Predicted protein targets (top 7)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | AGXT | P21549 | 5/20 | 0.39 |
| ▸ | ESR1 | P03372 | 2/20 | 0.39 |
| ▸ | APP | P05067 | 1/20 | 0.36 |
| ▸ | IDO1 | P14902 | 7/20 | 0.36 |
| ▸ | TRPV1 | Q8NER1 | 1/20 | 0.35 |
| ▸ | ESR2 | Q92731 | 1/20 | 0.34 |
| ▸ | TSHR | P16473 | 1/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL19638101 | 0.92 | AGXT (0.41) | AGXTESR1IDO1 | |
| SCHEMBL2452819 | 0.90 | ESR1 (0.54) | ESR1IDO1ESR2TSHR | |
| SCHEMBL7935343 | 0.90 | AGXT (0.54) | AGXTIDO1TSHR | |
| SCHEMBL8103605 | 0.88 | IDO1 (0.52) | AGXTAPPIDO1 | |
| SCHEMBL1691492 | 0.88 | APP (0.52) | ESR1APPESR2TSHR | |
| SCHEMBL8481932 | 0.88 | CA1 (0.34) | AGXTESR1APPIDO1TRPV1 | |
| SCHEMBL19354411 | 0.88 | APP (0.35) | AGXTESR1APPIDO1TRPV1 | |
| SCHEMBL18773888 | 0.88 | AGXT (0.32) | AGXTESR1APPIDO1TRPV1 | |
| SCHEMBL22385098 | 0.88 | AGXT (0.32) | AGXTESR1APPIDO1TRPV1 | |
| SCHEMBL11957478 | 0.88 | IDO1 (0.52) | APPIDO1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 35 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-118053799-A | Method for manufacturing semiconductor device | 株式会社力森诺科 | 2024-05-17 | — | — | CN | disclosed |
| CN-117157733-A | Method for manufacturing semiconductor device and dicing die-bonding integrated film | 株式会社力森诺科 | 2023-12-01 | — | — | CN | disclosed |
| CN-110945634-B | Heat-dissipating die bonding film and dicing die bonding film | 株式会社力森诺科 | 2023-08-29 | — | — | CN | disclosed |
| WO-2022255322-A1 | METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND DICING-DIE BONDING INTEGRATED FILM | 昭和電工マテリアルズ株式会社 | 2022-12-08 | — | — | WO | disclosed |
| WO-2022255321-A1 | INTEGRATED DICING/DIE BONDING FILM AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | 昭和電工マテリアルズ株式会社 | 2022-12-08 | — | — | WO | disclosed |
| US-20220216114-A1 | METHOD FOR EVALUATING PICKUP PERFORMANCE, INTEGRATED DICING/DIE-BONDING FILM, METHOD FOR EVALUATING AND SELECTING INTEGRATED DICING/DIE-BONDING FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | RESONAC CORPORATION (JP) | 2022-07-07 | — | — | US | disclosed |
| CN-114641848-A | Dicing die-bonding integrated film, method for manufacturing the same, and method for manufacturing semiconductor device | 昭和电工材料株式会社 | 2022-06-17 | — | — | CN | disclosed |
| CN-114641849-A | Dicing die-bonding integrated film, method for manufacturing the same, and method for manufacturing semiconductor device | 昭和电工材料株式会社 | 2022-06-17 | — | — | CN | disclosed |
| US-9688810-B2 | Resin, resin composition and method for producing the same, and toner using this resin composition | FUJIFILM CORPORATION (JP) | 2017-06-27 | — | — | US | disclosed |
| US-20150306077-A1 | Novel Compositions and Methods for Treating Cancer | BOARD OF REGENTS, THE UNIVERSITY OF TEXAS SYSTEM | 2015-10-29 | — | — | US | disclosed |
| US-7517724-B2 | Dicing/die bonding sheet | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2009-04-14 | — | — | US | disclosed |
| US-20080044667-A1 | Modified Phenolic Resin, Epoxy Resin Composition Containing the Same, and Prepreg Containing the Composition | MITSUI CHEMICALS, INC. (JP) | 2008-02-21 | — | — | US | disclosed |
| US-20070036971-A1 | Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device | INADA TEIICHI | 2007-02-15 | — | — | US | disclosed |
| US-20070026572-A1 | Dicing/die bonding sheet | RESONAC CORPORATION (JP) | 2007-02-01 | — | — | US | disclosed |
| US-20060106166-A1 | Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device | INADA TEIICHI | 2006-05-18 | — | — | US | disclosed |
| US-20060100315-A1 | Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device | INADA TEIICHI | 2006-05-11 | — | — | US | disclosed |
| US-20030069331-A1 | An adhesive formulation containing an epoxy resin, a phenolic curing agent and a acrylic copolymer incompatible with epoxy resin | HITACHI CHEMICAL CO., LTD. (JP) | 2003-04-10 | — | — | US | disclosed |
| US-6297332-B1 | FOR SEALING A SEMICONDUCTOR INTEGRATED CIRCUIT, AMINOPHOSPHINE OXIDE AS IMPROVED ACCELERATING AGENT, PACKAGE BETTER IN CRACK RESISTANCE | MITSUI CHEMICALS, INC. (JP) | 2001-10-02 | — | — | US | disclosed |
| EP-0953588-A2 | An epoxy-resin composition and use thereof | Mitsui Chemicals, Inc. (JP) | 1999-11-03 | — | — | EP | disclosed |
| US-4588482-A | Preparation of phthalaldehyde acetals | BASF AKTIENGESELLSCHAFT (DE) | 1986-05-13 | — | — | US | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-20150306077-A1 | Novel Compositions and Methods for Treating Cancer | HDGF, HCCS, CCNC | AGXT 4178/4885ESR1 2114/4885APP 612/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.