diamine, hexamethylene diamine and diacids STANDARD OIL COMPANY (US) 1984-10-09 US claimed
US-RE31343-E STABILIZERS FOR POLYMERS CIBA-GEIGY CORPORATION (US) 1983-08-09 US claimed
US-4248654-A Securing substrates together with melt adhesives based on polyamides VEBA-CHEMIE AKTIENGESELLSCHAFT (DE) 1981-02-03 US claimed
US-4229505-A WEAR LAYERS FOR FLOOR COVERINGS ARMSTRONG CORK COMPANY (US) 1980-10-21 US claimed
US-4221902-A CROSSLINKED, WEAR LAYER COATINGS ARMSTRONG CORK COMPANY (US) 1980-09-09 US claimed
US-4218515-A FOR FLOOR COVERINGS HECKLES JOHN S 1980-08-19 US claimed
US-4178432-A THERMOPLASTIC MOLDING MATERIALS; HEAT AND OXIDATION RESISTANCE THE UPJOHN COMPANY (US) 1979-12-11 US claimed