⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL4520004 | 0.61 | — | — | |
| SCHEMBL9901675 | 0.61 | — | — | |
| SCHEMBL6519556 | 0.55 | — | — | |
| SCHEMBL6519554 | 0.55 | — | — | |
| SCHEMBL733360 | 0.50 | — | — | |
| SCHEMBL9388785 | 0.50 | — | — | |
| SCHEMBL5420343 | 0.50 | — | — | |
| SCHEMBL590264 | 0.50 | — | — | |
| SCHEMBL3802203 | 0.50 | — | — | |
| SCHEMBL20267772 | 0.50 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 747 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-120160734-A | Hemispherical double-shaft torque sensor | 四川国软科技集团有限公司 | 2025-06-17 | — | — | CN | claimed |
| CN-120160735-A | Differential type circular torque sensor | 四川国软科技集团有限公司 | 2025-06-17 | — | — | CN | claimed |
| CN-114787304-B | Shallow trench isolation chemical mechanical planarization polishing of low oxide trench recesses | 弗萨姆材料美国有限责任公司 | 2024-06-18 | — | — | CN | claimed |
| EP-4323470-A1 | ETCHING SOLUTION FOR SELECTIVELY REMOVING SILICON-GERMANIUM ALLOY FROM A SILICON-GERMANIUM/ SILICON STACK DURING MANUFACTURE OF A SEMICONDUCTOR DEVICE | Versum Materials US, LLC (US) | 2024-02-21 | — | — | EP | claimed |
| CN-112086516-B | Semiconductor-on-insulator structure and total dose radiation resisting reinforcement method thereof | 中国科学院微电子研究所 | 2024-01-19 | — | — | CN | claimed |
| EP-4286926-A1 | METHOD FOR MANUFACTURING A PHOTONIC CHIP | Commissariat à l'énergie atomique et aux énergies alternatives (FR) | 2023-12-06 | — | — | EP | claimed |
| CN-112349329-B | EEPROM memory cell structure compatible with standard CMOS process | 北京工业大学 | 2023-06-30 | — | — | CN | claimed |
| US-11670539-B2 | Method of making a semiconductor arrangement | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) | 2023-06-06 | — | — | US | claimed |
| WO-2022131103-A1 | ELECTRONIC APPARATUS AND METHOD FOR MANUFACTURING ELECTRONIC APPARATUS | ソニーセミコンダクタソリューションズ株式会社 | 2022-06-23 | — | — | WO | claimed |
| US-20220130866-A1 | Silicon-On-Oxide-On-Silicon | BOARD OF REGENTS, THE UNIVERSITY OF TEXAS SYSTEM | 2022-04-28 | — | — | US | claimed |
| CN-101930940-B | Semiconductor shallow trench isolation method | CSMC SEMICONDUCTOR CO LTD | 2014-01-01 | — | — | CN | claimed |
| CN-103035560-A | Method for restraining boron impurities expanding in P-shaped pseudo buried layer | SHANGHAI HUAHONG NEC ELECT CO | 2013-04-10 | — | — | CN | claimed |
| CN-101930940-A | Semiconductor shallow trench isolation method | CSMC SEMICONDUCTOR CO LTD | 2010-12-29 | — | — | CN | claimed |
| US-20080054228-A1 | DOPED NITRIDE FILM, DOPED OXIDE FILM AND OTHER DOPED FILMS | GLOBALFOUNDRIES U.S. INC. | 2008-03-06 | — | — | US | claimed |
| US-20060222869-A1 | Electropen lithography | ENERGY, UNITED STATES DEPARTMENT | 2006-10-05 | — | — | US | claimed |
| US-6593589-B1 | Semiconductor nitride structures | THE UNIVERSITY OF NEW MEXICO | 2003-07-15 | — | — | US | claimed |
| US-6479350-B1 | Reduced masking step CMOS transistor formation using removable amorphous silicon sidewall spacers | ADVANCED MICRO DEVICES, INC. | 2002-11-12 | — | — | US | claimed |
| US-6107143-A | Method for forming a trench isolation structure in an integrated circuit | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2000-08-22 | — | — | US | claimed |
| EP-0652591-B1 | Method of forming a radiation-hardened silicon-on-insulator semiconductor device | IBM (US) | 1999-12-22 | — | — | EP | claimed |
| EP-0062334-B1 | FLEXIBLE POLYMER FILM WITH VAPOR IMPERMEABLE COATING | OPTICAL COATING LABORATORY, INC. (US) | 1988-01-20 | — | — | EP | claimed |