SCHEMBL645403

SCHEMBL645403

CC(=O)Nc1ccc([N+](=O)[O-])c2ccccc12

nearest known ligand 0.58

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
RXFP1 Q9HBX9 1/20 0.58
CTSB P07858 1/20 0.54
MAPT P10636 2/20 0.54
NPSR1 Q6W5P4 1/20 0.54
AKR1C4 P17516 2/20 0.53
AKR1C3 P42330 2/20 0.53
AKR1C2 P52895 2/20 0.53
AKR1C1 Q04828 2/20 0.53
AR P10275 1/20 0.53
PKM P14618 2/20 0.52
KMT2A Q03164 4/20 0.51
HTT P42858 2/20 0.51
PDE7A Q13946 1/20 0.51
TDP1 Q9NUW8 1/20 0.50
ALDH3A1 P30838 1/20 0.47
MEN1 O00255 1/20 0.46
KDM4E B2RXH2 1/20 0.45
ALDH1A1 P00352 1/20 0.45
HPGD P15428 1/20 0.45
CYP19A1 P11511 1/20 0.45

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11147829 0.90 TDP1 (0.60) RXFP1MAPTNPSR1PKMKMT2A
4-Nitroaniline SCHEMBL9483906 0.88 RXFP1 (0.47) RXFP1CTSBMAPTNPSR1AKR1C4
SCHEMBL5503917 0.87 RXFP1 (0.49) RXFP1CTSBMAPTNPSR1AKR1C4
SCHEMBL4583812 0.83 HCAR3 (0.63) CTSBMAPTNPSR1AKR1C4AKR1C3
SCHEMBL30735789 0.83 HCAR3 (0.63) CTSBMAPTNPSR1AKR1C4AKR1C3
SCHEMBL9054525 0.81 RXFP1 (0.52) RXFP1MAPTNPSR1AKR1C4AKR1C3
SCHEMBL6671791 0.81 AKR1C4 (0.49) CTSBNPSR1AKR1C4AKR1C3AKR1C2
SCHEMBL733777 0.81 KMT2A (0.69) MAPTNPSR1PKMKMT2AHTT
SCHEMBL3814746 0.81 TDP1 (0.55) CTSBMAPTAKR1C4AKR1C3AKR1C2
SCHEMBL29740651 0.81 KMT2A (0.69) MAPTNPSR1PKMKMT2AHTT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 424 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-110501875-B Photoresist composition, manufacturing method, substrate and display device 合肥鑫晟光电科技有限公司 2023-05-16 CN claimed
US-11592742-B2 Photoresist composition, its manufacturing method, and manufacturing methods of metal pattern and array substrate HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD. (CN) 2023-02-28 US claimed
US-11579525-B2 Photoresist composition, pixel definition structure and manufacturing method thereof, and display panel HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD. (CN) 2023-02-14 US claimed
CN-110441989-B Photoresist composition 沧州信联化工有限公司 2022-08-23 CN claimed
US-11322561-B2 Photoresist composition, pixel definition layer, display substrate and method for preparing the same, and display device HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD. (CN) 2022-05-03 US claimed
CN-108919605-B Photoresist composition, pixel defining layer, preparation method and application thereof 京东方科技集团股份有限公司 2021-12-21 CN claimed
CN-109100915-B Photoresist composition, pixel definition structure, manufacturing method of pixel definition structure and display panel 合肥鑫晟光电科技有限公司 2021-12-14 CN claimed
US-20210335929-A1 DISPLAY SUBSTRATE, DISPLAY APPARATUS, METHOD OF FABRICATING DISPLAY SUBSTRATE, AND PIXEL DEFINITION MATERIAL FOR FORMING PIXEL DEFINITION LAYER OF DISPLAY SUBSTRATE HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD. (CN) 2021-10-28 US claimed
US-20210333710-A1 Photoresist Composition, its Manufacturing Method, and Manufacturing Methods of Metal Pattern and Array Substrate HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD. (CN) 2021-10-28 US claimed
CN-111285796-B Monomer, polymer, resin composition, substrate, preparation method and display device 合肥鑫晟光电科技有限公司 2021-09-21 CN claimed
CN-108003273-A PH response type polymers and preparation method thereof and photoetching compositions 合肥鑫晟光电科技有限公司 2018-05-08 CN claimed
CN-102830589-B Resin composition of negative photoresist and preparation method thereof BOE TECHNOLOGY GROUP CO LTD 2014-12-17 CN claimed
CN-102830589-A Resin composition of negative photoresist and preparation method thereof BOE TECHNOLOGY GROUP CO LTD 2012-12-19 CN claimed
US-20070172600-A1 Molecular bonding method and molecular bonding device NATIONAL INSTITUTE OF INFORMATION AND COMMUNICATION TECHNOLOGY INCORPORATED (JP) 2007-07-26 US claimed
US-20070114400-A1 Probe NATIONAL INSTITUTE OF INFORMATION AND COMMUNICATIONS TECHNOLOGY, INCORPORATED (JP) 2007-05-24 US claimed
EP-1623953-A1 PROBE National Institute of Information and Communications Technology (JP) 2006-02-08 EP claimed
EP-1621517-A1 METHOD OF BONDING MOLECULE AND MOLECULE BONDING APPARATUS National Institute of Information and Communications Technology (JP) 2006-02-01 EP claimed
CN-1508625-A Negative photoresist resin coating liquid and preparation method thereof 中国科学院理化技术研究所 2004-06-30 CN claimed
US-4522913-A DIACRYLATE OR LOW MOLECULAR WEIGHT OLIGOMER THEROF, POLYMERIC FILLER, AND SENSITTIZER DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 1985-06-11 US claimed
US-4321319-A Photosensitive compositions containing polyamides acid with photosensitive groups HITACHI, LTD. (JP) 1982-03-23 US claimed