SCHEMBL6400586

SCHEMBL6400586

Nc1cccc(Oc2ccc(C(=O)c3ccc(Oc4cccc(N)c4)cc3)cc2)c1.Nc1cccc(Oc2ccc(Sc3ccc(Oc4cccc(N)c4)cc3)cc2)c1

nearest known ligand 0.59

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAOB P27338 1/20 0.53
PARP10 Q53GL7 3/20 0.49
ALDH1A1 P00352 2/20 0.49
TNKS O95271 1/20 0.49
PARP15 Q460N3 1/20 0.49
PARP14 Q460N5 1/20 0.49
TNKS2 Q9H2K2 1/20 0.49
PARP2 Q9UGN5 1/20 0.49
SRD5A2 P31213 4/20 0.49
PBRM1 Q86U86 1/20 0.46
MITF O75030 2/20 0.46
MEN1 O00255 1/20 0.46
GAA P10253 1/20 0.46
MAPT P10636 1/20 0.46
GFER P55789 1/20 0.46
KMT2A Q03164 1/20 0.46
SMN1; SMN2 Q16637 1/20 0.46
NLRP1 Q9C000 1/20 0.46
NOD2 Q9HC29 1/20 0.46
POLB P06746 2/20 0.46

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8374424 0.96 PBRM1 (0.54) MAOBPARP10ALDH1A1TNKSPARP15
SCHEMBL29083171 0.93 MAOB (0.51) MAOBPARP10ALDH1A1TNKSPARP15
SCHEMBL204441 0.91 MAOB (0.63) MAOBPARP10ALDH1A1TNKSPARP15
SCHEMBL29362975 0.91 MAOB (0.63) MAOBPARP10ALDH1A1TNKSPARP15
SCHEMBL8962593 0.91 MAOB (0.63) MAOBPARP10ALDH1A1TNKSPARP15
SCHEMBL204289 0.91 MAOB (0.63) MAOBPARP10ALDH1A1TNKSPARP15
SCHEMBL29394233 0.91 MAOB (0.63) MAOBPARP10ALDH1A1TNKSPARP15
SCHEMBL26111588 0.88 ALDH1A1 (0.61) MAOBPARP10ALDH1A1TNKSPARP15
SCHEMBL125530 0.87 MAOB (0.68) MAOBALDH1A1MITFMEN1GAA
SCHEMBL29363354 0.87 MAOB (0.68) MAOBALDH1A1MITFMEN1GAA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20050119381-A1 Thermosetting resin composition and laminates and circuit board substrates made by using the same KANEKA CORPORATION (JP) 2005-06-02 US disclosed