Predicted protein targets (top 9)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | PLA2G4B | P0C869 | 1/20 | 0.45 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.44 |
| ▸ | L3MBTL1 | Q9Y468 | 2/20 | 0.44 |
| ▸ | NAAA | Q02083 | 1/20 | 0.43 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.42 |
| ▸ | HPGD | P15428 | 1/20 | 0.42 |
| ▸ | TSHR | P16473 | 3/20 | 0.40 |
| ▸ | CYP3A4 | P08684 | 2/20 | 0.40 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.40 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL10591328 | 0.89 | IDO1 (0.55) | PLA2G4BALDH1A1 | |
| SCHEMBL2261630 | 0.87 | PLA2G4B (0.40) | PLA2G4BTDP1L3MBTL1NAAAALDH1A1 | |
| SCHEMBL8880826 | 0.87 | CYP3A4 (0.53) | CYP3A4 | |
| SCHEMBL1310466 | 0.87 | TSHR (0.42) | PLA2G4BNAAATSHR | |
| SCHEMBL6707479 | 0.87 | TSHR (0.43) | TDP1L3MBTL1ALDH1A1HPGDTSHR | |
| SCHEMBL4734636 | 0.86 | IDO1 (0.57) | TDP1L3MBTL1ALDH1A1 | |
| SCHEMBL317686 | 0.85 | TSHR (0.58) | TDP1L3MBTL1NAAAALDH1A1HPGD | |
| SCHEMBL9479894 | 0.84 | PLA2G4B (0.47) | PLA2G4BTDP1L3MBTL1TSHR | |
| SCHEMBL9468805 | 0.84 | PLA2G4B (0.44) | PLA2G4BTDP1L3MBTL1TSHR | |
| SCHEMBL27666511 | 0.83 | IDO1 (0.53) | PLA2G4B |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 37 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2022255321-A1 | INTEGRATED DICING/DIE BONDING FILM AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | 昭和電工マテリアルズ株式会社 | 2022-12-08 | — | — | WO | disclosed |
| WO-2022255322-A1 | METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND DICING-DIE BONDING INTEGRATED FILM | 昭和電工マテリアルズ株式会社 | 2022-12-08 | — | — | WO | disclosed |
| US-20220216114-A1 | METHOD FOR EVALUATING PICKUP PERFORMANCE, INTEGRATED DICING/DIE-BONDING FILM, METHOD FOR EVALUATING AND SELECTING INTEGRATED DICING/DIE-BONDING FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | RESONAC CORPORATION (JP) | 2022-07-07 | — | — | US | disclosed |
| US-20140332984-A1 | ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM USING THE SAME, SUBSTRATE FOR MOUNTING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE | HITACHI CHEMICAL CO LTD (JP) | 2014-11-13 | — | — | US | disclosed |
| US-8200059-B2 | Adhesive composition for optical waveguide, adhesive film for optical waveguide and adhesive sheet for optical waveguide each using the same, and optical device using any of them | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2012-06-12 | — | — | US | disclosed |
| US-20120080808-A1 | ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM USING THE SAME, SUBSTRATE FOR MOUNTING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE | INADA TEIICHI (JP) | 2012-04-05 | — | — | US | disclosed |
| US-8119737-B2 | Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2012-02-21 | — | — | US | disclosed |
| US-8053378-B2 | Modified phenolic resin, epoxy resin composition containing the same, and prepreg containing the composition | MITSUI CHEMICALS, INC. (JP) | 2011-11-08 | — | — | US | disclosed |
| US-20110187006-A1 | ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM USING THE SAME, SUBSTRATE FOR MOUNTING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE | INADA TEIICHI | 2011-08-04 | — | — | US | disclosed |
| US-7947779-B2 | Semiconductor device by adhering circuit substrate with adhesive film of epoxy resin, phenolic resin and incompatible polymer | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2011-05-24 | — | — | US | disclosed |
| EP-0342943-B1 | THERMOSETTING RESIN COMPOSITION | MITSUI TOATSU CHEMICALS, Inc. (JP) | 1993-08-04 | — | — | EP | disclosed |
| US-5145949-A | Production process for making aromatic amine resins | MITSUI TOATSU CHEMICALS, INC. (JP) | 1992-09-08 | — | — | US | disclosed |
| US-5106953-A | Reacting aromatic amines with bishalogenomethyl derivatives; curing agents or raw materials for polyamides | MITSUI TOATSU CHEMICALS, INC. (JP) | 1992-04-21 | — | — | US | disclosed |
| EP-0233450-B1 | LINEAR SALICYLIC ACID COPOLYMERS AND THEIR METAL SALTS, PRODUCTION PROCESS THEREOF, COLOR-DEVELOPING AGENTS COMPRISING METAL-RESINS OF THE COPOLYMERS, AND COLOR-DEVELOPING SHEETS EMPLOYING THE AGENTS | MITSUI TOATSU CHEMICALS, Inc. (JP) | 1992-03-11 | — | — | EP | disclosed |
| US-5051494-A | A bismaleimide and an amino resin | MITSUI TOATSU CHEMICALS, INC. (JP) | 1991-09-24 | — | — | US | disclosed |
| US-4959443-A | HIGH STRENGTH, REACTION OF ARALKYL ALCOHOL AND AROMATIC AMINE | MITSUI TOATSU CHEMICALS, INC. (JP) | 1990-09-25 | — | — | US | disclosed |
| US-4937318-A | Aromatic amine resins | MITSUI TOATSU CHEMICALS, INC. (JP) | 1990-06-26 | — | — | US | disclosed |
| EP-0311387-A2 | Aromatic amine resins, their production process and thermosetting resin compositions making use of the same | MITSUI TOATSU CHEMICALS, Inc. (JP) | 1989-04-12 | — | — | EP | disclosed |
| US-4783521-A | Linear salicylic acid copolymers and their metal salts, production process thereof, color-developing agents comprising metal-resins of the copolymers | MITSUI TOATSU CHEMICALS, INCORPORATED (JP) | 1988-11-08 | — | — | US | disclosed |
| EP-0233450-A2 | Linear salicylic acid copolymers and their metal salts, production process thereof, color-developing agents comprising metal-resins of the copolymers, and color-developing sheets employing the agents | MITSUI TOATSU CHEMICALS, Inc. (JP) | 1987-08-26 | — | — | EP | disclosed |