⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL23413280 | 0.69 | — | — | |
| SCHEMBL1789611 | 0.69 | — | — | |
| SCHEMBL28648238 | 0.68 | TSHR (0.47) | — | |
| SCHEMBL29064650 | 0.67 | — | — | |
| SCHEMBL11098290 | 0.67 | — | — | |
| SCHEMBL28760019 | 0.65 | — | — | |
| SCHEMBL11028216 | 0.64 | THRB (0.32) | — | |
| SCHEMBL7379405 | 0.63 | — | — | |
| SCHEMBL708811 | 0.63 | — | — | |
| SCHEMBL7976813 | 0.62 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 76 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-107129687-A | The preparation method of vibrating diaphragm, vibrating diaphragm component and vibrating diaphragm and vibrating diaphragm component | 歌尔股份有限公司 | 2017-09-05 | — | — | CN | claimed |
| US-12319814-B2 | Polyamideimide resin, resin composition, and semiconductor device | RESONAC CORPORATION (JP) | 2025-06-03 | — | — | US | disclosed |
| CN-114641514-B | Adhesive composition | 陶氏环球技术有限责任公司 | 2024-06-14 | — | — | CN | disclosed |
| EP-4303250-A1 | POLY(AMIDE-IMIDE) RESIN, RESIN COMPOSITION, AND SEMICONDUCTOR DEVICE | Resonac Corporation (JP) | 2024-01-10 | — | — | EP | disclosed |
| EP-4026867-B1 | POLYAMIDEIMIDE RESIN, RESIN COMPOSITION, AND SEMICONDUCTOR DEVICE | RESONAC CORP (JP) | 2023-12-06 | — | — | EP | disclosed |
| CN-116940618-A | Polyamide-imide resin, resin composition, and semiconductor device | 株式会社力森诺科 | 2023-10-24 | — | — | CN | disclosed |
| EP-3730536-B1 | POLYAMIDE IMIDE RESIN, POLYAMIDE IMIDE RESIN COMPOSITION, AND SEMICONDUCTOR DEVICE USING POLYAMIDE IMIDE RESIN AND POLYAMIDE IMIDE RESIN COMPOSITION | RESONAC CORP (JP) | 2023-09-13 | — | — | EP | disclosed |
| US-20220396721-A1 | ADHESIVE COMPOSITION | ARKEMA FRANCE (FR) | 2022-12-15 | — | — | US | disclosed |
| US-20220332947-A1 | POLYAMIDEIMIDE RESIN, RESIN COMPOSITION, AND SEMICONDUCTOR DEVICE | RESONAC CORPORATION (JP) | 2022-10-20 | — | — | US | disclosed |
| EP-4065623-A1 | ADHESIVE COMPOSITION | Dow Global Technologies LLC (US) | 2022-10-05 | — | — | EP | disclosed |
| US-20060106166-A1 | Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device | INADA TEIICHI | 2006-05-18 | — | — | US | disclosed |
| US-20060100315-A1 | Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device | INADA TEIICHI | 2006-05-11 | — | — | US | disclosed |
| CN-1763144-A | Adhesive composition, method for producing same, adhesive film using same, substrate for mounting semiconductor, and semiconductor device | HITACHI CHEMICAL CO LTD (JP) | 2006-04-26 | — | — | CN | disclosed |
| CN-1727429-A | Adhesive composition, process for producing the same, adhesive film made with the same, substrate for semiconductor mounting, and semiconductor device | HITACHI CHEMICAL CO LTD (JP) | 2006-02-01 | — | — | CN | disclosed |
| CN-1208418-C | Adhesive composition, method for producing same, adhesive film using same, substrate for mounting semiconductor, and semiconductor device | HITACHI CHEMICAL CO LTD (JP) | 2005-06-29 | — | — | CN | disclosed |
| CN-1633487-A | Adhesive sheet, semiconductor device and method for manufacturing the same | HITACHI CHEMICAL CO LTD (JP) | 2005-06-29 | — | — | CN | disclosed |
| US-6602970-B2 | A 2-cyanoacrylate composition has high curing rate and excellent moisture resistance, surface curability containing a cyclic phenol sulfide derivative | TOAGOSEI CO., LTD. (JP) | 2003-08-05 | — | — | US | disclosed |
| US-20030069331-A1 | An adhesive formulation containing an epoxy resin, a phenolic curing agent and a acrylic copolymer incompatible with epoxy resin | HITACHI CHEMICAL CO., LTD. (JP) | 2003-04-10 | — | — | US | disclosed |
| CN-1400993-A | Adhesive composition, method for producing same, adhesive film using same, substrate for mounting semiconductor, and semiconductor device | HITACHI CHEMICAL CO LTD (JP) | 2003-03-05 | — | — | CN | disclosed |
| US-20020029848-A1 | 2-cyanoacrylate composition | TOAGOSEI CO., LTD. | 2002-03-14 | — | — | US | disclosed |