Di(Hydroxyethyl)Ether

Di(Hydroxyethyl)Ether

SCHEMBL6401383

O=P(O)(OCCCl)OCCCl.OCCOCCO

nearest known ligand 0.46

Full drug profile on Sugi Atlas →

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 2/20 0.46
TSHR P16473 2/20 0.43
MAPK1 P28482 1/20 0.43
MEN1 O00255 2/20 0.42
KMT2A Q03164 2/20 0.42
PLA2G2C Q5R387 1/20 0.32
PPARD Q03181 1/20 0.30
THRB P10828 1/20 0.30
HTT P42858 1/20 0.30
MAPT P10636 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9064989 0.91 ALDH1A1 (0.50) ALDH1A1TSHRPLA2G2CPPARD
SCHEMBL4906432 0.86 ALDH1A1 (0.60) ALDH1A1TSHR
SCHEMBL28435086 0.86 ALDH1A1 (0.60) ALDH1A1TSHR
SCHEMBL27852355 0.84 MEN1 (0.41) ALDH1A1TSHRMAPK1MEN1KMT2A
SCHEMBL8860368 0.84 MEN1 (0.55) ALDH1A1TSHRMAPK1MEN1KMT2A
SCHEMBL11258450 0.84 ALDH1A1 (0.45) ALDH1A1TSHRMAPK1MEN1KMT2A
Bromide SCHEMBL10486803 0.84 ALDH1A1 (0.57) ALDH1A1TSHR
SCHEMBL6738698 0.84 ALDH1A1 (0.57) ALDH1A1TSHR
SCHEMBL6401387 0.81 ALDH1A1 (0.62) ALDH1A1TSHRMAPK1MEN1KMT2A
Ethyl Chloride SCHEMBL11788111 0.79 ALDH1A1 (0.52) ALDH1A1TSHRPPARD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20050070647-A1 Flame retardant composition process for producing the same, flame-retardant resin composition, and molded object thereof DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2005-03-31 US disclosed
EP-1462503-A1 FLAME RETARDANT COMPOSITION, PROCESS FOR PRODUCING THE SAME, FLAME-RETARDANT RESIN COMPOSITION, AND MOLDED OBJECT THEREOF DAICEL CHEMICAL INDUSTRIES, Ltd. (JP) 2004-09-29 EP disclosed