Predicted protein targets (top 17)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | EPHX1 | P07099 | 2/20 | 0.45 |
| ▸ | HPGD | P15428 | 2/20 | 0.45 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.45 |
| ▸ | EPHX2 | P34913 | 2/20 | 0.42 |
| ▸ | NPC1 | O15118 | 1/20 | 0.40 |
| ▸ | RAB9A | P51151 | 1/20 | 0.40 |
| ▸ | SLC1A3 | P43003 | 3/20 | 0.38 |
| ▸ | SLC1A2 | P43004 | 3/20 | 0.38 |
| ▸ | SLC1A1 | P43005 | 3/20 | 0.38 |
| ▸ | LMNA | P02545 | 1/20 | 0.37 |
| ▸ | CYP2D6 | P10635 | 1/20 | 0.37 |
| ▸ | ALOX5 | P09917 | 1/20 | 0.36 |
| ▸ | ADH1B | P00325 | 1/20 | 0.35 |
| ▸ | ADH1C | P00326 | 1/20 | 0.35 |
| ▸ | ADH1A | P07327 | 1/20 | 0.35 |
| ▸ | ADH4 | P08319 | 1/20 | 0.35 |
| ▸ | ADH7 | P40394 | 1/20 | 0.35 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL4610177 | 1.00 | EPHX1 (0.45) | EPHX1HPGDKMT2AEPHX2NPC1 | |
| SCHEMBL111091 | 1.00 | EPHX1 (0.45) | EPHX1HPGDKMT2AEPHX2NPC1 | |
| SCHEMBL10814953 | 1.00 | EPHX1 (0.45) | EPHX1HPGDKMT2AEPHX2NPC1 | |
| SCHEMBL644021 | 0.98 | KMT2A (0.42) | EPHX1HPGDKMT2AEPHX2NPC1 | |
| SCHEMBL1735458 | 0.93 | KMT2A (0.38) | EPHX1HPGDKMT2AEPHX2NPC1 | |
| SCHEMBL23644756 | 0.89 | EPHX1 (0.38) | EPHX1HPGDKMT2AEPHX2NPC1 | |
| SCHEMBL23644810 | 0.89 | EPHX1 (0.38) | EPHX1HPGDKMT2AEPHX2NPC1 | |
| SCHEMBL1134203 | 0.88 | — | — | |
| SCHEMBL2533403 | 0.88 | TET2 (0.36) | EPHX1HPGDKMT2ASLC1A3SLC1A2 | |
| Methacrylic Acid SCHEMBL5465243 | 0.86 | EPHX1 (0.36) | EPHX1HPGDKMT2AEPHX2NPC1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8535872-B2 | Thermally cured underlayer for lithographic application | FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. (US) | 2013-09-17 | — | — | US | disclosed |
| US-20120178871-A1 | THERMALLY CURED UNDERLAYER FOR LITHOGRAPHIC APPLICATION | DE BINOD B (US) | 2012-07-12 | — | — | US | disclosed |
| US-8153346-B2 | Hydroxyl containing polymer, amino crosslinking agent and thermal acid generator; undercoating for multilayer lithography material | FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. (US) | 2012-04-10 | — | — | US | disclosed |
| US-8119754-B2 | Room temperature curing adhesive composition having high temperature properties | HENKEL CORPORATION (US) | 2012-02-21 | — | — | US | disclosed |
| US-20100084091-A1 | ROOM TEMPERATURE CURING ADHESIVE COMPOSITION HAVING HIGH TEMPERATURE PROPERTIES | HENKEL CORPORATION (US) | 2010-04-08 | — | — | US | disclosed |
| WO-2008153883-A1 | ROOM TEMPERATURE CURING ADHESIVE COMPOSITION HAVING HIGH TEMPERATURE PROPERTIES | HENKEL CORPORATION (US) | 2008-12-18 | — | — | WO | disclosed |
| US-20080206676-A1 | THERMALLY CURED UNDERLAYER FOR LITHOGRAPHIC APPLICATION | FUJIFILM ELECTRONIC MATERIALS, U.S.A, INC | 2008-08-28 | — | — | US | disclosed |
| WO-2008103776-A2 | THERMALLY CURED UNDERLAYER FOR LITHOGRAPHIC APPLICATION | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2008-08-28 | — | — | WO | disclosed |
| US-7416821-B2 | Thermally cured undercoat for lithographic application | FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. (US) | 2008-08-26 | — | — | US | disclosed |
| EP-1743363-A2 | THERMALLY CURED UNDERCOAT FOR LITHOGRAPHIC APPLICATION | FujiFilm Electronic Materials USA, Inc. (US) | 2007-01-17 | — | — | EP | disclosed |
| US-20050238997-A1 | Thermally cured undercoat for lithographic application | FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. | 2005-10-27 | — | — | US | disclosed |
| WO-2005089150-A2 | THERMALLY CURED UNDERCOAT FOR LITHOGRAPHIC APPLICATION | FUJIFILM ELECTRONIC MATERIALS USA INC. (US) | 2005-09-29 | — | — | WO | disclosed |