Hydrochloric Acid

Hydrochloric Acid

SCHEMBL647056

C[Si](C)(C)CC1=C([Zr+2]C2=C(C[Si](C)(C)C)C=CC2)CC=C1.[Cl-].[Cl-]

nearest known ligand 0.00

Full drug profile on Sugi Atlas →

Known targets — ChEMBL curated mechanism

ACHEBDKRB2CHRM1CHRM2CHRM3CHRNA1CHRNB1CHRNDCHRNECHRNGGUCY1A1GUCY1A2GUCY1B1GUCY1B2NAMPTPTAFRSLC10A2SLC6A2SLC6A3TACR1dacAdacBdacCftsImrcAmrcBmrdA

The experimentally established mechanism targets of Hydrochloric Acid. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 92 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-111073729-B Automatic transmission oil composition 现代自动车株式会社 2022-08-12 CN claimed
US-10793804-B2 Automatic transmission oil composition HYUNDAI MOTOR COMPANY (KR) 2020-10-06 US claimed
CN-111073729-A Automatic transmission oil composition 现代自动车株式会社 2020-04-28 CN claimed
US-20200123465-A1 AUTOMATIC TRANSMISSION OIL COMPOSITION HYUNDAI MOTOR COMPANY (KR) 2020-04-23 US claimed
US-20240417604-A1 CURABLE RESIN TOYOBO CO., LTD. (JP) 2024-12-19 US disclosed
US-20240400790-A1 CURABLE RESIN COMPOSITION AND HOT MELT ADHESIVE TOYOBO CO., LTD. (JP) 2024-12-05 US disclosed
EP-4431534-A1 CURABLE RESIN COMPOSITION TOYOBO CO., LTD. (JP) 2024-09-18 EP disclosed
EP-4431565-A1 CURABLE RESIN COMPOSITION TOYOBO CO., LTD. (JP) 2024-09-18 EP disclosed
EP-4421098-A1 CURABLE RESIN Toyobo Co., Ltd. (JP) 2024-08-28 EP disclosed
EP-4410901-A1 CURABLE RESIN COMPOSITION AND HOT MELT ADHESIVE Toyobo Co., Ltd. (JP) 2024-08-07 EP disclosed
CN-118119647-A Curable resin 东洋纺株式会社 2024-05-31 CN disclosed
CN-118043406-A Curable resin composition and hot melt adhesive 东洋纺株式会社 2024-05-14 CN disclosed
WO-2002000436-A2 METALLOCENE-PRODUCED VERY LOW DENSITY POLYETHYLENE AND LOW DENSITY POLYETHYLENE BLENDS EXXONMOBIL CHEMICAL PATENTS INC. (US) 2002-01-03 WO disclosed
WO-2001098409-A1 VERY LOW DENSITY POLYETHYLENE AND HIGH DENSITY POLYETHYLENE BLENDS EXXONMOBIL CHEMICAL PATENTS INC. (US) 2001-12-27 WO disclosed
WO-2001098406-A2 POLYETHYLENE BLENDS EXXONMOBIL CHEMICAL PATENTS INC. (US) 2001-12-27 WO disclosed
WO-2001098372-A2 METALLOCENE-PRODUCED VERY LOW DENSITY POLYETHYLENES EXXONMOBIL CHEMICAL PATENTS, INC. (US) 2001-12-27 WO disclosed
EP-1042377-A1 SLURRY POLYMERIZATION PROCESS WITH ALKYL-SUBSTITUTED BISCYCLOPENTADIENYL METALLOCENES Univation Technologies LLC (US) 2000-10-11 EP disclosed
EP-1042377-A1 SLURRY POLYMERIZATION PROCESS WITH ALKYL-SUBSTITUTED BISCYCLOPENTADIENYL METALLOCENES Univation Technologies LLC (US) 2000-10-11 EP disclosed
WO-1999032531-A1 SLURRY POLYMERIZATION PROCESS WITH ALKYL-SUBSTITUTED BISCYCLOPENTADIENYL METALLOCENES UNIVATION TECHNOLOGIES LLC (US) 1999-07-01 WO disclosed
WO-1999032531-A1 SLURRY POLYMERIZATION PROCESS WITH ALKYL-SUBSTITUTED BISCYCLOPENTADIENYL METALLOCENES UNIVATION TECHNOLOGIES LLC (US) 1999-07-01 WO disclosed