Butane

Butane

SCHEMBL6479816

C=CC(=O)OCCOCCO.CCCC

nearest known ligand 0.70

Full drug profile on Sugi Atlas →

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
TSHR P16473 9/20 0.70
ALDH1A1 P00352 4/20 0.70
TP53 P04637 3/20 0.70
HIF1A Q16665 3/20 0.70
HSD17B10 Q99714 1/20 0.70
HPGD P15428 1/20 0.58
THRB P10828 4/20 0.57
CYP3A4 P08684 2/20 0.48
MEN1 O00255 2/20 0.42
KMT2A Q03164 2/20 0.42
HTT P42858 1/20 0.42
MAPT P10636 1/20 0.42
MAPK1 P28482 2/20 0.40
SMN1; SMN2 Q16637 1/20 0.40
ATM Q13315 1/20 0.38
EPHX2 P34913 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1537388 0.92 TSHR (0.83) TSHRALDH1A1TP53HIF1AHSD17B10
SCHEMBL130139 0.92 TSHR (0.83) TSHRALDH1A1TP53HIF1AHSD17B10
SCHEMBL1537467 0.92 TSHR (0.83) TSHRALDH1A1TP53HIF1AHSD17B10
SCHEMBL1537378 0.92 TSHR (0.83) TSHRALDH1A1TP53HIF1AHSD17B10
SCHEMBL139735 0.92 TSHR (0.83) TSHRALDH1A1TP53HIF1AHSD17B10
SCHEMBL259313 0.92 TSHR (0.83) TSHRALDH1A1TP53HIF1AHSD17B10
SCHEMBL10530471 0.92 TSHR (0.83) TSHRALDH1A1TP53HIF1AHSD17B10
SCHEMBL10533428 0.92 TSHR (0.83) TSHRALDH1A1TP53HIF1AHSD17B10
SCHEMBL8852469 0.92 TSHR (0.83) TSHRALDH1A1TP53HIF1AHSD17B10
SCHEMBL1537403 0.92 TSHR (0.83) TSHRALDH1A1TP53HIF1AHSD17B10

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0805614-B1 MULTILAYERED WIRING BOARD, PREFABRICATED MATERIAL FOR MULTILAYERED WIRING BOARD, PROCESS OF MANUFACTURING MULTILAYERED WIRING BOARD, ELECTRONIC PARTS PACKAGE, AND METHOD FOR FORMING CONDUCTIVE PILLAR TOSHIBA KK (JP) 2005-04-13 EP disclosed
US-6237218-B1 Method and apparatus for manufacturing multilayered wiring board and multi-layered wiring board KABUSHIKI KAISHA TOSHIBA (JP) 2001-05-29 US disclosed
US-6010769-A Multilayer wiring board and method for forming the same KABUSHIKI KAISHA TOSHIBA (JP) 2000-01-04 US disclosed
EP-0805614-A1 MULTILAYERED WIRING BOARD, PREFABRICATED MATERIAL FOR MULTILAYERED WIRING BOARD, PROCESS OF MANUFACTURING MULTILAYERED WIRING BOARD, ELECTRONIC PARTS PACKAGE, AND METHOD FOR FORMING CONDUCTIVE PILLAR KABUSHIKI KAISHA TOSHIBA (JP) 1997-11-05 EP disclosed