⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL648046 | 0.82 | — | — | |
| SCHEMBL647513 | 0.82 | — | — | |
| SCHEMBL249241 | 0.79 | — | — | |
| SCHEMBL1960995 | 0.76 | — | — | |
| SCHEMBL648680 | 0.73 | — | — | |
| SCHEMBL248851 | 0.73 | — | — | |
| SCHEMBL26667621 | 0.71 | — | — | |
| SCHEMBL3408625 | 0.71 | — | — | |
| SCHEMBL27999190 | 0.71 | — | — | |
| SCHEMBL27602505 | 0.71 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 219 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| JP-7048515-A | — | — | None | — | — | JP | disclosed |
| US-12346026-B2 | Composition for forming underlayer film, resist pattern forming method, and manufacturing method of electronic device | FUJIFILM CORPORATION (JP) | 2025-07-01 | — | — | US | disclosed |
| WO-2024053557-A1 | NON-AQUEOUS ELECTROLYTIC SOLUTION AND BATTERY | 株式会社日本触媒 | 2024-03-14 | — | — | WO | disclosed |
| US-20220252985-A1 | COMPOSITION FOR FORMING UNDERLAYER FILM, RESIST PATTERN FORMING METHOD, AND MANUFACTURING METHOD OF ELECTRONIC DEVICE | FUJIFILM CORPORATION (JP) | 2022-08-11 | — | — | US | disclosed |
| WO-2021106537-A1 | RESIST UNDERLAYER FILM-FORMING COMPOSITION, PATTERN FORMING METHOD, AND ELECTRONIC DEVICE MANUFACTURING METHOD | 富士フイルム株式会社 | 2021-06-03 | — | — | WO | disclosed |
| CN-107207870-B | Curable composition and cured product thereof | 株式会社钟化 | 2020-06-23 | — | — | CN | disclosed |
| EP-3246364-B1 | CURABLE COMPOSITION AND CURED ARTICLE OBTAINED THEREFROM | KANEKA CORP (JP) | 2020-03-04 | — | — | EP | disclosed |
| US-10287399-B2 | Curable composition and cured article obtained therefrom | KANEKA CORPORATION (JP) | 2019-05-14 | — | — | US | disclosed |
| EP-1520891-B1 | FILM FORMING COMPOSITION, PROCESS FOR PRODUCING FILM FORMING COMPOSITION, INSULATING FILM FORMING MATERIAL, PROCESS FOR FORMING FILM, AND SILICA-BASED FILM | JSR CORP (JP) | 2019-05-01 | — | — | EP | disclosed |
| US-10234762-B2 | Pattern-forming method | JSR CORPORATION (JP) | 2019-03-19 | — | — | US | disclosed |
| EP-0669363-A2 | Process for preparing polyorganosilane | TOSHIBA SILICONE CO., LTD. (JP) | 1995-08-30 | — | — | EP | disclosed |
| EP-0641820-A1 | Process for the preparation of organosilicon polymer | TOSHIBA SILICONE CO., LTD. (JP) | 1995-03-08 | — | — | EP | disclosed |
| JP-H0748515-A | CURABLE POLYSILANE COMPOSITION | TOSHIBA SILICONE CO LTD | 1995-02-21 | — | — | JP | disclosed |
| EP-0336404-B1 | Process for preparing of organopolysilanes | WACKER CHEMIE GMBH (DE) | 1994-08-03 | — | — | EP | disclosed |
| US-5250646-A | Reacting disilane with organometallic compound | WACKER-CHEMIE GMBH (DE) | 1993-10-05 | — | — | US | disclosed |
| US-5166287-A | Reaction of a disilane to form polysiloxanes | WACKER-CHEMIE GMBH (DE) | 1992-11-24 | — | — | US | disclosed |
| EP-0486946-A2 | Process for the production of metallopolysilanes and their use | Wacker-Chemie GmbH (DE) | 1992-05-27 | — | — | EP | disclosed |
| EP-0463624-A2 | Process for preparing organopolysilanes | WACKER-CHEMIE GMBH (DE) | 1992-01-02 | — | — | EP | disclosed |
| US-4952658-A | REACTING ORGANOSILICON COMPOUND WITH BORIC ACID | WACKER-CHEMIE GMBH (DE) | 1990-08-28 | — | — | US | disclosed |
| EP-0336404-A2 | Process for preparing of organopolysilanes | WACKER-CHEMIE GMBH (DE) | 1989-10-11 | — | — | EP | disclosed |