SCHEMBL647513

SCHEMBL647513

CCO[Si](C)(C)[Si](C)(C)OCC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3408625 0.87
SCHEMBL1960995 0.85
SCHEMBL647684 0.82
SCHEMBL248851 0.82
SCHEMBL10626349 0.80
SCHEMBL27602505 0.79
SCHEMBL27999190 0.79
SCHEMBL31656724 0.77
SCHEMBL9123116 0.75
SCHEMBL27813 0.75

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 280 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113020589-A Stable metal lithium powder and preparation method and application thereof 昆山宝创新能源科技有限公司 2021-06-25 CN claimed
CN-102911199-B The method of purification of diethoxy tetramethyl-disilane and application SHANGHAI ADVANCED RESEARCH INSTITUTE CHINESE ACADEMY OF SCIENCES (CN) 2016-01-20 CN claimed
US-9216952-B2 Process for preparing antiviral compound ABBVIE INC. (US) 2015-12-22 US claimed
EP-2411372-B1 PROCESS FOR PREPARING AN ANTIVIRAL COMPOUND ABBVIE BAHAMAS LTD (BS) 2014-07-23 EP claimed
CN-102911199-A Purification method and application of dioxethyl-tetramethyl-disilane SHANGHAI CAS ADVANCED RES INST 2013-02-06 CN claimed
US-20110237793-A1 PROCESS FOR PREPARING ANTIVIRAL COMPOUND ABBOTT LABORATORIES (US) 2011-09-29 US claimed
US-7932295-B2 Organic silica-based film, method of forming the same, composition for forming insulating film for semiconductor device, interconnect structure, and semiconductor device JSR CORPORATION (JP) 2011-04-26 US claimed
US-7875317-B2 formed by hydrolyzing and condensing a siloxy compound in the presence of a polycarbosilane; low relative dielectric constant and excellent mechanical strength, storage stability, and chemical resistance; semiconductors JSR CORPORATION (JP) 2011-01-25 US claimed
US-20080246153-A1 ORGANIC SILICA-BASED FILM, METHOD OF FORMING THE SAME, COMPOSITION FOR FORMING INSULATING FILM FOR SEMICONDUCTOR DEVICE, INTERCONNECT STRUCTURE, AND SEMICONDUCTOR DEVICE JSR CORPORATION (JP) 2008-10-09 US claimed
US-7399715-B2 Organic silica-based film, method of forming the same, composition for forming insulating film for semiconductor device, interconnect structure, and semiconductor device JSR CORPORATION (JP) 2008-07-15 US claimed
JP-5059183-A None JP disclosed
US-12346026-B2 Composition for forming underlayer film, resist pattern forming method, and manufacturing method of electronic device FUJIFILM CORPORATION (JP) 2025-07-01 US disclosed
WO-2024053557-A1 NON-AQUEOUS ELECTROLYTIC SOLUTION AND BATTERY 株式会社日本触媒 2024-03-14 WO disclosed
US-20220252985-A1 COMPOSITION FOR FORMING UNDERLAYER FILM, RESIST PATTERN FORMING METHOD, AND MANUFACTURING METHOD OF ELECTRONIC DEVICE FUJIFILM CORPORATION (JP) 2022-08-11 US disclosed
EP-3286250-B1 COMPOSITION FOR FORMING COATING FILM AND METHOD FOR FORMING COATING FILM USING SAME MERCK PATENT GMBH (DE) 2022-06-15 EP disclosed
EP-0641820-A1 Process for the preparation of organosilicon polymer TOSHIBA SILICONE CO., LTD. (JP) 1995-03-08 EP disclosed
JP-H0559183-A METHYLPOLYSILANE HAVING CONTROLLABLE RHEOLOGY AND ITS PRODUCTION DOW CORNING CORP 1993-03-09 JP disclosed
US-5023307-A Methylpolysilanes having controllable rheology and method for their preparation DOW CORNING CORPORATION (US) 1991-06-11 US disclosed
US-4135045-A PROCESS FOR POLYMERIZATION OF OLEFINS AND CATALYST COMPOSITION THEREFOR MITSUI PETROCHEMICAL INDUSTRIES, LTD. (JP) 1979-01-16 US disclosed
US-4048415-A TITANIUM-ALUMINUM COORDINATION CATALYSTS MITSUI PETROCHEMICAL INDUSTRIES LTD. (JA) 1977-09-13 US disclosed