SCHEMBL135226

SCHEMBL135226

Cc1ccc(OP(=O)(Oc2cccc(OP(=O)(Oc3ccc(C)cc3C)Oc3ccc(C)cc3C)c2)Oc2ccc(C)cc2C)c(C)c1

nearest known ligand 0.48

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CYP3A4 P08684 3/20 0.48
TSHR P16473 2/20 0.48
TDP1 Q9NUW8 2/20 0.44
MAPK1 P28482 2/20 0.44
ALDH1A1 P00352 1/20 0.44
HPGD P15428 4/20 0.43
L3MBTL1 Q9Y468 3/20 0.43
NPSR1 Q6W5P4 2/20 0.42
GAA P10253 1/20 0.42
MEN1 O00255 3/20 0.41
KMT2A Q03164 3/20 0.41
HCRTR1 O43613 1/20 0.41
LMNA P02545 2/20 0.39
MAPT P10636 1/20 0.39
HTT P42858 1/20 0.39
CYP1A2 P05177 1/20 0.38
CYP2C9 P11712 1/20 0.38
CYP2C19 P33261 1/20 0.38
MRGPRX4 Q96LA9 1/20 0.38
NPC1 O15118 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5391862 0.91 CYP3A4 (0.53) CYP3A4TSHRTDP1MAPK1ALDH1A1
SCHEMBL160572 0.90 HPGD (0.54) CYP3A4TSHRTDP1MAPK1ALDH1A1
SCHEMBL3174312 0.90 HPGD (0.54) CYP3A4TSHRTDP1MAPK1ALDH1A1
SCHEMBL640383 0.90 CYP3A4 (0.42) CYP3A4TSHRTDP1MAPK1ALDH1A1
SCHEMBL132774 0.88 CYP3A4 (0.64) CYP3A4TSHRTDP1MAPK1ALDH1A1
SCHEMBL108984 0.88 CYP3A4 (0.50) CYP3A4TSHRTDP1MAPK1ALDH1A1
SCHEMBL29349879 0.88 CYP3A4 (0.50) CYP3A4TSHRTDP1MAPK1ALDH1A1
SCHEMBL1317610 0.86 TSHR (0.68) CYP3A4TSHRTDP1MAPK1ALDH1A1
SCHEMBL1960509 0.86 TSHR (0.68) CYP3A4TSHRTDP1MAPK1ALDH1A1
SCHEMBL10783899 0.84 GPR84 (0.47) CYP3A4TSHRTDP1MAPK1ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 853 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11835858-B2 Photo-curable composition and methods for preparing cured film, optical component, circuit substrate, electrical component and replica mold using the same CANON KABUSHIKI KAISHA (JP) 2023-12-05 US claimed
US-11603467-B2 Polycarbonate resin composition MITSUBISHI ENGINEERING-PLASTICS CORPORATION (JP) 2023-03-14 US claimed
WO-2021256333-A1 PHOTO-CURABLE COMPOSITION AND METHODS FOR PREPARING CURED FILM, OPTICAL COMPONENT, CIRCUIT SUBSTRATE, ELECTRICAL COMPONENT AND REPLICA MOLD USING THE SAME CANON KABUSHIKI KAISHA (JP) 2021-12-23 WO claimed
US-20210397088-A1 PHOTO-CURABLE COMPOSITION AND METHODS FOR PREPARING CURED FILM, OPTICAL COMPONENT, CIRCUIT SUBSTRATE, ELECTRICAL COMPONENT AND REPLICA MOLD USING THE SAME CANON KABUSHIKI KAISHA (JP) 2021-12-23 US claimed
US-20200399471-A1 PHOSPHORUS-CONTAINING RESIN COMPOSITION AND ARTICLE MADE THEREFROM Elite Material Co., Ltd. (TW) 2020-12-24 US claimed
US-10072148-B2 Resin composition, copper clad laminate and printed circuit board using same ELITE ELECTRONIC MATERIAL (KUNSHAN) CO., LTD. (CN) 2018-09-11 US claimed
EP-2213703-B1 AROMATIC POLYCARBONATE RESIN COMPOSITION TEIJIN LTD (JP) 2018-05-16 EP claimed
US-20180072884-A1 RESIN COMPOSITION, COPPER CLAD LAMINATE AND PRINTED CIRCUIT BOARD USING SAME ELITE ELECTRONIC MATERIAL (KUNSHAN) CO. LTD. (CN) 2018-03-15 US claimed
US-9850375-B2 Resin composition, copper clad laminate and printed circuit board using same ELITE ELECTRONIC MATERIAL (KUNSHAN) CO. LTD. (CN) 2017-12-26 US claimed
EP-2751205-B1 MIGRATION-FREE, HALOGEN-FREE, FLAME RETARDANT THERMOPLASTIC POLYURETHANE COMPOSITIONS DOW GLOBAL TECHNOLOGIES LLC (US) 2016-11-23 EP claimed
WO-2011120225-A1 MIGRATION-FREE, HALOGEN-FREE, FLAME RETARDANT THERMOPLASTIC POLYURETHANE COMPOSITIONS DOW GLOBAL TECHNOLOGIES LLC (US) 2011-10-06 WO claimed
US-7928151-B2 Resin composition for shell mold and resin coated sand HITACHI CHEMICAL COMPANY, LTD. (JP) 2011-04-19 US claimed
US-7625964-B2 Flame retardant polycarbonate composition OVATION POLYMER TECHNOLOGY AND ENGINEERED MATERIALS, INC. (US) 2009-12-01 US claimed
US-20080214733-A1 FLAME RETARDANT POLYCARBONATE COMPOSITION OVATION POLYMER TECHNOLOGY AND ENGINEERED MATERIALS, INC. (US) 2008-09-04 US claimed
US-20060270768-A1 Flame retardant polycarbonate composition OVATION POLYMER TECHNOLOGY AND ENGINEERED MATERIALS, INC. 2006-11-30 US claimed
EP-1572789-A1 IGNITION RESISTANT POLYMERIC COMPOSITE DOW GLOBAL TECHNOLOGIES INC. (US) 2005-09-14 EP claimed
US-20050027048-A1 Complex flame retardant and thermoplastic resin composition containing it ASAHI GLASS COMPANY, LIMITED (JP) 2005-02-03 US claimed
US-20040143045-A1 Ignition resistant polymeric composite MORGAN ALEXANDER B (US) 2004-07-22 US claimed
WO-2004055103-A1 IGNITION RESISTANT POLYMERIC COMPOSITE DOW GLOBAL TECHNOLOGIES INC. (US) 2004-07-01 WO claimed
US-6403690-B1 HALOGEN-FREE; FREE RADICALLY POLYMERIZABLE MONOMER AND A REACTIVE HYDROXY-FUNCTIONAL CYCLIC PHOSPHINATE; VARNISH FOR GLASS WOVEN FABRICS LAMINATES MATSUSHITA ELECTRIC WORKS, LTD. (JP) 2002-06-11 US claimed