Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CYP3A4 | P08684 | 3/20 | 0.42 |
| ▸ | TSHR | P16473 | 2/20 | 0.42 |
| ▸ | ACHE | P22303 | 1/20 | 0.41 |
| ▸ | MRGPRX4 | Q96LA9 | 1/20 | 0.39 |
| ▸ | HPGD | P15428 | 3/20 | 0.39 |
| ▸ | MAPK1 | P28482 | 3/20 | 0.39 |
| ▸ | L3MBTL1 | Q9Y468 | 3/20 | 0.39 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.39 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.39 |
| ▸ | POLB | P06746 | 1/20 | 0.38 |
| ▸ | NPSR1 | Q6W5P4 | 2/20 | 0.38 |
| ▸ | GAA | P10253 | 1/20 | 0.38 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.37 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.37 |
| ▸ | MEN1 | O00255 | 1/20 | 0.37 |
| ▸ | HCRTR1 | O43613 | 1/20 | 0.37 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.37 |
| ▸ | NPC1 | O15118 | 1/20 | 0.36 |
| ▸ | TP53 | P04637 | 1/20 | 0.36 |
| ▸ | RAB9A | P51151 | 1/20 | 0.36 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL135226 | 0.90 | CYP3A4 (0.48) | CYP3A4TSHRMRGPRX4HPGDMAPK1 | |
| SCHEMBL3174312 | 0.83 | HPGD (0.54) | CYP3A4TSHRHPGDMAPK1L3MBTL1 | |
| SCHEMBL9308791 | 0.83 | CYP3A4 (0.63) | CYP3A4TSHRACHEMAPK1L3MBTL1 | |
| SCHEMBL160572 | 0.83 | HPGD (0.54) | CYP3A4TSHRHPGDMAPK1L3MBTL1 | |
| SCHEMBL132774 | 0.81 | CYP3A4 (0.64) | CYP3A4TSHRACHEHPGDMAPK1 | |
| SCHEMBL5391862 | 0.81 | CYP3A4 (0.53) | CYP3A4TSHRACHEHPGDMAPK1 | |
| SCHEMBL108984 | 0.81 | CYP3A4 (0.50) | CYP3A4TSHRACHEHPGDMAPK1 | |
| SCHEMBL31746084 | 0.81 | CYP3A4 (0.52) | CYP3A4TSHRMAPK1TDP1ALDH1A1 | |
| SCHEMBL3834133 | 0.81 | CYP3A4 (0.52) | CYP3A4TSHRMAPK1TDP1ALDH1A1 | |
| SCHEMBL29349879 | 0.81 | CYP3A4 (0.50) | CYP3A4TSHRACHEHPGDMAPK1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 217 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2024056417-A1 | FLAME RETARDANT THERMOPLASTIC POLYURETHANE COMPOSITION | BASF SE (DE) | 2024-03-21 | — | — | WO | claimed |
| CN-114573946-B | Halogen-free low dielectric epoxy resin composition, laminated board and printed circuit board | 联茂(无锡)电子科技有限公司 | 2024-03-08 | — | — | CN | claimed |
| CN-114806078-B | Low expansion coefficient halogen-free resin composition, laminated board and printed circuit board | 联茂(无锡)电子科技有限公司 | 2023-12-05 | — | — | CN | claimed |
| CN-116874779-A | Polyamide acid solution, resin composition and application thereof | 山东金宝电子有限公司 | 2023-10-13 | — | — | CN | claimed |
| CN-115960438-A | Resin composition, prepreg and application of prepreg in laminated board, copper-clad plate and wiring board | 广东盈骅新材料科技有限公司 | 2023-04-14 | — | — | CN | claimed |
| CN-115637013-A | Bismaleimide composition, semi-cured film and copper foil substrate | 深圳伊帕思新材料科技有限公司 | 2023-01-24 | — | — | CN | claimed |
| CN-111117154-B | Flame-retardant thermosetting resin composition, and prepreg, laminated board and printed circuit board manufactured from same | 广东生益科技股份有限公司 | 2022-10-18 | — | — | CN | claimed |
| CN-114806167-A | Low-expansion-coefficient halogen-free resin composition, laminated plate and printed circuit board | 联茂(无锡)电子科技有限公司 | 2022-07-29 | — | — | CN | claimed |
| CN-114806078-A | Low-expansion-coefficient halogen-free resin composition, laminated plate and printed circuit board | 联茂(无锡)电子科技有限公司 | 2022-07-29 | — | — | CN | claimed |
| CN-114573946-A | Halogen-free low-dielectric epoxy resin composition, laminated board and printed circuit board | 联茂(无锡)电子科技有限公司 | 2022-06-03 | — | — | CN | claimed |
| US-20130115472-A1 | HALOGEN-FREE RESIN COMPOSITION, AND COPPER CLAD LAMINATE AND PRINTED CIRCUIT BOARD USING SAME | Elite Material Co., Ltd. (TW) | 2013-05-09 | — | — | US | claimed |
| US-20130105209-A1 | INORGANIC FILLER AND ELECTRIC MATERIAL CONTAINING THE SAME | ELITE ELECTRONIC MATERIAL (KUNSHAN) CO., LTD. (CN) | 2013-05-02 | — | — | US | claimed |
| US-20130108875-A1 | INORGANIC FILLER, RESIN COMPOSITION, AND APPLICATION THEREOF | ELITE ELECTRONIC MATERIAL (KUNSHAN) CO., LTD. (CN) | 2013-05-02 | — | — | US | claimed |
| US-20130075136-A1 | RESIN COMPOSITION AND PREPREG, LAMINATE AND CIRCUIT BOARD THEREOF | Elite Material Co., Ltd. (TW) | 2013-03-28 | — | — | US | claimed |
| US-20130075138-A1 | HALOGEN-FREE RESIN COMPOSITION AND COPPER CLAD LAMINATE AND PRINTED CIRCUIT BOARD USING SAME | Elite Material Co., Ltd. (TW) | 2013-03-28 | — | — | US | claimed |
| US-8404764-B1 | Resin composition and prepreg, laminate and circuit board thereof | Elite Material Co., Ltd. (TW) | 2013-03-26 | — | — | US | claimed |
| JP-2011529507-A | — | — | 2011-12-08 | — | — | JP | claimed |
| US-20110130490-A1 | FLAME RETARDANT POLYURETHANE COMPOSITION | GLOBAL INDUSTRIAL CORPORATION | 2011-06-02 | — | — | US | claimed |
| EP-2307501-A1 | FLAME RETARDANT POLYURETHANE COMPOSITION | Dow Global Technologies Inc. (US) | 2011-04-13 | — | — | EP | claimed |
| WO-2010012136-A1 | FLAME RETARDANT POLYURETHANE COMPOSITION | DOW GLOBAL TECHNOLOGIES INC. (US) | 2010-02-04 | — | — | WO | claimed |