⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL4845049 | 0.83 | APP (0.33) | — | |
| SCHEMBL6433577 | 0.80 | CYP2A6 (0.32) | — | |
| SCHEMBL15734831 | 0.80 | NPSR1 (0.34) | — | |
| SCHEMBL7190607 | 0.79 | POLB (0.33) | — | |
| SCHEMBL426114 | 0.78 | — | — | |
| SCHEMBL15734853 | 0.77 | CYP3A4 (0.35) | — | |
| SCHEMBL13429632 | 0.77 | APP (0.32) | — | |
| SCHEMBL15738335 | 0.76 | NPSR1 (0.34) | — | |
| SCHEMBL15735022 | 0.76 | NPC1 (0.34) | — | |
| SCHEMBL6436939 | 0.76 | ALDH1A1 (0.39) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-1276807-B1 | CURABLE SILICONE RESIN COMPOSITION AND REACTIVE SILICON COMPOUNDS | DOW CORNING (US) | 2005-10-12 | — | — | EP | disclosed |
| US-6780471-B2 | USING CROSSLINKER WITH NONFLEXIBLE LINKAGE INCLUDING AT LEAST ONE P-ARYLENE MOIETY FOR SPATIAL SEPARATION; FLEXURAL STRENGTH, FRACTURE TOUGHNESS, MODULUS AND/OR MECHANICAL DAMPING | DOW CORNING CORPORATION | 2004-08-24 | — | — | US | disclosed |
| US-20030130389-A1 | Curable silicone resin composition and reactive silicon compounds | DOW CORNING LIMITED (GB) | 2003-07-10 | — | — | US | disclosed |
| EP-1276807-A1 | CURABLE SILICONE RESIN COMPOSITION AND REACTIVE SILICON COMPOUNDS | Dow Corning Corporation (US) | 2003-01-22 | — | — | EP | disclosed |
| WO-2001083608-A1 | CURABLE SILICONE RESIN COMPOSITION AND REACTIVE SILICON COMPOUNDS | DOW CORNING CORPORATION (US) | 2001-11-08 | — | — | WO | disclosed |