SCHEMBL6476321

SCHEMBL6476321

Cc1nnnn1C.Cn1nnnc1S

nearest known ligand 0.34

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 2/20 0.34
SMN1; SMN2 Q16637 1/20 0.34
MAPK1 P28482 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL94304 0.88
SCHEMBL15404204 0.85
SCHEMBL1393843 0.85
SCHEMBL9894230 0.85
SCHEMBL8207759 0.85
Water SCHEMBL9616800 0.85
SCHEMBL75716 0.85
SCHEMBL10874941 0.76 SMN1; SMN2 (0.41) ALDH1A1SMN1; SMN2MAPK1
SCHEMBL15365430 0.70 ALDH1A1 (0.31) ALDH1A1
SCHEMBL15404045 0.67

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6946027-B2 Composition and method for preparing chemically-resistant roughened copper surfaces for bonding to substrates ELECTROCHEMICALS, INC. (US) 2005-09-20 US disclosed
US-20040159264-A1 Composition and method for preparing chemically-resistant roughened copper surfaces for bonding to substrates MACDERMID, INCORPORATED 2004-08-19 US disclosed