SCHEMBL6435802

SCHEMBL6435802

CC(C)O[SiH](OCCl)OC(C)C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28437557 0.79
SCHEMBL7869224 0.74 LMNA (0.32)
SCHEMBL28959050 0.72
SCHEMBL106461 0.71
SCHEMBL7877703 0.70 HSD17B10 (0.32)
SCHEMBL10426770 0.69 LMNA (0.32)
Fluoride SCHEMBL27859121 0.68
SCHEMBL8436798 0.67 TDP1 (0.32)
SCHEMBL7195424 0.67 LMNA (0.30)
SCHEMBL28518302 0.65

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1276807-B1 CURABLE SILICONE RESIN COMPOSITION AND REACTIVE SILICON COMPOUNDS DOW CORNING (US) 2005-10-12 EP disclosed
US-6780471-B2 USING CROSSLINKER WITH NONFLEXIBLE LINKAGE INCLUDING AT LEAST ONE P-ARYLENE MOIETY FOR SPATIAL SEPARATION; FLEXURAL STRENGTH, FRACTURE TOUGHNESS, MODULUS AND/OR MECHANICAL DAMPING DOW CORNING CORPORATION 2004-08-24 US disclosed
US-20030130389-A1 Curable silicone resin composition and reactive silicon compounds DOW CORNING LIMITED (GB) 2003-07-10 US disclosed
EP-1276807-A1 CURABLE SILICONE RESIN COMPOSITION AND REACTIVE SILICON COMPOUNDS Dow Corning Corporation (US) 2003-01-22 EP disclosed
WO-2001083608-A1 CURABLE SILICONE RESIN COMPOSITION AND REACTIVE SILICON COMPOUNDS DOW CORNING CORPORATION (US) 2001-11-08 WO disclosed