SCHEMBL64393

SCHEMBL64393

CCCCCCCCCCCc1ncc[nH]1

nearest known ligand 0.59

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
TBXAS1 P24557 2/20 0.59
TERT O14746 1/20 0.50
ALDH1A1 P00352 1/20 0.43
PKM P14618 1/20 0.43
HPGD P15428 1/20 0.43
TAAR1 Q96RJ0 2/20 0.42
HTR1A P08908 1/20 0.42
ALOX15 P16050 1/20 0.41
CYP1A2 P05177 1/20 0.41
CYP3A4 P08684 1/20 0.41
CYP2D6 P10635 1/20 0.41
CYP19A1 P11511 1/20 0.41
CYP2C9 P11712 1/20 0.41
CYP2C19 P33261 1/20 0.41
GPR84 Q9NQS5 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL534913 1.00 TBXAS1 (0.59) TBXAS1TERTALDH1A1PKMHPGD
SCHEMBL2775177 1.00 TBXAS1 (0.59) TBXAS1TERTALDH1A1PKMHPGD
SCHEMBL535710 1.00 TBXAS1 (0.59) TBXAS1TERTALDH1A1PKMHPGD
SCHEMBL534846 1.00 TBXAS1 (0.59) TBXAS1TERTALDH1A1PKMHPGD
SCHEMBL23071637 1.00 TBXAS1 (0.59) TBXAS1TERTALDH1A1PKMHPGD
SCHEMBL3497513 1.00 TBXAS1 (0.59) TBXAS1TERTALDH1A1PKMHPGD
SCHEMBL25380441 1.00 TBXAS1 (0.59) TBXAS1TERTALDH1A1PKMHPGD
SCHEMBL73945 1.00 TBXAS1 (0.59) TBXAS1TERTALDH1A1PKMHPGD
SCHEMBL11277600 1.00 TBXAS1 (0.59) TBXAS1TERTALDH1A1PKMHPGD
SCHEMBL11277597 1.00 TBXAS1 (0.59) TBXAS1TERTALDH1A1PKMHPGD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Appears in 11533 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117549213-B Diamond prepreg for grinding pad and preparation method and application thereof 东莞市鼎泰鑫电子有限公司 2026-05-15 CN claimed
CN-119193064-B Comb type poly (arylene ether nitrile) modified epoxy resin adhesive and preparation method thereof 黑龙江省科学院石油化学研究院 2026-05-12 CN claimed
EP-4321541-B1 RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD AND SEMICONDUCTOR DEVICE MITSUBISHI GAS CHEMICAL CO (JP) 2025-08-06 EP claimed
US-12365783-B2 Compound, molded article, and cured product RESONAC CORPORATION (JP) 2025-07-22 US claimed
US-20250223488-A1 DEGRADABLE LOST CIRCULATION MATERIAL FOR PROTECTION OIL AND GAS RESERVOIRS, AND PREPARATION METHOD AND USE THEREOF CHINA UNIVERSITY OF PETROLEUM (EAST CHINA) (CN) 2025-07-10 US claimed
CN-120040724-A Preparation method of intermediate-normal-temperature rapid-curing transition metal coordination heterocyclic latent curing agent 北京化工大学 2025-05-27 CN claimed
CN-120041182-A Particle size-controllable epoxy resin fracturing propping agent and preparation method thereof 江苏扬农化工集团有限公司 2025-05-27 CN claimed
US-20250163261-A1 LOW-DIELECTRIC RESIN COMPOSITION NAN YA PLASTICS CORPORATION (TW) 2025-05-22 US claimed
CN-120005486-A Low dielectric resin composition 南亚塑胶工业股份有限公司 2025-05-16 CN claimed
CN-119899494-A High-heat-conductivity and high-strength epoxy resin material and preparation method and application thereof 江苏中科科化新材料股份有限公司 2025-04-29 CN claimed
US-4546155-A ADDUCT OF EPOXY COMPOUND, TERTIARY AMINE COMPOUND, AND CARBOXYLIC ACID ANHYDRIDE AJINOMOTO CO., INC. (JP) 1985-10-08 US claimed
US-4411700-A AMIDINE DERIVATIVES FUJI PHOTO FILM CO., LTD. (JP) 1983-10-25 US claimed
US-4370467-A CYANATE, PEROXIDE MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 1983-01-25 US claimed
US-4304818-A POLYISOCYANURATE-OXAZOLIDONES FROM POLYISOCYANATE AND POLYEPOXIDE HITACHI, LTD. (JP) 1981-12-08 US claimed
EP-0003663-A2 Amino-substituted phenyl and heteroaryl compounds, process for their preparation and pharmaceutical compositions containing them AMERICAN CYANAMID COMPANY (US) 1979-08-22 EP claimed
US-4110364-A AND BISMALEIIMIDES MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 1978-08-29 US claimed
US-4026872-A PHENOLIC CURING AGENTS HITACHI, LTD. (JA) 1977-05-31 US claimed
US-3984376-A Thermosetting resin compositions prepared from isocyanates and epoxyphenols HITACHI, LTD. (JA) 1976-10-05 US claimed
US-3947395-A Epoxy surface coating compositions HITACHI, LTD. (JA) 1976-03-30 US claimed
US-3933531-A Method of rust-preventing for copper and copper alloy SHIKOKU KASEI KOGYO COMPANY LIMITED (JP) 1976-01-20 US claimed